KR910008854A - 전기 또는 전자회로의 성형에 사용되는 세라믹기판 - Google Patents
전기 또는 전자회로의 성형에 사용되는 세라믹기판 Download PDFInfo
- Publication number
- KR910008854A KR910008854A KR1019900015989A KR900015989A KR910008854A KR 910008854 A KR910008854 A KR 910008854A KR 1019900015989 A KR1019900015989 A KR 1019900015989A KR 900015989 A KR900015989 A KR 900015989A KR 910008854 A KR910008854 A KR 910008854A
- Authority
- KR
- South Korea
- Prior art keywords
- ceramic
- electronic circuits
- ceramic substrates
- substrates used
- forming electrical
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 title claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Ceramic Products (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 의한 세라믹기판의 구조를 나타내는 단면도.
Claims (2)
- a) 주로 질화알루미늄으로 이루어진 물질로 형성된 세라믹판(11)과 b) 알루미늄 또는 알루미늄합금으로 형성되어 전기한 세라믹판의 한쪽면에 접합되며, 그곳에 접속되는 적어도 하나의 회로부품(16)(17)을 위한 도전로(conductivd path)를 구비하는 전도성아일런드(12)(13)로 구성된 것을 특징으로 하는 전기 또는 전자회로의 성형에 사용되는 세라믹기판.
- 제1항에 있어서, 전기한 세라믹기판은 알루미늄 또는 알루미늄합금으로 형성되어 전기한 세라믹판(11)의 다른쪽 면에 접합되는 방열판(14)이 더 구성되어 있는 것을 특징으로 하는 전기 또는 전자회로의 성형에 사용되는 세라믹기판.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1-118588 | 1989-10-09 | ||
JP1-263710 | 1989-10-09 | ||
JP1263710A JP2658435B2 (ja) | 1989-10-09 | 1989-10-09 | 半導体装置用軽量基板 |
JP11858889U JPH0810202Y2 (ja) | 1989-10-09 | 1989-10-09 | 半導体装置用軽量基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910008854A true KR910008854A (ko) | 1991-05-31 |
KR0173782B1 KR0173782B1 (ko) | 1999-02-01 |
Family
ID=26456504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900015989A KR0173782B1 (ko) | 1989-10-09 | 1990-10-08 | 전기 또는 전자회로의 성형에 사용되는 세라믹기판 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5130498A (ko) |
EP (2) | EP1020914B1 (ko) |
KR (1) | KR0173782B1 (ko) |
DE (2) | DE69034139T2 (ko) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0455229B1 (en) * | 1990-05-02 | 1997-10-15 | Mitsubishi Materials Corporation | Ceramic substrate used for an electric or electronic circuit |
US5570502A (en) * | 1991-04-08 | 1996-11-05 | Aluminum Company Of America | Fabricating metal matrix composites containing electrical insulators |
US5775403A (en) * | 1991-04-08 | 1998-07-07 | Aluminum Company Of America | Incorporating partially sintered preforms in metal matrix composites |
US5616421A (en) * | 1991-04-08 | 1997-04-01 | Aluminum Company Of America | Metal matrix composites containing electrical insulators |
US5474834A (en) * | 1992-03-09 | 1995-12-12 | Kyocera Corporation | Superconducting circuit sub-assembly having an oxygen shielding barrier layer |
WO1995002900A1 (en) * | 1993-07-15 | 1995-01-26 | Astarix, Inc. | Aluminum-palladium alloy for initiation of electroless plating |
US5965193A (en) | 1994-04-11 | 1999-10-12 | Dowa Mining Co., Ltd. | Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material |
ATE204678T1 (de) * | 1995-10-16 | 2001-09-15 | Siemens Nv | Polymeres höcker-matrix-gehäuse |
US5700549A (en) * | 1996-06-24 | 1997-12-23 | International Business Machines Corporation | Structure to reduce stress in multilayer ceramic substrates |
US6033787A (en) * | 1996-08-22 | 2000-03-07 | Mitsubishi Materials Corporation | Ceramic circuit board with heat sink |
DE19654606C2 (de) * | 1996-12-20 | 1998-10-22 | Siemens Ag | Beidseitig oder mehrschichtig kupferkaschierte Leiterplatte und Verfahren zu ihrer Herstellung |
JP3864282B2 (ja) | 1998-09-22 | 2006-12-27 | 三菱マテリアル株式会社 | パワーモジュール用基板及びその製造方法並びにこの基板を用いた半導体装置 |
JP2001148451A (ja) | 1999-03-24 | 2001-05-29 | Mitsubishi Materials Corp | パワーモジュール用基板 |
EP1056321B1 (en) * | 1999-05-28 | 2007-11-14 | Denki Kagaku Kogyo Kabushiki Kaisha | Ceramic substrate circuit and its manufacturing process |
JP4649027B2 (ja) * | 1999-09-28 | 2011-03-09 | 株式会社東芝 | セラミックス回路基板 |
US6485816B2 (en) * | 2000-01-31 | 2002-11-26 | Ngk Insulators, Ltd. | Laminated radiation member, power semiconductor apparatus, and method for producing the same |
