KR950701396A - 집적 회로 다이의 땜납 범핑(solder bumping of integrated circuit die) - Google Patents

집적 회로 다이의 땜납 범핑(solder bumping of integrated circuit die)

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Publication number
KR950701396A
KR950701396A KR1019940703890A KR19940703890A KR950701396A KR 950701396 A KR950701396 A KR 950701396A KR 1019940703890 A KR1019940703890 A KR 1019940703890A KR 19940703890 A KR19940703890 A KR 19940703890A KR 950701396 A KR950701396 A KR 950701396A
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South Korea
Prior art keywords
solder
bond pad
integrated circuit
circuit die
terminal
Prior art date
Application number
KR1019940703890A
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English (en)
Inventor
케빈 디. 무어
칼 미셸
Original Assignee
안쏘니 제이. 살리, 주니어.
모토롤라, 인크.
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Application filed by 안쏘니 제이. 살리, 주니어., 모토롤라, 인크. filed Critical 안쏘니 제이. 살리, 주니어.
Publication of KR950701396A publication Critical patent/KR950701396A/ko

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    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H—ELECTRICITY
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

직접회로 다이 상에 땜납 범프를 형성하기 위한 방법은 구리 입자들과 중합체 바인더로 이루어진 전기적으로 도전성이고, 땜납-습윤성인 합성 물질로 형성된 단자(12)를 사용한다. 단자는 다이 상의 표면안정화층(20)위에 있는 본드패드(24) 및 금속 접촉부(16)에 본드 패드를 접속시키는 런너 섹션(26)을 포함한다. 단자를 예를 들면, 스크린 인쇄에 의해 잉크로서 다이에 인가된 후에 범프를 형성하기 위해 땜납 합금의 본체가 본드 패드와 접촉되어 리플로우된다. 단자용의 양호한 물질은 은도금된 구리 입자들 및 레졸형 페놀 바이더로 이루어진다.

Description

집적회로 다이의 땜납 범핑(SOLDER BUMPING OF INTEGRATED CIRCUIT DIE)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따라 형성된 단자를 보여주는 집적회로 다이의 부분 평면도,
제2도는 선2-2를 따라 화살표 방향으로 절취된, 제1도의 다이의 단면도.

Claims (13)

