KR890015451A - 전송회로 - Google Patents
전송회로 Download PDFInfo
- Publication number
- KR890015451A KR890015451A KR1019890004331A KR890004331A KR890015451A KR 890015451 A KR890015451 A KR 890015451A KR 1019890004331 A KR1019890004331 A KR 1019890004331A KR 890004331 A KR890004331 A KR 890004331A KR 890015451 A KR890015451 A KR 890015451A
- Authority
- KR
- South Korea
- Prior art keywords
- dielectric
- transmission circuit
- grooves
- transmission
- dielectric constant
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/16—Dielectric waveguides, i.e. without a longitudinal conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguides (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 제 1 실시예의 사시도, 제 2 도 및 제 3 도는 각각 압축부분 1A의 다른 예를 표시한 횡단면도.
Claims (3)
- 유전체(1)의 일부를 압축하는 것에 의하여 압축부분(1A)의 유전율을 비압축부분(1B)보다 높여 그 유전율을 높인 부분을 전자파의 전송부분으로 한 것을 특징으로 하는 전송회로.
- 유전체(1)의 표면에 요홈(2)을 형성하고, 그 요홈(2) 내부 또는, 그 근방에 그 요홈(2)에 따라가 적어도 2개의 전기 전도체(7)를 평행 또는, 서로 이간시켜 배설한 것을 특징으로 하는 전송회로.
- 유전체(1)의 표면에 요홈(2)을 형성하고, 그 요홈(2)내부에 그 유전체(1)보다 유전율이 높은 부재를 실시하여 전자파의 전송 부분으로 한 것을 특징으로 하는 전송회로.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63076346A JP2700553B2 (ja) | 1988-03-31 | 1988-03-31 | 伝送回路 |
JP???63-76346 | 1988-03-31 | ||
JP?63-76346 | 1988-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890015451A true KR890015451A (ko) | 1989-10-30 |
KR940001606B1 KR940001606B1 (ko) | 1994-02-25 |
Family
ID=13602797
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890004331A KR940001606B1 (ko) | 1988-03-31 | 1989-03-31 | 전송회로 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0343771A1 (ko) |
JP (1) | JP2700553B2 (ko) |
KR (1) | KR940001606B1 (ko) |
AU (1) | AU3130389A (ko) |
GB (1) | GB2217114A (ko) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0254602A (ja) * | 1988-08-19 | 1990-02-23 | Junkosha Co Ltd | 高周波伝送回路 |
US5381596A (en) * | 1993-02-23 | 1995-01-17 | E-Systems, Inc. | Apparatus and method of manufacturing a 3-dimensional waveguide |
JP3123293B2 (ja) * | 1993-03-05 | 2001-01-09 | 株式会社村田製作所 | 非放射性誘電体線路およびその製造方法 |
NL9400165A (nl) * | 1994-02-03 | 1995-09-01 | Hollandse Signaalapparaten Bv | Transmissielijnnetwerk. |
JPH11500879A (ja) * | 1995-02-23 | 1999-01-19 | スーパーコンダクター・テクノロジーズ・インコーポレイテッド | 高温超伝導体デバイスの電力処理能力を向上させる方法 |
US5889449A (en) * | 1995-12-07 | 1999-03-30 | Space Systems/Loral, Inc. | Electromagnetic transmission line elements having a boundary between materials of high and low dielectric constants |
JP2000312102A (ja) | 1999-04-27 | 2000-11-07 | Kyocera Corp | 誘電体線路の接合構造及び非放射性誘電体線路 |
SE0101709D0 (sv) | 2001-05-15 | 2001-05-15 | Hesselbom Innovation & Dev Hb | Transmissionsledning |
US7061342B2 (en) | 2001-12-28 | 2006-06-13 | Molex Incorporated | Differential transmission channel link for delivering high frequency signals and power |
US6888427B2 (en) * | 2003-01-13 | 2005-05-03 | Xandex, Inc. | Flex-circuit-based high speed transmission line |
US6956445B2 (en) * | 2003-02-19 | 2005-10-18 | Electro-Tec Corp. | Broadband high-frequency slip ring system |
CN101174718B (zh) | 2003-03-14 | 2012-01-04 | 莫莱克斯公司 | 具有底座形状的基本传输通道链路组 |
US7138170B2 (en) * | 2003-04-28 | 2006-11-21 | Eastman Kodak Company | Terminated conductive patterned sheet utilizing conductive conduits |
JP4142992B2 (ja) | 2003-05-15 | 2008-09-03 | 株式会社フジクラ | GHz帯伝送の伝送線路構造およびGHz帯伝送に用いるコネクタ |
JP2007518311A (ja) * | 2003-12-24 | 2007-07-05 | モレックス インコーポレーテッド | 三角整合伝送構造 |
EP1698217A1 (en) * | 2003-12-24 | 2006-09-06 | Molex Incorporated | Electromagnetically shielded slot transmission line |
KR100836967B1 (ko) * | 2003-12-24 | 2008-06-10 | 몰렉스 인코포레이티드 | 다채널 도파관 구조물 |
EP1698015A1 (en) * | 2003-12-24 | 2006-09-06 | Molex Incorporated | Slot transmission line patch connector |
