KR910015018A - 액체소오스용기 - Google Patents
액체소오스용기 Download PDFInfo
- Publication number
- KR910015018A KR910015018A KR1019910000315A KR910000315A KR910015018A KR 910015018 A KR910015018 A KR 910015018A KR 1019910000315 A KR1019910000315 A KR 1019910000315A KR 910000315 A KR910000315 A KR 910000315A KR 910015018 A KR910015018 A KR 910015018A
- Authority
- KR
- South Korea
- Prior art keywords
- liquid source
- line
- liquid
- gas supply
- valves
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims description 14
- 238000010926 purge Methods 0.000 claims 3
- 238000007599 discharging Methods 0.000 claims 1
- 238000005086 pumping Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/2931—Diverse fluid containing pressure systems
- Y10T137/3115—Gas pressure storage over or displacement of liquid
- Y10T137/3127—With gas maintenance or application
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/4238—With cleaner, lubrication added to fluid or liquid sealing at valve interface
- Y10T137/4245—Cleaning or steam sterilizing
- Y10T137/4259—With separate material addition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- Loading And Unloading Of Fuel Tanks Or Ships (AREA)
- Jet Pumps And Other Pumps (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 액체소오스용기의 실시예를 나타낸 도면, 제2도는 제1도의 액체소오스용기 및 압송시스템을 나타낸 도면, 제3도는 본 발명의 과정에서 개발된 액체소오스용기를 나타낸 도면.
Claims (1)
- 액체소오스를 수용하는 액체소오스용기본체(17)와, 상기 액체소오스를 압송하기 위한 압송가스공급라인(18), 이 압송가스공급라인(18)에 설치된 제1 및 제2압송가스공급밸브(20,24), 상기 액체소오스를 토출하는 액체소오스토출라인(19), 이 액체소오스토출라인(19)에 설치된 제1 및 제2액체소오스토출밸브(21, 25), 제1 및 제2압송가스공급밸브(20,24)를 연결하는 압송가스공급라인(18)에 일단이 접속되고, 제1 및 제 2 액체소오스토출밸브(21, 25)를 연결하는 액체소오스토출라인(19)에 다른 단이 접속된 퍼어지라인(23) 및, 이 퍼어지라인(23)에 설치된 퍼어지밸브(22)를 구비한 것을 특징으로 하는 액체소오스용기.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP90-4337 | 1990-01-11 | ||
JP433790A JP2614338B2 (ja) | 1990-01-11 | 1990-01-11 | 液体ソース容器 |
JP02-004337 | 1990-01-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910015018A true KR910015018A (ko) | 1991-08-31 |
KR930007441B1 KR930007441B1 (ko) | 1993-08-10 |
Family
ID=11581628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910000315A KR930007441B1 (ko) | 1990-01-11 | 1991-01-11 | 액체소오스용기 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5069244A (ko) |
EP (1) | EP0437196B1 (ko) |
JP (1) | JP2614338B2 (ko) |
KR (1) | KR930007441B1 (ko) |
DE (1) | DE69113066T2 (ko) |
Families Citing this family (51)
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US5174323A (en) * | 1992-03-02 | 1992-12-29 | Kent Haselden | Liquid material reservoir |
GB9206552D0 (en) * | 1992-03-26 | 1992-05-06 | Epichem Ltd | Bubblers |
IT1257434B (it) * | 1992-12-04 | 1996-01-17 | Cselt Centro Studi Lab Telecom | Generatore di vapori per impianti di deposizione chimica da fase vapore |
US5449294A (en) * | 1993-03-26 | 1995-09-12 | Texas Instruments Incorporated | Multiple valve assembly and process |
IL108992A (en) * | 1993-03-29 | 1997-11-20 | Johnson & Johnson Vision Prod | Solution removal nozzle |
US6029717A (en) * | 1993-04-28 | 2000-02-29 | Advanced Delivery & Chemical Systems, Ltd. | High aspect ratio containers for ultrahigh purity chemicals |
US6260588B1 (en) | 1993-04-28 | 2001-07-17 | Advanced Technology Materials, Inc. | Bulk chemical delivery system |
US5964254A (en) * | 1997-07-11 | 1999-10-12 | Advanced Delivery & Chemical Systems, Ltd. | Delivery system and manifold |
US5607002A (en) * | 1993-04-28 | 1997-03-04 | Advanced Delivery & Chemical Systems, Inc. | Chemical refill system for high purity chemicals |
