KR890015451A - 전송회로 - Google Patents

전송회로 Download PDF

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Publication number
KR890015451A
KR890015451A KR1019890004331A KR890004331A KR890015451A KR 890015451 A KR890015451 A KR 890015451A KR 1019890004331 A KR1019890004331 A KR 1019890004331A KR 890004331 A KR890004331 A KR 890004331A KR 890015451 A KR890015451 A KR 890015451A
Authority
KR
South Korea
Prior art keywords
dielectric
transmission circuit
grooves
transmission
dielectric constant
Prior art date
Application number
KR1019890004331A
Other languages
English (en)
Other versions
KR940001606B1 (ko
Inventor
히로미 야즈모또
후지꼬 아끼바
Original Assignee
시마무라 미아까
가부시끼가이샤 중꼬오샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시마무라 미아까, 가부시끼가이샤 중꼬오샤 filed Critical 시마무라 미아까
Publication of KR890015451A publication Critical patent/KR890015451A/ko
Application granted granted Critical
Publication of KR940001606B1 publication Critical patent/KR940001606B1/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/16Dielectric waveguides, i.e. without a longitudinal conductor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001Manufacturing waveguides or transmission lines of the waveguide type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/08Coupling devices of the waveguide type for linking dissimilar lines or devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/024Dielectric details, e.g. changing the dielectric material around a transmission line
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0187Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0191Dielectric layers wherein the thickness of the dielectric plays an important role
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0388Other aspects of conductors
    • H05K2201/0394Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0707Shielding
    • H05K2201/0715Shielding provided by an outer layer of PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09645Patterning on via walls; Plural lands around one hole
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981Metallised walls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108Male die used for patterning, punching or transferring

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguides (AREA)

Abstract

내용 없음

Description

전송회로
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 제 1 실시예의 사시도, 제 2 도 및 제 3 도는 각각 압축부분 1A의 다른 예를 표시한 횡단면도.

Claims (3)

  1. 유전체(1)의 일부를 압축하는 것에 의하여 압축부분(1A)의 유전율을 비압축부분(1B)보다 높여 그 유전율을 높인 부분을 전자파의 전송부분으로 한 것을 특징으로 하는 전송회로.
  2. 유전체(1)의 표면에 요홈(2)을 형성하고, 그 요홈(2) 내부 또는, 그 근방에 그 요홈(2)에 따라가 적어도 2개의 전기 전도체(7)를 평행 또는, 서로 이간시켜 배설한 것을 특징으로 하는 전송회로.
  3. 유전체(1)의 표면에 요홈(2)을 형성하고, 그 요홈(2)내부에 그 유전체(1)보다 유전율이 높은 부재를 실시하여 전자파의 전송 부분으로 한 것을 특징으로 하는 전송회로.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890004331A 1988-03-31 1989-03-31 전송회로 KR940001606B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63076346A JP2700553B2 (ja) 1988-03-31 1988-03-31 伝送回路
JP???63-76346 1988-03-31
JP?63-76346 1988-03-31

Publications (2)

Publication Number Publication Date
KR890015451A true KR890015451A (ko) 1989-10-30
KR940001606B1 KR940001606B1 (ko) 1994-02-25

Family

ID=13602797

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890004331A KR940001606B1 (ko) 1988-03-31 1989-03-31 전송회로

Country Status (5)

Country Link
EP (1) EP0343771A1 (ko)
JP (1) JP2700553B2 (ko)
KR (1) KR940001606B1 (ko)
AU (1) AU3130389A (ko)
GB (1) GB2217114A (ko)

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JPH0254602A (ja) * 1988-08-19 1990-02-23 Junkosha Co Ltd 高周波伝送回路
US5381596A (en) * 1993-02-23 1995-01-17 E-Systems, Inc. Apparatus and method of manufacturing a 3-dimensional waveguide
JP3123293B2 (ja) * 1993-03-05 2001-01-09 株式会社村田製作所 非放射性誘電体線路およびその製造方法
NL9400165A (nl) * 1994-02-03 1995-09-01 Hollandse Signaalapparaten Bv Transmissielijnnetwerk.
JPH11500879A (ja) * 1995-02-23 1999-01-19 スーパーコンダクター・テクノロジーズ・インコーポレイテッド 高温超伝導体デバイスの電力処理能力を向上させる方法
US5889449A (en) * 1995-12-07 1999-03-30 Space Systems/Loral, Inc. Electromagnetic transmission line elements having a boundary between materials of high and low dielectric constants
JP2000312102A (ja) 1999-04-27 2000-11-07 Kyocera Corp 誘電体線路の接合構造及び非放射性誘電体線路
SE0101709D0 (sv) 2001-05-15 2001-05-15 Hesselbom Innovation & Dev Hb Transmissionsledning
US7061342B2 (en) 2001-12-28 2006-06-13 Molex Incorporated Differential transmission channel link for delivering high frequency signals and power
US6888427B2 (en) * 2003-01-13 2005-05-03 Xandex, Inc. Flex-circuit-based high speed transmission line
US6956445B2 (en) * 2003-02-19 2005-10-18 Electro-Tec Corp. Broadband high-frequency slip ring system
CN101174718B (zh) 2003-03-14 2012-01-04 莫莱克斯公司 具有底座形状的基本传输通道链路组
US7138170B2 (en) * 2003-04-28 2006-11-21 Eastman Kodak Company Terminated conductive patterned sheet utilizing conductive conduits
JP4142992B2 (ja) 2003-05-15 2008-09-03 株式会社フジクラ GHz帯伝送の伝送線路構造およびGHz帯伝送に用いるコネクタ
JP2007518311A (ja) * 2003-12-24 2007-07-05 モレックス インコーポレーテッド 三角整合伝送構造
EP1698217A1 (en) * 2003-12-24 2006-09-06 Molex Incorporated Electromagnetically shielded slot transmission line
KR100836967B1 (ko) * 2003-12-24 2008-06-10 몰렉스 인코포레이티드 다채널 도파관 구조물
EP1698015A1 (en) * 2003-12-24 2006-09-06 Molex Incorporated Slot transmission line patch connector
KR100751600B1 (ko) 2003-12-24 2007-08-22 몰렉스 인코포레이티드 변형 임피던스를 구비한 전송 라인
US7295024B2 (en) 2005-02-17 2007-11-13 Xandex, Inc. Contact signal blocks for transmission of high-speed signals
US8554136B2 (en) 2008-12-23 2013-10-08 Waveconnex, Inc. Tightly-coupled near-field communication-link connector-replacement chips
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WO2012174350A1 (en) 2011-06-15 2012-12-20 Waveconnex, Inc. Proximity sensing and distance measurement using ehf signals
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CN104145380B (zh) 2011-12-14 2017-09-29 基萨公司 提供触觉反馈的连接器
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JP6097974B2 (ja) * 2012-11-27 2017-03-22 矢崎総業株式会社 伝送路
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JPS5550702A (en) * 1978-10-06 1980-04-12 Mitsubishi Electric Corp Microstrip line
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JPS63174703U (ko) * 1986-11-28 1988-11-14

Also Published As

Publication number Publication date
EP0343771A1 (en) 1989-11-29
JPH01251902A (ja) 1989-10-06
GB2217114A (en) 1989-10-18
JP2700553B2 (ja) 1998-01-21
GB8905557D0 (en) 1989-04-19
AU3130389A (en) 1989-10-05
KR940001606B1 (ko) 1994-02-25

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