  1. 기판, 기판위에 있는 표면안정화층 및 표면안정화층 내의 개구를 통해 노출되는 급속 접촉부를 포함하는 집적 회로 다이 상에 땜납 범프를 형성하는 방법에 있어서, 상기 금속 접촉부로부터 멀리 떨어져 상기 표면안정화층 위에 있는 본드 패드 및 전기 신호를 도전시키기 위해 본드 패드와 금속 점촉부 사이에 연장되어 있는 런너 섹션을 포함하고, 구리 입자들 및 중합체 바인더로 이루어진 전기적 도전성이고 땜납-습윤성인 합성 물질로 형셩되는 단자를 상기 집적회로 다이 상에 형성하는 단계, 및 본드 패드에 접착된 땝납 범프를 형성하도록 땜납 금속을 리플로우하기 위해 본드 패드와 접촉하여 땜납 물질을 가열 및 냉각하는 단계를 포함하는 것을 특징으로 하는 집적 회로 다이 상에 땜납 범프를 형성하는 방법.
  2. 제1항에 있어서, 상기 구리 입자들이 은 코팅을 포함하는 것을 특징으로 하는 집적회로 다이 상에 땜납 펌프를 형성하는 방법.
  3. 제1항에 있어서, 상기 바인더가 레졸형 페놀계 수지로 이루어지는 것을 특징으로 하는 집적회로 다이상에 땜납 범프를 형성하는 방법.
  4. 기판, 기판위에 놓이고 유전체 중합체 물질로 형성된 표면안정화층 및 표면 안정화층 내의 개구를 통해 노출되는 금속 접촉부를 포함하는 집적회로 다이 상에 땜납 범프를 형성하는 방법에 있어서, 최소한 70중량％의 구리 입자들과 레졸형 페놀계 수지 및 기화가능한 용매를 포함하는 매질을 포함하는 구리 파우더 잉크를, 급속 접촉부로부터 떨어져 표면안정화층 위에 겹쳐져 놓인 본드 패드 및 본드 패드와 금속 접촉부사이에 연장되어 있는 런너를 포함하는 단자에 대응하는 패턴으로 집적 회로 다이 상에 인쇄하는 단계, 상기 인쇄 단계에 후속하여 전기적으로 도전성이고 땜납-습윤성인 단자를 형성하도록 단일 막 내에 구리 입자들을 접착시키기 위해 잉크를 건조시키고 경화시키는 단계, 및 본드 패드에 접착된 땜납 범플을 형성하도록 땜납 금속을 리플로우하기위해 본드 패드와 접촉하여 땜납 합금의 본체를 가열 및 냉각하는 단계를 포함하는 것을 특징으로 하는 집적회로 다이 상에 땜납 범프를 형성하는 방법.
  5. 제4항에 있어서, 상기 구리 입자들이 은 코팅을 포함하는 것을 특징으로 하는직접회로 다이 상에 땜납 범프를 형성하는 방법.
  6. 제4항에 있어서, 본드 패드에 땜납 합금을 포함시키기 위한 범프를 형성하기 전에, 단라 런저 섹션에 땜납 레지스터를 인가하는 단계를 더 포함하는 것을 특징으로 하는 직접 회로 다이 상에 땜납 범프를 형성하는 방법.
  7. 제4항에 있어서, 상기 단자가 직경을 갖는 일반적인 원형 본드 패드 및 본드 패드에 인접한 선형 섹션을 갖고 직경보다 작은 폭을 갖는 런너를 포함하는 것을 특징으로 하는 직접회로 다이 상에 땜납 펌프를 형성하는 방법.
  8. 기판, 기판위에 놓이고 유전체 중합체 물질로 형성된 표면안정화층 및 표면 안정화층 내의 개구를 통해 노출되는 알루미늄 접촉부를 포함하는 집적회로 다이 상에 땜납 범프를 형성하는 방법에 있어서, 최소한 70중량％의 은도금된 구리 입자들과 레졸형 페놀계 수지 및 기화가능한 용매를 포함하는 매질을 포함하는 구리 파우더 잉크를, 알루미늄 금속 접촉부로부터 떨어져 표면안정화층 위에 겹쳐져 놓인 본드 패드 및 본드 패드와 금속 접촉부사이에 연장되어 있는 런너를 포함하는 단자에 대응하는 패턴으로 집적 회로 다이 상에 인쇄하는 단계, 상기 인쇄 단계에 후속하여 전기적으로 도전성이고 땜납-습윤성인 단자를 형성하도록 단일 막 내에 은도금된 구리 입자들을 접착시키기 위해 잉크를 건조시키고 경화시키는 단계, 및 본드 패드에 접착된 땜납 범플을 형성하도록 땜납 금속을 리플로우하기위해 본드 패드와 접촉하여 땜납 합금의 본체를 가열 및 냉각하는 단계를 포함하는 것을 특징으로 하는 집적회로 다이 상에 땜납 범프를 형성하는 방법.
  9. 제8항에 있어서, 본드 패드에 땜납 합금을 포함시키기 위한 펌프를 형성하기 전에, 단자 런너 섹션에 땜납 레지스터를 인가하는 단계를 더 포함하는 것을 특징을 하는 집적회로 다이 상에 땜납 범프를 형성하는 방법.
  10. 제8항에 있어서, 상기 단자가 직경을 갖는 일반적인 원형 본드 패트 및 본드 패드에 인접한 선형 섹션을 갖고 직경보다 작은 폭을 갖는 런너를 포함하는 것을 특지응로 하는 집적회로 다이 상에 땜납 범프를 형성하는 방법.
  11. 제8항에 있어서, 상기 땜납 합금이 주석 및 납을 포함하는 것을 특징으로 하는 집적회로 다이 상에 땜납 범프를 형성하는 방법.
  12. 기판, 기판위에 겹쳐있고, 땜납 금속애 의해 습윤되지 않는 물질로 형서되고 개구부를 한정하는 표면안정화층, 상기 개구를 통해 노출되는 금속 접촉부, 구리입자들 및 중합체 바인더를 포함하는 전기적으로 도전성이고 땜납-습윤성인 물질로 형성되고, 금속 접촉부로부터 떠렁져 상기 표면안정화층 위체 겹쳐 있는 본드 패드 및 본드 패드로부터 연장되고 있고 본드 패드와 금속 접촉부 사이에서 전기 신호들을 도전시키기 위해 금속 접촉부에 접속되어 있는 런너 섹션을 포함하는 단자, 및 본드 패드에 접착되는 땜납 범프를 포함하는 것을 특징으로 하는 땜납-범프된 집적회로다이.
  13. 실리콘 기판, 실리코 기판위에 겹쳐있고, 땜납 금속에 의해 습윤되지 않는 유전체 중합체로 형성되고 개구부를 한정하는 표면안정화층, 상기 개구를 통해 노출되는 상기 실리콘 기판상의 알루미늄 금속접촉부 은도금된 구리입자들 및 레졸형 페놀계 수지 바인더를 포함하는 전기적으로 도전성이고 땜납-습윤성이 물질로 형성되고, 알루미늄 금속 접촉부로부터 떨어져 상기 표면안정화층 위에 겹쳐있는 본드 패드 및 본드 패드로부터 연장되어 있고 본드 패드와 알루미늄 금속 접촉부 사이에서 전기 신호들을 도전시키기 위해 알루미늄 금속 접촉부에 접속되어 있는 런너 섹션을 포함하는 단자, 및 본드 패드에 접착되는 땜납 범프를 포함하는 것을 특징으로 하는 땜납-범프된 직접 회로 다이.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940703890A 1992-04-30 1993-04-21 집적 회로 다이의 땜납 범핑(solder bumping of integrated circuit die) KR950701396A (ko)

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US07/876,147 1992-04-30
US07/876,147 US5281684A (en) 1992-04-30 1992-04-30 Solder bumping of integrated circuit die
PCT/US1993/003731 WO1993022475A1 (en) 1992-04-30 1993-04-21 Solder bumping of integrated circuit die

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WO1993022475A1 (en) 1993-11-11
EP0640151B1 (en) 1997-07-30
EP0640151A1 (en) 1995-03-01
JPH07506462A (ja) 1995-07-13
DE69312709D1 (de) 1997-09-04
US5281684A (en) 1994-01-25
DE69312709T2 (de) 1998-02-05
US5327013A (en) 1994-07-05
EP0640151A4 (en) 1995-05-03

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