JP2616413B2
(ja)
*
|
1993-11-22 |
1997-06-04 |
日本電気株式会社 |
リペアデータの編集装置およびリペアデータの編集方法
|
US6546308B2
(en)
|
1993-12-28 |
2003-04-08 |
Hitachi, Ltd, |
Method and system for manufacturing semiconductor devices, and method and system for inspecting semiconductor devices
|
JPH07201946A
(ja)
*
|
1993-12-28 |
1995-08-04 |
Hitachi Ltd |
半導体装置等の製造方法及びその装置並びに検査方法及びその装置
|
US5544350A
(en)
*
|
1994-07-05 |
1996-08-06 |
Taiwan Semiconductor Manufacturing Co. |
Ratio of running work in progress
|
JP2755195B2
(ja)
*
|
1994-12-08 |
1998-05-20 |
日本電気株式会社 |
半導体装置の製造方法及びその装置
|
KR960035944A
(ko)
*
|
1995-03-28 |
1996-10-28 |
김주용 |
반도체 소자 제조시 불량분석 방법
|
US5546326A
(en)
*
|
1995-04-04 |
1996-08-13 |
Taiwan Semiconductor Manufacturing Company Ltd |
Dynamic dispatching rule that uses long term due date and short term queue time to improve delivery performance
|
US5665609A
(en)
*
|
1995-04-21 |
1997-09-09 |
Sony Corporation |
Prioritizing efforts to improve semiconductor production yield
|
US5971586A
(en)
*
|
1995-04-21 |
1999-10-26 |
Sony Corporation |
Identifying causes of semiconductor production yield loss
|
JP3639636B2
(ja)
*
|
1995-04-25 |
2005-04-20 |
株式会社ルネサステクノロジ |
半導体ウェハの不良解析装置及び不良解析方法
|
US6009545A
(en)
*
|
1995-04-25 |
1999-12-28 |
Mitsubishi Denki Kabushiki Kaisha |
System for analyzing a failure in a semiconductor wafer by calculating correlation coefficient between collated data of defects per prescribed unit and failures per prescribed unit
|
US5991699A
(en)
*
|
1995-05-04 |
1999-11-23 |
Kla Instruments Corporation |
Detecting groups of defects in semiconductor feature space
|
US5612886A
(en)
*
|
1995-05-12 |
1997-03-18 |
Taiwan Semiconductor Manufacturing Company Ltd. |
Method and system for dynamic dispatching in semiconductor manufacturing plants
|
US5787190A
(en)
*
|
1995-06-07 |
1998-07-28 |
Advanced Micro Devices, Inc. |
Method and apparatus for pattern recognition of wafer test bins
|
US5828778A
(en)
*
|
1995-07-13 |
1998-10-27 |
Matsushita Electric Industrial Co., Ltd. |
Method and apparatus for analyzing failure of semiconductor wafer
|
US5716856A
(en)
*
|
1995-08-22 |
1998-02-10 |
Advanced Micro Devices, Inc. |
Arrangement and method for detecting sequential processing effects in manufacturing using predetermined sequences within runs
|
US5963881A
(en)
*
|
1995-09-22 |
1999-10-05 |
Texas Instruments Incorporated |
Method and system for enhancing the identification of causes of variations in the performance of manufactured articles
|
JPH09199551A
(ja)
*
|
1996-01-12 |
1997-07-31 |
Mitsubishi Electric Corp |
インライン検査用検査データ解析処理装置
|
US5923554A
(en)
*
|
1996-01-16 |
1999-07-13 |
Matsushita Electric Industrial Co., Ltd. |
Method for assessing the number and type of flaws
|
DE19607047C2
(de)
*
|
1996-02-24 |
1999-03-25 |
Gen Semiconductor Ireland Macr |
Verfahren zum Herstellen von Halbleiterelementen mit aktiven Strukturen
|
JP3255292B2
(ja)
*
|
1996-03-19 |
