KR860005447A - 반도체 기억장치 - Google Patents

반도체 기억장치

Info

Publication number
KR860005447A
KR860005447A KR1019850008857A KR850008857A KR860005447A KR 860005447 A KR860005447 A KR 860005447A KR 1019850008857 A KR1019850008857 A KR 1019850008857A KR 850008857 A KR850008857 A KR 850008857A KR 860005447 A KR860005447 A KR 860005447A
Authority
KR
South Korea
Prior art keywords
semiconductor memory
semiconductor
memory
Prior art date
Application number
KR1019850008857A
Other languages
English (en)
Other versions
KR900000635B1 (ko
Inventor
시즈오 사다와
Original Assignee
가부시끼가이샤 도오시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 도오시바 filed Critical 가부시끼가이샤 도오시바
Publication of KR860005447A publication Critical patent/KR860005447A/ko
Application granted granted Critical
Publication of KR900000635B1 publication Critical patent/KR900000635B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/763Polycrystalline semiconductor regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40Capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/92Capacitors having potential barriers
    • H01L29/94Metal-insulator-semiconductors, e.g. MOS
    • H01L29/945Trench capacitors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/01Manufacture or treatment
    • H10B12/02Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03Making the capacitor or connections thereto
    • H10B12/038Making the capacitor or connections thereto the capacitor being in a trench in the substrate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/37DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
KR1019850008857A 1984-12-12 1985-11-27 반도체 기억장치 KR900000635B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59262207A JPS61140168A (ja) 1984-12-12 1984-12-12 半導体記憶装置
JP59-262207 1984-12-12

Publications (2)

Publication Number Publication Date
KR860005447A true KR860005447A (ko) 1986-07-23
KR900000635B1 KR900000635B1 (ko) 1990-02-01

Family

ID=17372561

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850008857A KR900000635B1 (ko) 1984-12-12 1985-11-27 반도체 기억장치

Country Status (3)

Country Link
JP (1) JPS61140168A (ko)
KR (1) KR900000635B1 (ko)
DE (1) DE3543937A1 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61184861A (ja) * 1985-02-12 1986-08-18 Matsushita Electronics Corp 半導体装置
JPS62120070A (ja) * 1985-11-20 1987-06-01 Toshiba Corp 半導体記憶装置
JP2767104B2 (ja) * 1987-03-30 1998-06-18 三菱電機株式会社 半導体装置の製造方法
JP2621181B2 (ja) * 1987-06-12 1997-06-18 日本電気株式会社 Mis型半導体記憶装置
JPH0262073A (ja) * 1988-08-26 1990-03-01 Mitsubishi Electric Corp 半導体記憶装置
JP2819520B2 (ja) * 1991-05-07 1998-10-30 インターナショナル・ビジネス・マシーンズ・コーポレイション Dramセル
JPH05175452A (ja) * 1991-12-25 1993-07-13 Mitsubishi Electric Corp 半導体記憶装置およびその製造方法
US6468855B2 (en) 1998-08-14 2002-10-22 Monolithic System Technology, Inc. Reduced topography DRAM cell fabricated using a modified logic process and method for operating same
US6573548B2 (en) * 1998-08-14 2003-06-03 Monolithic System Technology, Inc. DRAM cell having a capacitor structure fabricated partially in a cavity and method for operating same
WO2001073846A1 (en) * 2000-03-29 2001-10-04 Hitachi, Ltd. Semiconductor device
US6677633B2 (en) 2002-09-24 2004-01-13 Hitachi, Ltd. Semiconductor device
DE102004043858A1 (de) * 2004-09-10 2006-03-16 Infineon Technologies Ag Verfahren zur Herstellung einer Speicherzelle, einer Speicherzellenanordnung und Speicherzellenanordnung
US7323379B2 (en) 2005-02-03 2008-01-29 Mosys, Inc. Fabrication process for increased capacitance in an embedded DRAM memory
US7538371B2 (en) 2005-09-01 2009-05-26 United Microelectronics Corp. CMOS image sensor integrated with 1-T SRAM and fabrication method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4017885A (en) * 1973-10-25 1977-04-12 Texas Instruments Incorporated Large value capacitor
JPH0666436B2 (ja) * 1983-04-15 1994-08-24 株式会社日立製作所 半導体集積回路装置

Also Published As

Publication number Publication date
DE3543937A1 (de) 1986-06-12
JPS61140168A (ja) 1986-06-27
DE3543937C2 (ko) 1989-05-24
KR900000635B1 (ko) 1990-02-01

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Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20030130

Year of fee payment: 14

LAPS Lapse due to unpaid annual fee