US6557593B2 (en) | 1993-04-28 | 2003-05-06 | Advanced Technology Materials, Inc. | Refillable ampule and method re same |
US5465766A (en) * | 1993-04-28 | 1995-11-14 | Advanced Delivery & Chemical Systems, Inc. | Chemical refill system for high purity chemicals |
US5878793A (en) * | 1993-04-28 | 1999-03-09 | Siegele; Stephen H. | Refillable ampule and method re same |
US5950693A (en) * | 1993-04-28 | 1999-09-14 | Advanced Delivery & Chemical Systems, Ltd. | Bulk chemical delivery system |
JP2813856B2 (ja) * | 1993-11-29 | 1998-10-22 | 日本エア・リキード株式会社 | シリンダ付ガス供給装置 |
US5582366A (en) * | 1995-01-19 | 1996-12-10 | Motorola, Inc. | Satellite fueling system and method therefor |
US5531240A (en) * | 1995-03-13 | 1996-07-02 | Kelada; Maher I. | Method and apparatus for spill free liquid transfer |
US5878767A (en) * | 1996-12-13 | 1999-03-09 | Novus International, Inc. | Fluid transfer system |
US6536460B1 (en) * | 1997-03-21 | 2003-03-25 | Advanced Micro Devices, Inc. | Process line purge system and method |
US6296026B1 (en) * | 1997-06-26 | 2001-10-02 | Advanced Technology Materials, Inc. | Chemical delivery system having purge system utilizing multiple purge techniques |
US6199599B1 (en) | 1997-07-11 | 2001-03-13 | Advanced Delivery & Chemical Systems Ltd. | Chemical delivery system having purge system utilizing multiple purge techniques |
US6435229B1 (en) | 1997-07-11 | 2002-08-20 | Advanced Technology Materials, Inc. | Bulk chemical delivery system |
US6296025B1 (en) | 1997-07-11 | 2001-10-02 | Advanced Technology Materials, Inc. | Chemical delivery system having purge system utilizing multiple purge techniques |
US6637475B2 (en) | 1997-07-11 | 2003-10-28 | Advanced Technology Materials, Inc. | Bulk chemical delivery system |
DE19735399C2 (de) * | 1997-08-14 | 2002-01-17 | Infineon Technologies Ag | Gasleitungssystem für einen Prozeßreaktor, insbesondere Vertikalofen, zur Behandlung von Wafern und Verfahren zur Behandlung von Wafern in einem Prozeßreaktor |
WO1999064780A1 (en) * | 1998-06-08 | 1999-12-16 | Advanced Delivery & Chemical Systems, Ltd. | Chemical delivery system having purge system utilizing multiple purge techniques |
JP2000205499A (ja) * | 1999-01-18 | 2000-07-25 | Air Liquide Japan Ltd | 液体供給装置及び液体供給装置におけるパ―ジ方法 |
US6293430B1 (en) | 1999-09-25 | 2001-09-25 | Odell Kent Haselden, Jr. | Apparatus and method for recovering beverage syrup |
US6837251B1 (en) * | 2000-06-21 | 2005-01-04 | Air Products And Chemicals, Inc. | Multiple contents container assembly for ultrapure solvent purging |
US6604555B2 (en) | 2000-08-04 | 2003-08-12 | Arch Specialty Chemicals, Inc. | Automatic refill system for ultra pure or contamination sensitive chemicals |
DE60130662T2 (de) | 2000-08-04 | 2008-07-17 | Fujifilm Electronic Materials Usa, Inc. | Automatisches auffüllsystem für hochreine oder kontaminationsempfindliche chemikalien |
EP1245527B1 (de) * | 2001-03-29 | 2002-11-06 | Cs Clean Systems Ag | Vorratsbehälter für flüssige, hochreine Substanzen mit einer Einrichtung zur Reinigung der Anschlussstücke und Rohrleitungen des Vorratsbehälters |
US7334708B2 (en) * | 2001-07-16 | 2008-02-26 | L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude | Integral blocks, chemical delivery systems and methods for delivering an ultrapure chemical |
US7077388B2 (en) * | 2002-07-19 | 2006-07-18 | Asm America, Inc. | Bubbler for substrate processing |
US6921062B2 (en) * | 2002-07-23 | 2005-07-26 | Advanced Technology Materials, Inc. | Vaporizer delivery ampoule |
