KR960021558A - 비접촉 ic 카드, 그의 제조방법 및 그 제조장치 - Google Patents

비접촉 ic 카드, 그의 제조방법 및 그 제조장치 Download PDF

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KR960021558A
KR960021558A KR1019950058782A KR19950058782A KR960021558A KR 960021558 A KR960021558 A KR 960021558A KR 1019950058782 A KR1019950058782 A KR 1019950058782A KR 19950058782 A KR19950058782 A KR 19950058782A KR 960021558 A KR960021558 A KR 960021558A
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circuit pattern
card
electronic component
sheet
contactless
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KR1019950058782A
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KR0169554B1 (ko
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겐이찌 다까히라
쥰 오오부찌
야스히로 무라사와
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기다오까 다까시
미쓰비시 뎅끼 가부시끼가이샤
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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

본 밭명은 낮은 제조비용으로 얇은 두께를 지니도록 제조될 수 있으며, 제조공정에 있어서 자동화와 인건비 절감을 이를 수 있는 비접촉 IC 카드와 그의 제조방법 및 제조장치에 관한 것이다. 전자부품(4)은 IC 카드(100)의 외장을 한정하기 위한 일 표면을 지닌 수지로 이루어진 시트(1)의 타 표면 상에 제공된 회로패턴(3)을 포함하는 회로패턴장치 상에 실장된다. 가소성재료(5)는 회로패턴(3) 상에 위치하며, 전자부품(4)은 시트(1)의 타 표면상에 위치한다. 이것은 통합된 판상 몸체를 형상하도록 프레스에 의해 가소적으로 변형되고, 카드의 형태로 절단됨으로써, 얇은 두께를 지닌 비접촉 IC 카드가 얻어지게 된다.

Description

비접촉 IC 카드, 그의 제조방법 및 그 제조장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 IC 카드의 단면도이다,
제2도는 회로패턴장치 형성장치를 포함하는 장치도이다.
제3도는 회로패턴 상에 인쇄된 시트의 정면도이다,
제4도는 칩 실장기률 포함하는 전자부품 실장장치를 나타낸다,
제5도는 가열기와 프레스를 포함하는 가소성재료 압축장치를 나타낸다.
제6도는 회로검사기를 포함하는 검사장치와 절단기를 포함하는 절단장치를 나타낸다.
제7도는 걸단단계에서 하단으로부터 개시되는 절단기에 의한 절단상태를 나타낸다.
제8도는 절단단계에서 상단으로부터 개시되는 절단기에 의한 절단상태를 나타낸다.
제10도는 본 발명에 따른 비접촉 IC 카드 제조장치의 다른 실시예의 의한 회로패턴장치 형성장치를 나타낸다.
제11도는 본 발명에 따른 비접촉 IC 카드 제조장치의 또 다른 실시예에 의한 회로패턴 형성단계 이후에 경화건조로를 생략한 장치를 나타낸다.
제12도는 본 발명에 따른 비접촉 IC 카드 제조장치의 또 다른 실시예인 중간층을 사용하여 비접촉 IC 카드를 제조하는 방법을 나타낸다.

Claims (21)

