KR950024309A - Manufacturing method and mold mold structure of semiconductor mold - Google Patents

Manufacturing method and mold mold structure of semiconductor mold Download PDF

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Publication number
KR950024309A
KR950024309A KR1019940001158A KR19940001158A KR950024309A KR 950024309 A KR950024309 A KR 950024309A KR 1019940001158 A KR1019940001158 A KR 1019940001158A KR 19940001158 A KR19940001158 A KR 19940001158A KR 950024309 A KR950024309 A KR 950024309A
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South Korea
Prior art keywords
mold
semiconductor
punch
shape
manufacturing
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KR1019940001158A
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Korean (ko)
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KR970011624B1 (en
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이구
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황인길
아남산업 주식회사
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Priority to KR1019940001158A priority Critical patent/KR970011624B1/en
Publication of KR950024309A publication Critical patent/KR950024309A/en
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Publication of KR970011624B1 publication Critical patent/KR970011624B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

본 발명은 반도체 패키지 조립과정중 열경화성수지를 사용하여 반도체를 봉함하는 몰드(MOLD)금형의 제조방법 및 몰드금형구조에 관한 것이다.The present invention relates to a method of manufacturing a mold (MOLD) mold and a mold mold structure for sealing a semiconductor using a thermosetting resin during the semiconductor package assembly process.

종래에는 몰드금형을 제조함에 있어서 수지의 누출을 막기위해 금형상의 리드프레임 눌름부분(4)에 돌출부(4a) 또는 홈부(4b)를 가공하는 방법에 의해 몰드금형을 제조해 왔기 때문에 반도체의 고집적화에 따른 금형제작상의 어려움과 반도체 패키지의 성형성을 저하시키는 일요인이 되어 왔었다.Conventionally, in manufacturing mold molds, mold molds have been manufactured by processing protrusions 4a or grooves 4b in lead frame pressing portions 4 on molds in order to prevent resin leakage. This has been a factor in reducing moldability and moldability of semiconductor packages.

본 발명에서는 반도체 몰드금형을 수개의 유니트로 분할하여 조립 구성토록 함으로써 반도체 조립공정의 단순화를 이룩하고 나아가 댑바없는 리드프레임의 몰드성형시 수지가 금형밖으로 누출되는 것을 방지토록 하여 반도체 패키지의 성형품질을 향상시킬 수 있도록 한 것이다.The present invention simplifies the semiconductor assembly process by dividing the semiconductor mold mold into several units, thereby simplifying the semiconductor assembly process, and further preventing the resin from leaking out of the mold during mold molding of the leadless rod frame. It is to help improve.

Description

반도체 몰드(MOLD)금형의 제조방법 및 몰드금형구조Manufacturing method and mold mold structure of semiconductor mold

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제5도는 본 발명의 상부 또는 하부 몰드 금형 구성도.5 is a top or bottom mold mold configuration of the present invention.

Claims (9)