2002-02-12 |
株式会社日立製作所 |
プロセス管理システム
|
US5768133A
(en)
*
|
1996-03-19 |
1998-06-16 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
WIP/move management tool for semiconductor manufacturing plant and method of operation thereof
|
US5778386A
(en)
*
|
1996-05-28 |
1998-07-07 |
Taiwan Semiconductor Manufacturing Company Ltd. |
Global view storage management system for semiconductor manufacturing plants
|
JP3436456B2
(ja)
*
|
1996-06-14 |
2003-08-11 |
三菱電機株式会社 |
エミッション顕微鏡による半導体装置の故障解析方法及び半導体装置故障解析システム
|
US6021380A
(en)
*
|
1996-07-09 |
2000-02-01 |
Scanis, Inc. |
Automatic semiconductor wafer sorter/prober with extended optical inspection
|
AU4149897A
(en)
*
|
1996-08-12 |
1998-03-06 |
Intercell Corporation |
Memory module assembly using partially defective chips
|
US6119049A
(en)
*
|
1996-08-12 |
2000-09-12 |
Tandon Associates, Inc. |
Memory module assembly using partially defective chips
|
JPH10173021A
(ja)
*
|
1996-12-12 |
1998-06-26 |
Mitsubishi Electric Corp |
製造ライン解析方法及び製造ライン解析装置
|
US6072574A
(en)
*
|
1997-01-30 |
2000-06-06 |
Micron Technology, Inc. |
Integrated circuit defect review and classification process
|
US6073501A
(en)
*
|
1997-06-20 |
2000-06-13 |
Advanced Micro Devices, Inc. |
Apparatus and method for semiconductor wafer processing which facilitate determination of a source of contaminants or defects
|
US6246472B1
(en)
|
1997-07-04 |
2001-06-12 |
Hitachi, Ltd. |
Pattern inspecting system and pattern inspecting method
|
US6446017B1
(en)
|
1997-08-21 |
2002-09-03 |
Micron Technology, Inc. |
Method and system for tracking manufacturing data for integrated circuit parts
|
US5999003A
(en)
*
|
1997-12-12 |
1999-12-07 |
Advanced Micro Devices, Inc. |
Intelligent usage of first pass defect data for improved statistical accuracy of wafer level classification
|
JP3055516B2
(ja)
*
|
1997-12-25 |
2000-06-26 |
日本電気株式会社 |
半導体集積回路の検査解析装置及びその方法並びにその制御プログラムを記録した記録媒体
|
US6169770B1
(en)
|
1998-01-08 |
2001-01-02 |
Rockwell Collins, Inc. |
Preemptive processor for mode S squitter message reception
|
US6446021B1
(en)
|
1998-02-27 |
2002-09-03 |
Micron Technology, Inc. |
Method and apparatus to display processing parameter
|
US6265232B1
(en)
*
|
1998-08-21 |
2001-07-24 |
Micron Technology, Inc. |
Yield based, in-line defect sampling method
|
EP1056127A3
(en)
*
|
1999-05-21 |
2003-04-16 |
Lucent Technologies Inc. |
Method and apparatus for correlating data from a semiconductor wafer process
|
US6507933B1
(en)
*
|
1999-07-12 |
2003-01-14 |
Advanced Micro Devices, Inc. |
Automatic defect source classification
|
US6477685B1
(en)
|
1999-09-22 |
2002-11-05 |
Texas Instruments Incorporated |
Method and apparatus for yield and failure analysis in the manufacturing of semiconductors
|
KR100806060B1
(ko)
*
|
1999-11-29 |
2008-02-21 |
루센트 테크놀러지스 인크 |
멀티-칩 패키지들의 ic칩들의 클러스터 패키징
|
US6931580B1
(en)
|
2000-03-13 |
2005-08-16 |
International Business Machines Corporation |
