KR920010863A - 반도체장치 - Google Patents
반도체장치 Download PDFInfo
- Publication number
- KR920010863A KR920010863A KR1019910020239A KR910020239A KR920010863A KR 920010863 A KR920010863 A KR 920010863A KR 1019910020239 A KR1019910020239 A KR 1019910020239A KR 910020239 A KR910020239 A KR 910020239A KR 920010863 A KR920010863 A KR 920010863A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor element
- lead
- semiconductor device
- semiconductor
- vias
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 실시예1의 리드프레임 평면도, 제2도(a)는 실시예1에 따른 수지밀봉형 반도체장치의 몰드수지를 투시한 평면도, 제2도(b)는 제2도(a)의 측면도, 제3도(a)는 실시예2의 리드프레임 평면도, 제3도(b)는 제3도(a)의 측면도.
Claims (1)
- 반도체소자(1)와, 이 반도체소자(1)의 주변에 배치되어 소자의 내부회로와 전기적으로 접속되는 리드(9) 및, 상기 반도체소자(1)에 형성된 본딩패드(2,3,4)와 상기 리드(9)를 전기적으로 접속하는 수단(11)을 구비한 반도체장치에 있어서, 상기 반도체소자(1) 주면에서 상기 반도체소자(1)내의 전원배선(20)에 복수장소에서 접속된 바이패스리드(100)를 갖춘 것을 특징으로 하는 반도체장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP90-307023 | 1990-11-15 | ||
JP2307023A JP2896223B2 (ja) | 1990-11-15 | 1990-11-15 | 樹脂封止型半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920010863A true KR920010863A (ko) | 1992-06-27 |
KR950014121B1 KR950014121B1 (ko) | 1995-11-21 |
Family
ID=17964099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910020239A KR950014121B1 (ko) | 1990-11-15 | 1991-11-14 | 반도체 장치 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0486027B1 (ko) |
JP (1) | JP2896223B2 (ko) |
KR (1) | KR950014121B1 (ko) |
DE (1) | DE69124198T2 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3048496B2 (ja) * | 1993-04-16 | 2000-06-05 | 株式会社東芝 | 半導体装置 |
US5592020A (en) * | 1993-04-16 | 1997-01-07 | Kabushiki Kaisha Toshiba | Semiconductor device with smaller package having leads with alternating offset projections |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59100550A (ja) * | 1982-11-30 | 1984-06-09 | Mitsubishi Electric Corp | 半導体装置 |
JPS61248456A (ja) * | 1985-04-25 | 1986-11-05 | Nec Corp | 混成集積回路装置及びそれに使用するリ−ドフレ−ム |
JPS6352457A (ja) * | 1986-08-22 | 1988-03-05 | Hitachi Ltd | 半導体装置 |
JPS63253635A (ja) * | 1987-04-10 | 1988-10-20 | Nec Ic Microcomput Syst Ltd | 半導体装置 |
JPH0754841B2 (ja) * | 1987-04-13 | 1995-06-07 | サンケン電気株式会社 | 絶縁物封止型回路装置 |
JPH077816B2 (ja) * | 1988-11-24 | 1995-01-30 | 株式会社東芝 | 半導体封止容器 |
-
1990
- 1990-11-15 JP JP2307023A patent/JP2896223B2/ja not_active Expired - Fee Related
-
1991
- 1991-11-14 DE DE69124198T patent/DE69124198T2/de not_active Expired - Fee Related
- 1991-11-14 KR KR1019910020239A patent/KR950014121B1/ko not_active IP Right Cessation
- 1991-11-14 EP EP91119460A patent/EP0486027B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69124198T2 (de) | 1997-05-28 |
EP0486027A3 (en) | 1993-02-24 |
JPH04180256A (ja) | 1992-06-26 |
EP0486027B1 (en) | 1997-01-15 |
KR950014121B1 (ko) | 1995-11-21 |
EP0486027A2 (en) | 1992-05-20 |
DE69124198D1 (de) | 1997-02-27 |
JP2896223B2 (ja) | 1999-05-31 |
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