JPS56163120A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS56163120A
JPS56163120A JP6652480A JP6652480A JPS56163120A JP S56163120 A JPS56163120 A JP S56163120A JP 6652480 A JP6652480 A JP 6652480A JP 6652480 A JP6652480 A JP 6652480A JP S56163120 A JPS56163120 A JP S56163120A
Authority
JP
Japan
Prior art keywords
composition
prepared
ethylenically unsaturated
epoxy compound
reaction product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6652480A
Other languages
Japanese (ja)
Inventor
Akio Nishikawa
Goro Tanaka
Koji Fujisaki
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6652480A priority Critical patent/JPS56163120A/en
Publication of JPS56163120A publication Critical patent/JPS56163120A/en
Pending legal-status Critical Current

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Landscapes

  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: A composition having a low elasticity, a low coefficient of expansion, a high Tg and excellent moisture resistance, and being suitable, for example, as a sealing material for semiconductor device, prepared by mixing a polyfunctional epoxy compound, a fluoracarbon resin and a reaction producr between an ethylenically unsaturated dicarboxylic acid anhydride and a plyamine.
CONSTITUTION: Titled composition is prepared by mixisg (A) 100pts.wt. polyfunctional epoxy compound, (B) 5W100pts.wt. reaction product between (i) an ethylenically unsaturated dicarboxylic acid anhydride or its functional derivative, e.g., maleic acid, and (ii) a polyamine, e.g., aromatic diamine, (C) 1W100pts.wt. fluorocarbon resin and , if necessary, (D) an inorganic filler or the like. Reaction product (B) can be obtained by melting and reacting components (i) and (ii) at 90W200°C and a mol ratio of 0.05W0.5:1. The composition is cured by heating to 130W200°C.
USE: Adhesives, paints.
COPYRIGHT: (C)1981,JPO&Japio
JP6652480A 1980-05-21 1980-05-21 Epoxy resin composition Pending JPS56163120A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6652480A JPS56163120A (en) 1980-05-21 1980-05-21 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6652480A JPS56163120A (en) 1980-05-21 1980-05-21 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS56163120A true JPS56163120A (en) 1981-12-15

Family

ID=13318340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6652480A Pending JPS56163120A (en) 1980-05-21 1980-05-21 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS56163120A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4876298A (en) * 1987-06-03 1989-10-24 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition
JPH06317905A (en) * 1993-11-15 1994-11-15 Ibiden Co Ltd Photosensitive resin composition and printed circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431500A (en) * 1977-08-13 1979-03-08 Allied Chem Packing composition based on anhydride curable epoxy resin
JPS5512124A (en) * 1978-07-12 1980-01-28 Hitachi Ltd Thermosetting resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431500A (en) * 1977-08-13 1979-03-08 Allied Chem Packing composition based on anhydride curable epoxy resin
JPS5512124A (en) * 1978-07-12 1980-01-28 Hitachi Ltd Thermosetting resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4876298A (en) * 1987-06-03 1989-10-24 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition
JPH06317905A (en) * 1993-11-15 1994-11-15 Ibiden Co Ltd Photosensitive resin composition and printed circuit board

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