KR900017719A - 와이어 본딩 방법 - Google Patents

와이어 본딩 방법 Download PDF

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Publication number
KR900017719A
KR900017719A KR1019900006854A KR900006854A KR900017719A KR 900017719 A KR900017719 A KR 900017719A KR 1019900006854 A KR1019900006854 A KR 1019900006854A KR 900006854 A KR900006854 A KR 900006854A KR 900017719 A KR900017719 A KR 900017719A
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KR
South Korea
Prior art keywords
bonding method
wire bonding
fouling
wire
pushed
Prior art date
Application number
KR1019900006854A
Other languages
English (en)
Other versions
KR920007157B1 (ko
Inventor
요시미쓰 데라가도
노부도 야마자끼
Original Assignee
아라이 가즈오
가부시기가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아라이 가즈오, 가부시기가이샤 신가와 filed Critical 아라이 가즈오
Publication of KR900017719A publication Critical patent/KR900017719A/ko
Application granted granted Critical
Publication of KR920007157B1 publication Critical patent/KR920007157B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L21/607—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85203—Thermocompression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음

Description

와이어 본딩 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일실시예를 도시한 타이밍도, 제2도는 스크레이프(scrape) 동작의 일실시예를 도시한 설명도, 제3도는 와이어본더의 개략도.

Claims (1)

  1. 와이어를 투울로 본드면에 밀어붙여, 이 투울에 초음파진동을 인가하여 본딩하는 와이어 본딩 방법에 있어서 와이어를 본드면에 밀어 붙여서 투울에 초음파진동을 인가하고 있을때에 투울에 스크레이프 동작을 행하게 하여 본딩하는 것을 특징으로 하는 와이어본딩방법.
    ※ 참고사항 : 최초출원내용에 의하여 공개하는 것임.
KR1019900006854A 1989-05-15 1990-05-14 와이어 본딩방법 KR920007157B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-118599 1989-05-15
JP1118599A JP2530224B2 (ja) 1989-05-15 1989-05-15 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
KR900017719A true KR900017719A (ko) 1990-12-19
KR920007157B1 KR920007157B1 (ko) 1992-08-27

Family

ID=14740561

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900006854A KR920007157B1 (ko) 1989-05-15 1990-05-14 와이어 본딩방법

Country Status (3)

Country Link
US (1) US5024367A (ko)
JP (1) JP2530224B2 (ko)
KR (1) KR920007157B1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5586713A (en) * 1993-08-31 1996-12-24 Matsushita Electric Industrial Co., Ltd. Method for wire bonding
JP2000082717A (ja) * 1998-09-07 2000-03-21 Shinkawa Ltd ワイヤボンディング方法
US6199743B1 (en) * 1999-08-19 2001-03-13 Micron Technology, Inc. Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
US6221748B1 (en) 1999-08-19 2001-04-24 Micron Technology, Inc. Apparatus and method for providing mechanically pre-formed conductive leads
WO2001013431A1 (en) 1999-08-19 2001-02-22 Micron Technology, Inc. Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies
JP4467631B1 (ja) 2009-01-07 2010-05-26 株式会社新川 ワイヤボンディング方法
JP4595018B2 (ja) * 2009-02-23 2010-12-08 株式会社新川 半導体装置の製造方法およびボンディング装置
JP6688725B2 (ja) * 2016-12-26 2020-04-28 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6986561B2 (ja) * 2018-08-23 2021-12-22 株式会社カイジョー ワイヤボンディング方法及びワイヤボンディング装置
WO2020110199A1 (ja) * 2018-11-27 2020-06-04 オリンパス株式会社 ケーブル接続構造

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1179082B (de) * 1956-06-14 1964-10-01 Sonobond Corp Verfahren und Vorrichtung zum Verbinden metallischer Werkstuecke durch Kaltpressschweissen
US3125803A (en) * 1960-10-24 1964-03-24 Terminals
BE621898A (ko) * 1961-08-30 1900-01-01
US4140263A (en) * 1976-03-22 1979-02-20 Diepeveen John C Method for moving tool or the like
US4496095A (en) * 1983-04-12 1985-01-29 Fairchild Industries, Inc. Progressive ultrasonic welding system
JPS6070736A (ja) * 1983-09-27 1985-04-22 Toshiba Corp 半導体装置の組立方法およびその組立装置
US4614292A (en) * 1985-09-30 1986-09-30 Rca Corporation Die bonder with electrically driven scrubbing means
JPS63239834A (ja) * 1987-03-27 1988-10-05 Hitachi Ltd スクラブ機構
JPS63242479A (ja) * 1987-03-31 1988-10-07 Jiromaru Tsujino 複合振動を用いた超音波溶接方法およびその装置

Also Published As

Publication number Publication date
JP2530224B2 (ja) 1996-09-04
US5024367A (en) 1991-06-18
JPH02299249A (ja) 1990-12-11
KR920007157B1 (ko) 1992-08-27

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