KR910008854A - 전기 또는 전자회로의 성형에 사용되는 세라믹기판 - Google Patents

전기 또는 전자회로의 성형에 사용되는 세라믹기판 Download PDF

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Publication number
KR910008854A
KR910008854A KR1019900015989A KR900015989A KR910008854A KR 910008854 A KR910008854 A KR 910008854A KR 1019900015989 A KR1019900015989 A KR 1019900015989A KR 900015989 A KR900015989 A KR 900015989A KR 910008854 A KR910008854 A KR 910008854A
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KR
South Korea
Prior art keywords
ceramic
electronic circuits
ceramic substrates
substrates used
forming electrical
Prior art date
Application number
KR1019900015989A
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English (en)
Other versions
KR0173782B1 (ko
Inventor
히데아끼 요시다
요시로오 구로미쓰
마꼬도 도리우미
미찌오 유자와
Original Assignee
나가노 다께시
미쓰비시 긴조꾸 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26456504&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR910008854(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP1263710A external-priority patent/JP2658435B2/ja
Priority claimed from JP11858889U external-priority patent/JPH0810202Y2/ja
Application filed by 나가노 다께시, 미쓰비시 긴조꾸 가부시기가이샤 filed Critical 나가노 다께시
Publication of KR910008854A publication Critical patent/KR910008854A/ko
Application granted granted Critical
Publication of KR0173782B1 publication Critical patent/KR0173782B1/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

내용 없음

Description

전기 또는 전자회로의 성형에 사용되는 세라믹기판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 의한 세라믹기판의 구조를 나타내는 단면도.

Claims (2)

  1. a) 주로 질화알루미늄으로 이루어진 물질로 형성된 세라믹판(11)과 b) 알루미늄 또는 알루미늄합금으로 형성되어 전기한 세라믹판의 한쪽면에 접합되며, 그곳에 접속되는 적어도 하나의 회로부품(16)(17)을 위한 도전로(conductivd path)를 구비하는 전도성아일런드(12)(13)로 구성된 것을 특징으로 하는 전기 또는 전자회로의 성형에 사용되는 세라믹기판.
  2. 제1항에 있어서, 전기한 세라믹기판은 알루미늄 또는 알루미늄합금으로 형성되어 전기한 세라믹판(11)의 다른쪽 면에 접합되는 방열판(14)이 더 구성되어 있는 것을 특징으로 하는 전기 또는 전자회로의 성형에 사용되는 세라믹기판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900015989A 1989-10-09 1990-10-08 전기 또는 전자회로의 성형에 사용되는 세라믹기판 KR0173782B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1-118588 1989-10-09
JP1-263710 1989-10-09
JP1263710A JP2658435B2 (ja) 1989-10-09 1989-10-09 半導体装置用軽量基板
JP11858889U JPH0810202Y2 (ja) 1989-10-09 1989-10-09 半導体装置用軽量基板

Publications (2)

Publication Number Publication Date
KR910008854A true KR910008854A (ko) 1991-05-31
KR0173782B1 KR0173782B1 (ko) 1999-02-01

Family

ID=26456504

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900015989A KR0173782B1 (ko) 1989-10-09 1990-10-08 전기 또는 전자회로의 성형에 사용되는 세라믹기판

Country Status (4)

Country Link
US (1) US5130498A (ko)
EP (2) EP1020914B1 (ko)
KR (1) KR0173782B1 (ko)
DE (2) DE69034139T2 (ko)