KR100751600B1 (ko) | 2003-12-24 | 2007-08-22 | 몰렉스 인코포레이티드 | 변형 임피던스를 구비한 전송 라인 |
US7295024B2 (en) | 2005-02-17 | 2007-11-13 | Xandex, Inc. | Contact signal blocks for transmission of high-speed signals |
US8554136B2 (en) | 2008-12-23 | 2013-10-08 | Waveconnex, Inc. | Tightly-coupled near-field communication-link connector-replacement chips |
US8006075B2 (en) | 2009-05-21 | 2011-08-23 | Oracle America, Inc. | Dynamically allocated store queue for a multithreaded processor |
WO2012129426A2 (en) | 2011-03-24 | 2012-09-27 | Waveconnex, Inc. | Integrated circuit with electromagnetic communication |
US8811526B2 (en) | 2011-05-31 | 2014-08-19 | Keyssa, Inc. | Delta modulated low power EHF communication link |
WO2012174350A1 (en) | 2011-06-15 | 2012-12-20 | Waveconnex, Inc. | Proximity sensing and distance measurement using ehf signals |
TWI562555B (en) | 2011-10-21 | 2016-12-11 | Keyssa Inc | Contactless signal splicing |
CN104145380B (zh) | 2011-12-14 | 2017-09-29 | 基萨公司 | 提供触觉反馈的连接器 |
EP2820554B1 (en) | 2012-03-02 | 2016-08-24 | Keyssa, Inc. | Systems and methods for duplex communication |
KR101776821B1 (ko) | 2012-03-28 | 2017-09-08 | 키사, 아이엔씨. | 기판 구조들을 이용하는 전자기 신호의 재지향 |
EP2839541A1 (en) | 2012-04-17 | 2015-02-25 | Keyssa, Inc. | Dielectric lens structures for interchip communication |
WO2014026089A1 (en) | 2012-08-10 | 2014-02-13 | Waveconnex, Inc. | Dielectric coupling systems for ehf communications |
WO2014043577A1 (en) | 2012-09-14 | 2014-03-20 | Waveconnex, Inc. | Wireless connections with virtual hysteresis |
JP6097974B2 (ja) * | 2012-11-27 | 2017-03-22 | 矢崎総業株式会社 | 伝送路 |
CN104937769B (zh) | 2012-12-17 | 2018-11-16 | 凯萨股份有限公司 | 模块化电子设备 |
WO2014149107A1 (en) | 2013-03-15 | 2014-09-25 | Waveconnex, Inc. | Ehf secure communication device |
TWI551093B (zh) | 2013-03-15 | 2016-09-21 | 奇沙公司 | 極高頻通訊晶片 |
JP6279977B2 (ja) * | 2014-06-02 | 2018-02-14 | モレックス エルエルシー | 導波体 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB655803A (en) * | 1948-08-30 | 1951-08-01 | Cossor Ltd A C | Improvements in and relating to transmission lines for radio-frequency electric oscillations |
BE512499A (ko) * | 1951-06-30 | |||
GB1301553A (ko) * | 1970-07-14 | 1972-12-29 | ||
US3659916A (en) * | 1970-07-28 | 1972-05-02 | Bell Telephone Labor Inc | Single-mode dielectric waveguide |
DE2504268A1 (de) * | 1975-02-01 | 1976-08-05 | Licentia Gmbh | Wellenleiter |
JPS5550702A (en) * | 1978-10-06 | 1980-04-12 | Mitsubishi Electric Corp | Microstrip line |
JPS55104805U (ko) * | 1979-01-17 | 1980-07-22 | ||
GB2109640B (en) * | 1981-10-02 | 1985-06-19 | Marconi Co Ltd | Waveguide construction |
JPS5840361B2 (ja) * | 1982-04-23 | 1983-09-05 | 日本電気株式会社 | 高周波回路装置 |
JPS61163704A (ja) * | 1985-01-16 | 1986-07-24 | Junkosha Co Ltd | 誘電体線路 |
JPH0770885B2 (ja) * | 1986-06-02 | 1995-07-31 | 富士通株式会社 | マイクロストリツプ線路 |
JPS63174703U (ko) * | 1986-11-28 | 1988-11-14 |
-
1988
- 1988-03-31 JP JP63076346A patent/JP2700553B2/ja not_active Expired - Fee Related
-
1989
- 1989-03-10 EP EP89302388A patent/EP0343771A1/en not_active Withdrawn
- 1989-03-10 GB GB8905557A patent/GB2217114A/en not_active Withdrawn
- 1989-03-14 AU AU31303/89A patent/AU3130389A/en not_active Abandoned
- 1989-03-31 KR KR1019890004331A patent/KR940001606B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0343771A1 (en) | 1989-11-29 |
JPH01251902A (ja) | 1989-10-06 |
GB2217114A (en) | 1989-10-18 |
JP2700553B2 (ja) | 1998-01-21 |
GB8905557D0 (en) | 1989-04-19 |
AU3130389A (en) | 1989-10-05 |
KR940001606B1 (ko) | 1994-02-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19971121 Year of fee payment: 5 |
|
LAPS | Lapse due to unpaid annual fee |