EP1315205A4 (en) * | 2000-08-09 | 2009-04-01 | Mitsubishi Materials Corp | POWER MODULE AND POWER MODULE WITH COOLING BODY |
AU2002218493A1 (en) * | 2000-11-29 | 2002-06-11 | Denki Kagaku Kogyo Kabushiki Kaisha | Integral-type ceramic circuit board and method of producing same |
JP4015023B2 (ja) * | 2001-02-22 | 2007-11-28 | 日本碍子株式会社 | 電子回路用部材及びその製造方法並びに電子部品 |
US6670216B2 (en) | 2001-10-31 | 2003-12-30 | Ixys Corporation | Method for manufacturing a power semiconductor device and direct bonded substrate thereof |
JP2003163315A (ja) * | 2001-11-29 | 2003-06-06 | Denki Kagaku Kogyo Kk | モジュール |
US7128979B2 (en) * | 2002-04-19 | 2006-10-31 | Mitsubishi Materials Corporation | Circuit board, method of producing same, and power module |
JP4028452B2 (ja) * | 2003-08-27 | 2007-12-26 | Dowaホールディングス株式会社 | 電子部品搭載基板およびその製造方法 |
JP4664816B2 (ja) * | 2003-09-25 | 2011-04-06 | 株式会社東芝 | セラミック回路基板、その製造方法およびパワーモジュール |
KR20110124372A (ko) * | 2004-04-05 | 2011-11-16 | 미쓰비시 마테리알 가부시키가이샤 | Al/AlN 접합체, 전력 모듈용 기판 및 전력 모듈, 그리고 Al/AlN 접합체의 제조 방법 |
WO2008004851A1 (en) * | 2006-07-06 | 2008-01-10 | Globetronics Industries Sdn Bhd (17765-H) | A hybrid substrate and method of manufacturing the same |
JP4832419B2 (ja) * | 2007-12-25 | 2011-12-07 | トヨタ自動車株式会社 | 半導体モジュール |
JP5675610B2 (ja) * | 2009-07-24 | 2015-02-25 | 株式会社東芝 | 窒化珪素製絶縁シートおよびそれを用いた半導体モジュール構造体 |
JP6307832B2 (ja) * | 2013-01-22 | 2018-04-11 | 三菱マテリアル株式会社 | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール |
JP6614026B2 (ja) * | 2016-05-20 | 2019-12-04 | 株式会社オートネットワーク技術研究所 | 電磁シールド部材、配線モジュール及び電磁シールド部材の製造方法 |
CN106888551A (zh) * | 2017-04-17 | 2017-06-23 | 深圳市环基实业有限公司 | 一种陶瓷基覆铜板及其制备工艺 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3829598A (en) * | 1972-09-25 | 1974-08-13 | Hutson Ind Inc | Copper heat sinks for electronic devices and method of making same |
US4409278A (en) * | 1981-04-16 | 1983-10-11 | General Electric Company | Blister-free direct bonding of metals to ceramics and metals |
DE3376829D1 (en) * | 1982-06-29 | 1988-07-07 | Toshiba Kk | Method for directly bonding ceramic and metal members and laminated body of the same |
JPS59228740A (ja) * | 1983-06-10 | 1984-12-22 | Toshiba Corp | 耐熱性絶縁板 |
US4700273A (en) * | 1986-06-03 | 1987-10-13 | Kaufman Lance R | Circuit assembly with semiconductor expansion matched thermal path |
JPS6318648A (ja) * | 1986-07-11 | 1988-01-26 | Toshiba Corp | 窒化アルミニウム回路基板 |
JPH0834265B2 (ja) * | 1987-07-07 | 1996-03-29 | 株式会社東芝 | 良熱伝導性基板 |
US4791075A (en) * | 1987-10-05 | 1988-12-13 | Motorola, Inc. | Process for making a hermetic low cost pin grid array package |
JPH01214194A (ja) * | 1988-02-23 | 1989-08-28 | Toshiba Corp | 熱伝導性基板 |
JP2503775B2 (ja) * | 1988-09-30 | 1996-06-05 | 三菱マテリアル株式会社 | 半導体装置用基板 |
-
1990
- 1990-10-08 DE DE69034139T patent/DE69034139T2/de not_active Expired - Lifetime
- 1990-10-08 EP EP00104809A patent/EP1020914B1/en not_active Expired - Lifetime
- 1990-10-08 EP EP90119255A patent/EP0422558B1/en not_active Revoked
- 1990-10-08 DE DE69033718T patent/DE69033718T2/de not_active Revoked
- 1990-10-08 KR KR1019900015989A patent/KR0173782B1/ko not_active IP Right Cessation
- 1990-10-09 US US07/594,596 patent/US5130498A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1020914A2 (en) | 2000-07-19 |
EP0422558A2 (en) | 1991-04-17 |
EP0422558B1 (en) | 2001-03-28 |
DE69034139T2 (de) | 2004-11-25 |
EP0422558A3 (en) | 1991-12-18 |
KR0173782B1 (ko) | 1999-02-01 |
EP1020914A3 (en) | 2000-08-02 |
DE69033718D1 (de) | 2001-05-03 |
US5130498A (en) | 1992-07-14 |
EP1020914B1 (en) | 2004-04-28 |
DE69034139D1 (de) | 2004-06-03 |
DE69033718T2 (de) | 2001-11-15 |
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A201 | Request for examination | ||
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