  1. IC 카드의 외장을 한정하기 위한 일 표면을 지닌 수지로 이루어진 시트와, 상기한 시트의 타 표면 상에 제공된 도전성 회로패턴을 포함하는 회로 패턴장치와, 상기한 회로패턴장치 상에 실장된 전자부품과, 상기한 시트의 타 표면 상에 제공되며 상기한 회로패턴장치와 상기한 전자부품을 완전히 매립하도록 가소적으로 변형된 전기적 절연성 가소성재료를 포함하는 비접촉 IC 카드,
  2. IC 카트외 외장을 한정하기 위한 일 표면을 지닌 수지로 이루어진 시트와, 상기한 시트의 타 표면 상에 제공된 도전성 회로패턴을 포함하는 회로 패턴장치와, 상기한 회로패턴장치 상에 실장된 전자부품과, 상기한 회로패턴장치 상에 고착되며 상기한 전자부품을 수용하기 위한개구를 지닌 수지로 이루어진 중간충과, 상기한 중간층 및 상기한 회로부품 사이의 간극을 충전하기 위한 전기적 절연성 충전수지재료를 포함하는 비접촉 IC 카드.
  3. 제1항에 있어선, 상기한 IC 카드의 상기한 시트의 반대 표면 상에 수지로 이루어진 외장시키를 추가로 포함하는 것을 특징으로 하는 비접촉 IC 카드.
  4. 제1항에 있어서, 상기한 전자부품은 도전성 접착제에 의해 상기한 회로패턴장치 상에 실장되는 것을 특징으로 하는 비접촉 IC 카드.
  5. 제1항에 있어서, 인쇄에 의해 형성된 상기한 회로패턴장치의 상기한 회로패턴이 경화되기 이전에, 상기한 전자부품은 압착접합에 의해 상기한 회로패턴장치 상에 실장되는 것을 특징으로 하는 비접촉 IC 카드.
  6. 제1항에 있어서, 상기한 비접추 IC 카드의 적어도 두 면은 절단날에 의해 절단되어 형성되는 것을 특징으로 하는 비접촉 IC 카드.
  7. 제1항에 있어서, 상기한 회로패턴장치는, 서로 적층되어 배치된 복수개의 전기적 절연성 시트와, 상기한 복수개의 시트 상에 각각 형성된 회로패턴과, 상기한 각각의 회로패턴을 상호 전기적으로 접속하기 위한 접속 수단을 포함하는 것을 특징으로 하는 비접촉 IC 카드.
  8. 제1항에 있어서, 상기한 회로패턴장치는, 적어도 하나의 전기적 절연성 시트와, 상기한 시트의 양면 상에 형성된 회로패턴과, 양 표면상에 형성된 상기 회로패턴을 상호 전기적으로 접속하기 위한 접속수단을 포함하는 것을 특징으로 하는 비접촉 IC 카드.
  9. 완성되었을 때 IC 카드의 외장을 한정하는 일 표면을 지닌 수지로 이루어진 시트의 타 표면상에 도전성 회로패턴을 포함하는 회로패턴장치를 형성하는 단계와, 상기한 회로패턴장치 상에 전자부품을 실장하는 단계와, 상기한 회로패턴장치와 상기한 전자부품을 완전히 매립하기 위해 가소성재료를 가소직으로 변형시킴으로써 통합된 판상 몸체를 형성하도록, 상기한 회로패턴장치와 상기한 전자부품 상에 위치한 전기적 절연성 가소성재료를 상기한 시트 상에 압착하는 단계와, IC 카드를 형성하기 위해 상기한 시트와 상기한 가소성재료를 지닌 판상 몸체를 절단하는 단계를 포함하는 비접촉 IC 카드의 제조방법,
  10. 완성되었을 때 IC 카드의 외장을 한정하는 일 표면을 지닌 수지로 이루어진 시트외 타 표면 상에 도전성 회로패턴을 포함하는 회로패턴장치를 형성하는 단계와, 상기한 회로패턴장치 상에 전자부품을 실장하는 단계와, 상기한 전자부품을 상기한 회로패턴장치 상에 수용하기 위한 개구를 지닌 수지로 이루어진 중간층을 고각하는 단계와, 통할된 판상 몸체를 형성하기 위헤 충진수지재료를 사용하여 상기한 중간층과 상기한 전자부품 사이의 간극을 충전시키는 단계와, IC카드를 형성하기 위해 상기한 시트와 상기한 중간층을 지닌 판상 몸체를 절단하는 단계를 포함하는 비접 IC 카드의 제조방법.
  11. 제9항에 있어서, 상기한 회로패턴장치 형성단계는, 회로패턴이 각각 형성된 복수개의 시트를 교대로 적층하는 단계와, 각각회 회로패턴을 상호 전기적으로 접속하는 단계를 포함하는 것을 특징으로 하는 비접촉 IC 카드의 제조방법.
  12. 제9항에 있어서, 상기한 회로패턴장치 형성단계는, 하나의 시트의 양 표면 상에 회로패턴을 형성하는 단계와, 상기한 양 표면 상에 형성된 회로패턴을 상호 전기적으로 접속하는 단계를 포함하는 것을 특징으로 하는 비접촉 IC 카드의 제조방법.
