KR970018465A - Lead frame of semiconductor package - Google Patents
Lead frame of semiconductor package Download PDFInfo
- Publication number
- KR970018465A KR970018465A KR1019950030024A KR19950030024A KR970018465A KR 970018465 A KR970018465 A KR 970018465A KR 1019950030024 A KR1019950030024 A KR 1019950030024A KR 19950030024 A KR19950030024 A KR 19950030024A KR 970018465 A KR970018465 A KR 970018465A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- lead frame
- package
- lead
- pad portion
- Prior art date
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
본 발명은 반도체 제작 공정에 포함되는 조립공정에 있어서, 리드 프레임의 강도가 현저히 향상된 반도체 패키지의 리드 프레임을 제공하는 것으로서 좀 더 상세하게는 반도체 패키지중 트랜지스터 패키지에 적용되는 TO-220 패키지의 리드 프레임 폭을 일정하게 확대시켜 조립공정중 리드 휨 발생이 방지되도록 강도를 향상시킨 반도체 패키지의 리드 프레임에 관한 것으로 본도체 다이가 부착되는 패드부와, 상기 패드부의 다이와 본딩 와이어로 연결된 복수의 리드들을 몰드 수지로 봉지한 반도체 패키지에 있어서, 상기 각 리드들은 휨 방지를 위해 충분한 강도를 가리는 넓은 폭으로 구성됨을 특징으로 하는 반도체 패키지의 리드 프레임에 관한 것이다.The present invention provides a lead frame of a semiconductor package in which the strength of the lead frame is remarkably improved in the assembling process included in the semiconductor fabrication process, and more particularly, a lead frame of a TO-220 package applied to a transistor package in a semiconductor package. The present invention relates to a lead frame of a semiconductor package in which a width thereof is uniformly increased to prevent lead bending during an assembling process, and includes a pad portion to which a conductor die is attached, and a plurality of leads connected to the pad portion by a die and a bonding wire In a semiconductor package encapsulated with a resin, each of the leads relates to a lead frame of a semiconductor package, characterized in that it is configured in a wide width that covers a sufficient strength to prevent bending.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2도는 본 발명에 의한 반도체 패키지의 리드 프레임을 도시한 것이다.2 shows a lead frame of a semiconductor package according to the present invention.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950030024A KR970018465A (en) | 1995-09-14 | 1995-09-14 | Lead frame of semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950030024A KR970018465A (en) | 1995-09-14 | 1995-09-14 | Lead frame of semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970018465A true KR970018465A (en) | 1997-04-30 |
Family
ID=66615262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950030024A KR970018465A (en) | 1995-09-14 | 1995-09-14 | Lead frame of semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970018465A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150075727A (en) * | 2013-12-26 | 2015-07-06 | 삼성전기주식회사 | Semiconductor package |
-
1995
- 1995-09-14 KR KR1019950030024A patent/KR970018465A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150075727A (en) * | 2013-12-26 | 2015-07-06 | 삼성전기주식회사 | Semiconductor package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Withdrawal due to no request for examination |