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US5570502A (en) * 1991-04-08 1996-11-05 Aluminum Company Of America Fabricating metal matrix composites containing electrical insulators
US5775403A (en) * 1991-04-08 1998-07-07 Aluminum Company Of America Incorporating partially sintered preforms in metal matrix composites
US5616421A (en) * 1991-04-08 1997-04-01 Aluminum Company Of America Metal matrix composites containing electrical insulators
US5474834A (en) * 1992-03-09 1995-12-12 Kyocera Corporation Superconducting circuit sub-assembly having an oxygen shielding barrier layer
WO1995002900A1 (en) * 1993-07-15 1995-01-26 Astarix, Inc. Aluminum-palladium alloy for initiation of electroless plating
US5965193A (en) 1994-04-11 1999-10-12 Dowa Mining Co., Ltd. Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material
ATE204678T1 (de) * 1995-10-16 2001-09-15 Siemens Nv Polymeres höcker-matrix-gehäuse
US5700549A (en) * 1996-06-24 1997-12-23 International Business Machines Corporation Structure to reduce stress in multilayer ceramic substrates
US6033787A (en) * 1996-08-22 2000-03-07 Mitsubishi Materials Corporation Ceramic circuit board with heat sink
DE19654606C2 (de) * 1996-12-20 1998-10-22 Siemens Ag Beidseitig oder mehrschichtig kupferkaschierte Leiterplatte und Verfahren zu ihrer Herstellung
JP3864282B2 (ja) 1998-09-22 2006-12-27 三菱マテリアル株式会社 パワーモジュール用基板及びその製造方法並びにこの基板を用いた半導体装置
JP2001148451A (ja) 1999-03-24 2001-05-29 Mitsubishi Materials Corp パワーモジュール用基板
EP1056321B1 (en) * 1999-05-28 2007-11-14 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic substrate circuit and its manufacturing process
JP4649027B2 (ja) * 1999-09-28 2011-03-09 株式会社東芝 セラミックス回路基板
US6485816B2 (en) * 2000-01-31 2002-11-26 Ngk Insulators, Ltd. Laminated radiation member, power semiconductor apparatus, and method for producing the same
EP1315205A4 (en) * 2000-08-09 2009-04-01 Mitsubishi Materials Corp POWER MODULE AND POWER MODULE WITH COOLING BODY
AU2002218493A1 (en) * 2000-11-29 2002-06-11 Denki Kagaku Kogyo Kabushiki Kaisha Integral-type ceramic circuit board and method of producing same
JP4015023B2 (ja) * 2001-02-22 2007-11-28 日本碍子株式会社 電子回路用部材及びその製造方法並びに電子部品
US6670216B2 (en) 2001-10-31 2003-12-30 Ixys Corporation Method for manufacturing a power semiconductor device and direct bonded substrate thereof
JP2003163315A (ja) * 2001-11-29 2003-06-06 Denki Kagaku Kogyo Kk モジュール
US7128979B2 (en) * 2002-04-19 2006-10-31 Mitsubishi Materials Corporation Circuit board, method of producing same, and power module
JP4028452B2 (ja) * 2003-08-27 2007-12-26 Dowaホールディングス株式会社 電子部品搭載基板およびその製造方法
JP4664816B2 (ja) * 2003-09-25 2011-04-06 株式会社東芝 セラミック回路基板、その製造方法およびパワーモジュール
KR20110124372A (ko) * 2004-04-05 2011-11-16 미쓰비시 마테리알 가부시키가이샤 Al/AlN 접합체, 전력 모듈용 기판 및 전력 모듈, 그리고 Al/AlN 접합체의 제조 방법
WO2008004851A1 (en) * 2006-07-06 2008-01-10 Globetronics Industries Sdn Bhd (17765-H) A hybrid substrate and method of manufacturing the same
JP4832419B2 (ja) * 2007-12-25 2011-12-07 トヨタ自動車株式会社 半導体モジュール
JP5675610B2 (ja) * 2009-07-24 2015-02-25 株式会社東芝 窒化珪素製絶縁シートおよびそれを用いた半導体モジュール構造体
JP6307832B2 (ja) * 2013-01-22 2018-04-11 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール
JP6614026B2 (ja) * 2016-05-20 2019-12-04 株式会社オートネットワーク技術研究所 電磁シールド部材、配線モジュール及び電磁シールド部材の製造方法
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Also Published As

Publication number Publication date
EP1020914A2 (en) 2000-07-19
EP0422558A2 (en) 1991-04-17
EP0422558B1 (en) 2001-03-28
DE69034139T2 (de) 2004-11-25
EP0422558A3 (en) 1991-12-18
KR0173782B1 (ko) 1999-02-01
EP1020914A3 (en) 2000-08-02
DE69033718D1 (de) 2001-05-03
US5130498A (en) 1992-07-14
EP1020914B1 (en) 2004-04-28
DE69034139D1 (de) 2004-06-03
DE69033718T2 (de) 2001-11-15

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