  13. 제9항에 있어서, 상기한 절단단계 이전에 상기한 IC 카드의 상기한 시트의 반대 표면 상에 수지로 이루어진 외장시트를 접합하는 단계를 추가로 포함하는 것을 특징으로 하는 비접촉 IC 카드의 제조방법,
  14. 제9항에 있어서, 상기한 회로패턴장치 형성단계는 인쇄에 의해 수행되는 회로패턴 형성단계를 포함하는 것을 특징으로 하는 비접촉 IC 카드의 제조방법.
  15. 제9항에 있어서, 상기한 회로패턴장치 형성단계는 전이에 의해 수행되는 회로패턴 형성단계를 포함하는 것을 특징으로 하는 비접촉 IC 카드의 제조방법.
  16. 제9항에 있어서, 상기한 전자부품 실장단계는 도전성 접착제를 사용하여 상기한 회로패턴장치 상에 상기 한 전자부품을 실장하는 단계를 포함하는 것을 특징으로 하는 비접촉 IC 카드의 제조방법.
  17. 제9항에 있어서, 상기한 전자부품 실장단계는 회로패턴장치의 경화 이전에 상기한 회로패턴장치에 상기 한 전자부품을 압착접합하는 단계를 포함하는 것을 특징으로 하는 비접촉 IC 카드의 제조방법.
  18. 제9항에 있어서, 상기한 가소성재료 압착단계는 프레스를 사용하여 수행되는 것을 특징으로 하는 비접촉 IC 카드의 제조방법.
  19. 제9항에 있어서, 상기한 회로괘턴장치 형성단계는, 상기한 회로패턴장치 상에 검사단자를 형성하는 단계와, 상기한 절단단계 이전에 회로검사기를 상기한 검사단자에 접속함으로써 회로기능의 검사를 수행하는 단계를 포함하는 것을 특징으로 하는 비접촉 IC 카드의 제조방법.
  20. 완성되었을 때 IC 카드의 외장을 한정하는 일 표면을 지닌 수지로 이루어진 시트의 타 표면 상에 회로패턴장치를 형성하기 위한 회로패턴장치 형성장치와, 상기한 회포패턴장치 상에 전자부품을 실장하기 위한 전자부품 실장장치와, 상기한 회로패턴장치와 상기한 전자부품을 완전히 매립하기 위해 가소성재료를 가소적으로 변형시킴으로써 통합된 판상 몸체를 형성하도록, 상기한 회로패턴장치와 상기한 전자부품 상에 위치한 가소성 재료를 상기한 시트 상에 압착하기 위한 가소성재료 압착장치와, IC카드를 형성하기 위해 상기한 판상 몸체를 절단하기 위한 절단장치를 포함하는 비접촉 IC 카드 제조장치.
  21. 완성되었을 때 IC 카드의 외장을 한정하는 일 표면을 지닌 수지로 이루어진 시트의 타 표면 상에 회로패턴장치를 형성하기 위한 회로패턴장치 형성장치와, 상기한 회로패턴장치 상에 전자부품을 실장하기 위한 전자 부품 실장장치와, 상기한 전자부품을 상기한 회로패턴장치 상에 수용하기 위한 개구를 지닌 수지로 이루어진 중간층을 고착하기 위한 중간층 고착장치와, 통합된 판상 몸체를 형성하기 위해 충전수지재료를 사용하여 상기한 중간층과 상기한 전자부품 사이의 간극을 충전시키기 위한 충전수지재료 충전장치와, IC 카드를 형성하기 위해 상기한 판상 몸체를 절단하기 위한 절단장치를 포함하는 비접촉 IC 카드 제조장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950058782A 1994-12-27 1995-12-27 비접촉 ic카드, 그의 제조방법 및 제조장치 KR0169554B1 (ko)

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CN1131303A (zh) 1996-09-18
EP0720123A3 (en) 2000-03-15
DE69529967D1 (de) 2003-04-24
KR0169554B1 (ko) 1999-01-15
TW358943B (en) 1999-05-21
EP0720123B1 (en) 2003-03-19
EP1136944A1 (en) 2001-09-26
JPH08230367A (ja) 1996-09-10
CN1050681C (zh) 2000-03-22
EP0720123A2 (en) 1996-07-03
DE69529967T2 (de) 2003-11-06

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