JP2005131632A (ja) * | 2003-10-08 | 2005-05-26 | Adeka Engineering & Consutruction Co Ltd | 流体供給装置 |
US20060107898A1 (en) * | 2004-11-19 | 2006-05-25 | Blomberg Tom E | Method and apparatus for measuring consumption of reactants |
US7828004B2 (en) * | 2007-08-27 | 2010-11-09 | Rohde Uwe | Method and device for storing chemical products in a container |
US8158530B2 (en) * | 2008-09-10 | 2012-04-17 | Globalfoundries Inc. | Methods for retaining metal-comprising materials using liquid chemistry dispense systems from which oxygen has been removed |
US8151814B2 (en) * | 2009-01-13 | 2012-04-10 | Asm Japan K.K. | Method for controlling flow and concentration of liquid precursor |
US9598766B2 (en) * | 2012-05-27 | 2017-03-21 | Air Products And Chemicals, Inc. | Vessel with filter |
KR101497420B1 (ko) * | 2013-07-05 | 2015-03-03 | 삼성중공업 주식회사 | 증발가스 저감용 액화천연가스 수송장치 |
US20150259797A1 (en) * | 2014-03-17 | 2015-09-17 | Jiangsu Nata Opto-electronic Material Co., Ltd. | Liquid-Metal Organic Compound Supply System |
KR101585054B1 (ko) * | 2014-05-09 | 2016-01-14 | 한국생산기술연구원 | 액상 전구체 공급장치 |
US20180033614A1 (en) | 2016-07-27 | 2018-02-01 | Versum Materials Us, Llc | Compositions and Methods Using Same for Carbon Doped Silicon Containing Films |
US10822458B2 (en) | 2017-02-08 | 2020-11-03 | Versum Materials Us, Llc | Organoamino-functionalized linear and cyclic oligosiloxanes for deposition of silicon-containing films |
SG10201903201XA (en) | 2018-04-11 | 2019-11-28 | Versum Materials Us Llc | Organoamino-functionalized cyclic oligosiloxanes for deposition of silicon-containing films |
US20200071819A1 (en) | 2018-08-29 | 2020-03-05 | Versum Materials Us, Llc | Methods For Making Silicon Containing Films That Have High Carbon Content |
US10985010B2 (en) | 2018-08-29 | 2021-04-20 | Versum Materials Us, Llc | Methods for making silicon and nitrogen containing films |
CN112969818A (zh) | 2018-10-03 | 2021-06-15 | 弗萨姆材料美国有限责任公司 | 用于制备含硅和氮的膜的方法 |
US11649547B2 (en) | 2019-02-05 | 2023-05-16 | Versum Materials Us, Llc | Deposition of carbon doped silicon oxide |
KR20220163999A (ko) | 2020-04-02 | 2022-12-12 | 버슘머트리얼즈 유에스, 엘엘씨 | 실리콘 함유 필름의 증착을 위한 유기아미노-작용기화된 사이클릭 올리고실록산 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60244333A (ja) * | 1984-05-21 | 1985-12-04 | Sumitomo Electric Ind Ltd | 原料液補給装置 |
JP2585296B2 (ja) * | 1987-09-25 | 1997-02-26 | 株式会社東芝 | 有機金属熱分解法気相成長装置 |
JPH01156742U (ko) * | 1988-04-21 | 1989-10-27 | ||
US4941593A (en) * | 1989-01-11 | 1990-07-17 | Hicks Robert C | Cleaning system for beverage delivery conduits |
EP0382987A1 (en) * | 1989-02-13 | 1990-08-22 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Gas supplying apparatus |
-
1990
- 1990-01-11 JP JP433790A patent/JP2614338B2/ja not_active Expired - Lifetime
- 1990-12-28 US US07/635,655 patent/US5069244A/en not_active Expired - Lifetime
-
1991
- 1991-01-02 EP EP19910100041 patent/EP0437196B1/en not_active Expired - Lifetime
- 1991-01-02 DE DE69113066T patent/DE69113066T2/de not_active Expired - Fee Related
- 1991-01-11 KR KR1019910000315A patent/KR930007441B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH03208889A (ja) | 1991-09-12 |
EP0437196A1 (en) | 1991-07-17 |
DE69113066D1 (de) | 1995-10-26 |
EP0437196B1 (en) | 1995-09-20 |
JP2614338B2 (ja) | 1997-05-28 |
DE69113066T2 (de) | 1996-04-11 |
US5069244A (en) | 1991-12-03 |
KR930007441B1 (ko) | 1993-08-10 |
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Payment date: 20030801 Year of fee payment: 11 |
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