KR950030233A - How to remove photoresist - Google Patents

How to remove photoresist Download PDF

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Publication number
KR950030233A
KR950030233A KR1019940008861A KR19940008861A KR950030233A KR 950030233 A KR950030233 A KR 950030233A KR 1019940008861 A KR1019940008861 A KR 1019940008861A KR 19940008861 A KR19940008861 A KR 19940008861A KR 950030233 A KR950030233 A KR 950030233A
Authority
KR
South Korea
Prior art keywords
photoresist
remove photoresist
present
wafer
loading
Prior art date
Application number
KR1019940008861A
Other languages
Korean (ko)
Other versions
KR0144249B1 (en
Inventor
백인기
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019940008861A priority Critical patent/KR0144249B1/en
Publication of KR950030233A publication Critical patent/KR950030233A/en
Application granted granted Critical
Publication of KR0144249B1 publication Critical patent/KR0144249B1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

본 발명은 반도체장치 제조시의 포토레지스트 제거방법에 관한 것으로, 효율적으로 포토레지스트 제거공정을 행하여 생산능력을 향상시키기 위한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of removing photoresist in the manufacture of semiconductor devices, and to improve the production capacity by performing a photoresist removal process efficiently.

본 발명은 플라즈마장치의 석영보트의 1개의 홈에 2장의 웨이퍼를 뒷면을 맞대어 로딩하여 웨이퍼상에 도포된 포토레지스트의 제거공정을 진행하는 것을 특징으로 하는 포토레지스트 제거방법을 제공한다.The present invention provides a method of removing a photoresist, wherein a process of removing a photoresist applied on a wafer is carried out by loading two wafers into a groove of a quartz boat of a plasma apparatus, facing each other.

Description

포토레지스트 제거방법How to remove photoresist

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명의 포토레지스트 제거를 위한 플라즈마 장비를 도시한 도면.2 illustrates a plasma apparatus for removing photoresist of the present invention.

Claims (2)

플라즈마장치의 석영보트의 1개의 홈에 2장의 웨이퍼를 뒷면을 맞대어 로딩하여 웨이퍼상에 도포된 포토레지스트의 제거공정을 진행하는 것을 특징으로 하는 포토레지스트 제거방법.A method of removing a photoresist, comprising: loading two wafers face-to-back in one groove of a quartz boat of a plasma apparatus, and removing the photoresist applied onto the wafer. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임※ Note: The disclosure is based on the initial application.
KR1019940008861A 1994-04-26 1994-04-26 Method of removing photoresist KR0144249B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940008861A KR0144249B1 (en) 1994-04-26 1994-04-26 Method of removing photoresist

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940008861A KR0144249B1 (en) 1994-04-26 1994-04-26 Method of removing photoresist

Publications (2)

Publication Number Publication Date
KR950030233A true KR950030233A (en) 1995-11-24
KR0144249B1 KR0144249B1 (en) 1998-08-17

Family

ID=19381776

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940008861A KR0144249B1 (en) 1994-04-26 1994-04-26 Method of removing photoresist

Country Status (1)

Country Link
KR (1) KR0144249B1 (en)

Also Published As

Publication number Publication date
KR0144249B1 (en) 1998-08-17

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