Rapid fail analysis of embedded objects
|
JP2001274209A
(ja)
*
|
2000-03-28 |
2001-10-05 |
Toshiba Corp |
半導体検査装置、半導体欠陥解析装置、半導体設計データ修正装置、半導体検査方法、半導体欠陥解析方法、半導体設計データ修正方法およびコンピュータ読み取り可能な記録媒体
|
US6701204B1
(en)
*
|
2000-05-22 |
2004-03-02 |
Mosel Vitelic Inc. |
System and method for finding defective tools in a semiconductor fabrication facility
|
JP2002043200A
(ja)
*
|
2000-07-24 |
2002-02-08 |
Mitsubishi Electric Corp |
異常原因検出装置及び異常原因検出方法
|
JP4250347B2
(ja)
*
|
2000-08-21 |
2009-04-08 |
株式会社東芝 |
不良クラスタリング検索方法、不良クラスタリング検索装置、不良クラスタリング検索プログラムを格納した記録媒体、救済回路最適化方法、工程管理方法、クリーンルーム管理方法、半導体装置の製造方法、問題工程及び問題装置の抽出方法、問題工程及び問題装置の抽出プログラムを格納した記録媒体、問題工程及び問題装置の抽出装置、及び検索母体のスクラップ判断方法
|
US6963813B1
(en)
*
|
2000-09-13 |
2005-11-08 |
Dieter Rathei |
Method and apparatus for fast automated failure classification for semiconductor wafers
|
US7356430B2
(en)
*
|
2001-05-24 |
2008-04-08 |
Test Advantage, Inc. |
Methods and apparatus for data analysis
|
US7167811B2
(en)
*
|
2001-05-24 |
2007-01-23 |
Test Advantage, Inc. |
Methods and apparatus for data analysis
|
US7225107B2
(en)
*
|
2001-05-24 |
2007-05-29 |
Test Advantage, Inc. |
Methods and apparatus for data analysis
|
US7395170B2
(en)
*
|
2001-05-24 |
2008-07-01 |
Test Advantage, Inc. |
Methods and apparatus for data analysis
|
JP4038356B2
(ja)
|
2001-04-10 |
2008-01-23 |
株式会社日立製作所 |
欠陥データ解析方法及びその装置並びにレビューシステム
|
JP4521386B2
(ja)
*
|
2001-04-10 |
2010-08-11 |
株式会社日立製作所 |
欠陥データ解析方法およびその装置
|
US8417477B2
(en)
|
2001-05-24 |
2013-04-09 |
Test Acuity Solutions, Inc. |
Methods and apparatus for local outlier detection
|
US20030072481A1
(en)
*
|
2001-10-11 |
2003-04-17 |
Advanced Micro Devices, Inc. |
Method for evaluating anomalies in a semiconductor manufacturing process
|
US7194366B2
(en)
*
|
2001-10-19 |
2007-03-20 |
Auburn University |
System and method for estimating reliability of components for testing and quality optimization
|
JP2003243470A
(ja)
*
|
2002-02-18 |
2003-08-29 |
Mitsubishi Electric Corp |
異常検出システム、プログラムおよび記録媒体
|
US7106897B1
(en)
|
2002-04-29 |
2006-09-12 |
Advanced Micro Devices, Inc. |
Universal spatial pattern recognition system
|
JP4310090B2
(ja)
|
2002-09-27 |
2009-08-05 |
株式会社日立製作所 |
欠陥データ解析方法及びその装置並びにレビューシステム
|
US7319935B2
(en)
*
|
2003-02-12 |
2008-01-15 |
Micron Technology, Inc. |
System and method for analyzing electrical failure data
|
JP3940718B2
(ja)
|
2003-10-30 |
2007-07-04 |
株式会社東芝 |
試験装置、良否判定基準設定装置、試験方法及び試験プログラム
|
US7415317B2
(en)
*
|
2004-02-25 |
2008-08-19 |
Micron Technology, Inc. |
Method and system for correlating and combining production and non-production data for analysis
|
US7395130B2
(en)
*
|
2004-02-27 |
2008-07-01 |
Micron Technology, Inc. |
Method and system for aggregating and combining manufacturing data for analysis
|
US7904279B2
(en)
*
|
2004-04-02 |
2011-03-08 |
Test Advantage, Inc. |
Methods and apparatus for data analysis
|
US7163829B2
(en)
*
|
2005-01-26 |
2007-01-16 |