반도체 몰드(MOLD)금형을 제작함에 있어서, 상하부몰드금형(100)을 금형본체(30)와 펀치(40)와 형상금형(50)으로 분할 제작하여, 일측 몰드금형은 금형본체(30)와 펀치(40)와 형상금형(50)의 세부분으로 조립 구성하고, 타측 몰드금형은 금형본체(30)와 형상금형(50)만으로 조립 구성함을 특징으로 하는 반도체 몰드(MOLD)금형의 제조방법.In manufacturing a semiconductor mold (MOLD) mold, the upper and lower mold mold 100 is divided into a mold body 30, a punch 40 and a shape mold 50, and one mold mold is formed of a mold body 30 and a punch. The method of manufacturing a semiconductor mold (MOLD) mold, characterized in that the assembly is composed of the parts of the 40 and the shape mold (50), the other mold mold is assembled only by the mold body 30 and the shape mold (50). 제1항에 있어서, 상부몰드금형(l00)을 금형본체(30)와 펀치(40)와 형상금형(50)으로 조립 구성함을 특징으로 하는 반도체 몰드(MOLD)금형의 제조방법.The method according to claim 1, wherein the upper mold mold (00) is assembled into a mold body (30), a punch (40) and a shape mold (50). 제1항에 있어서, 하부몰드금형(100)을 금형본체(30)와 펀치(40)와 형상금형(50)으로 조립 구성함을 특징으로 하는 반도체 몰드(MOLD)금형의 제조방법.The method according to claim 1, wherein the lower mold mold (100) is assembled into a mold body (30), a punch (40) and a shape mold (50). 사각공간부(32)를 가지며 네면으로 다수개의 펀치홀(31)을 일정간격 형성한 금형본체(30)와, 상기 금형본체(30)의 펀치홀(31)에 삽입 설치되는 봉상의 펀치(40)와, 상기 금형본체(30)에 형성된 사각공간부(32)안에 설치되어 반도체를 봉함하는 부분인 형상금형(50)으로 조립 구성됨을 특징으로 하는 반도체 몰드금형구조.A mold main body 30 having a rectangular space portion 32 and formed with a plurality of punch holes 31 at regular intervals, and a rod-shaped punch 40 inserted into the punch hole 31 of the mold main body 30. And a shape mold (50) which is installed in the rectangular space portion (32) formed in the mold body (30) to seal the semiconductor. 제4항에 있어서, 금형본체(30)에 형성된 사각공간부(32)의 네면에 2.5㎜-0.2㎜의 일정한 간격을 두고 상하가 관통되는 사각형상인 펀치홀(31)을 형성함을 특징으로 한 반도체 몰드금형구조.The method of claim 4, wherein the four sides of the rectangular space portion 32 formed in the mold body 30 is formed with a punch hole 31 of rectangular shape through which the upper and lower sides are penetrated at regular intervals of 2.5 mm-0.2 mm. Semiconductor mold mold structure. 제4항에 있어서, 금형본체(30)의 펀치홀(31)에 각각 삽입되는 펀치(40)를 구성하되 그 저면일측에 고정부(41)를 돌출형성하고 펀치(40)의 상부형상을 쐐기형으로 형성함을 특징으로 하는 반도체 몰드금형구조.The method of claim 4, wherein each of the punch 40 to be inserted into the punch hole 31 of the mold body 30 is configured, but the fixing portion 41 is formed on one side of the bottom surface and the upper shape of the punch 40 is wedge A semiconductor mold mold structure, characterized in that formed in the mold. 제4항 및 제6항중 어느 한 항에 있어서, 하나의 부재에 여러개의 펀치(40)를 형성하여 상기 금형본체(30)에 형성된 다수개의 펀치홀(31)에 끼워 맞춰지도록 함을 특징으로 하는 반도체 몰드금형구조.The method of claim 4, wherein a plurality of punches 40 are formed in one member to be fitted into the plurality of punch holes 31 formed in the mold body 30. Semiconductor mold mold structure. 제4항에 있어서, 상기 금형본체(30)의, 사각공간부(32)에 삽입 설치되는 형상금형(50)을 구성하되, 형상금형(50)의 저면부에 상기 펀치(40)의 고정부(41)가 삽착되는 펀치고정홈부(52)를 형성함을 특징으로 하는 반도체 몰드금형구조.The method of claim 4, wherein the mold body 30, the shape of the mold 50 is inserted into the rectangular space portion 32 is installed, but the fixing portion of the punch 40 in the bottom surface of the mold 50 And a punch fixing groove portion 52 into which the 41 is inserted. 제1항에 있어서, 상부금형(또는 하부금형)에 돌출 설치된 펀치(40)가 리드프레임(1)의 각 리드(1a)사이를 거쳐 하부금형(또는 상부금형)에 형성된 펀치홀(31 )에 삽입되도록 하는 방법에 의해 열경화성수지의 금형밖 누출을 차폐토록 함을 특징으로 하는 반도체 몰드(MOLD)금형의 제조방법.According to claim 1, Punch 40 protruding in the upper mold (or lower mold) is formed in the punch hole 31 formed in the lower mold (or upper mold) through each lead (1a) of the lead frame (1). A method of manufacturing a semiconductor mold (MOLD) mold, characterized in that to shield the out-of-mold leakage of the thermosetting resin by the method to be inserted. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940001158A 1994-01-22 1994-01-22 Manufacture of mold transform and mold transform structure KR970011624B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940001158A KR970011624B1 (en) 1994-01-22 1994-01-22 Manufacture of mold transform and mold transform structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940001158A KR970011624B1 (en) 1994-01-22 1994-01-22 Manufacture of mold transform and mold transform structure

Publications (2)

Publication Number Publication Date
KR950024309A true KR950024309A (en) 1995-08-21
KR970011624B1 KR970011624B1 (en) 1997-07-12

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KR1019940001158A KR970011624B1 (en) 1994-01-22 1994-01-22 Manufacture of mold transform and mold transform structure

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