Youngtek Electronics Corporation |
Method of integration testing for packaged electronic components
|
JP5000104B2
(ja)
*
|
2005-06-22 |
2012-08-15 |
浜松ホトニクス株式会社 |
半導体不良解析装置、不良解析方法、不良解析プログラム、及び不良解析システム
|
JP5005893B2
(ja)
*
|
2005-06-22 |
2012-08-22 |
浜松ホトニクス株式会社 |
半導体不良解析装置、不良解析方法、及び不良解析プログラム
|
US7769225B2
(en)
*
|
2005-08-02 |
2010-08-03 |
Kla-Tencor Technologies Corp. |
Methods and systems for detecting defects in a reticle design pattern
|
JP2007264914A
(ja)
*
|
2006-03-28 |
2007-10-11 |
Hitachi Global Storage Technologies Netherlands Bv |
データ解析方法
|
JP4931483B2
(ja)
*
|
2006-06-14 |
2012-05-16 |
ルネサスエレクトロニクス株式会社 |
半導体不良解析装置、不良解析方法、及び不良解析プログラム
|
JP5091430B2
(ja)
*
|
2006-06-14 |
2012-12-05 |
ルネサスエレクトロニクス株式会社 |
半導体不良解析装置、不良解析方法、及び不良解析プログラム
|
JP5087236B2
(ja)
*
|
2006-06-14 |
2012-12-05 |
ルネサスエレクトロニクス株式会社 |
半導体不良解析装置、不良解析方法、及び不良解析プログラム
|
FR2911429B1
(fr)
*
|
2007-01-11 |
2009-04-17 |
Soitec Silicon On Insulator |
"procede et systeme de detection d'amas de defauts a la surface d'un substrat"
|
US20090139163A1
(en)
*
|
2007-12-04 |
2009-06-04 |
Intigral, Inc. |
Insulating glass unit
|
US20090139165A1
(en)
*
|
2007-12-04 |
2009-06-04 |
Intigral, Inc. |
Insulating glass unit
|
US20090139164A1
(en)
*
|
2007-12-04 |
2009-06-04 |
Intigral, Inc. |
Insulating glass unit
|
US8165837B1
(en)
*
|
2008-06-09 |
2012-04-24 |
Kla-Tencor Corporation |
Multi-scale classification of defects
|
US8363922B2
(en)
*
|
2009-02-12 |
2013-01-29 |
International Business Machines Corporation |
IC layout pattern matching and classification system and method
|
US8361915B2
(en)
|
2009-05-22 |
2013-01-29 |
Vidrio Plano De Mexico, S.A. De C.V. |
Glass composition
|
CN102129164B
(zh)
|
2010-01-15 |
2012-08-22 |
中芯国际集成电路制造(上海)有限公司 |
掩膜版缺陷的判断方法及判断***
|
JP5533092B2
(ja)
|
2010-03-18 |
2014-06-25 |
株式会社リコー |
座標平面におけるデータ点分布領域の識別方法及びその識別プログラム
|
JP5533091B2
(ja)
*
|
2010-03-18 |
2014-06-25 |
株式会社リコー |
座標平面におけるデータ点分布領域の識別方法及びその識別プログラム
|
JP5533196B2
(ja)
|
2010-04-27 |
2014-06-25 |
株式会社リコー |
座標平面におけるデータ点分布領域の識別方法及びその識別プログラム
|
US8903122B2
(en)
|
2013-03-15 |
2014-12-02 |
HGST Netherlands B.V. |
Verifying a slider tray map
|
US10318700B2
(en)
|
2017-09-05 |
2019-06-11 |
International Business Machines Corporation |
Modifying a manufacturing process of integrated circuits based on large scale quality performance prediction and optimization
|
CN107689335B
(zh)
*
|
2017-09-26 |
2019-12-17 |
华润微电子(重庆)有限公司 |
一种多种产品晶圆缺陷的分析方法
|
TWI805564B
(zh)
|
2018-01-25 |
2023-06-21 |
晶元光電股份有限公司 |
晶粒轉移方法及其裝置
|
US11454949B2
(en)
*
|
2018-03-28 |
2022-09-27 |
Kla Corporation |
Auto-correlation of wafer characterization data and generation of composite wafer metrics during semiconductor device fabrication
|
US11122680B2
(en)
*
|
2019-03-18 |
2021-09-14 |
International Business Machines Corporation |
Passive methods of loose die identification
|
CN115667915A
(zh)
|
2020-05-01 |
2023-01-31 |
Pdf决策公司 |
基于晶圆仓图的根本原因分析
|