KR20240021309A - 익스팬드 장치 - Google Patents

익스팬드 장치 Download PDF

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Publication number
KR20240021309A
KR20240021309A KR1020247001850A KR20247001850A KR20240021309A KR 20240021309 A KR20240021309 A KR 20240021309A KR 1020247001850 A KR1020247001850 A KR 1020247001850A KR 20247001850 A KR20247001850 A KR 20247001850A KR 20240021309 A KR20240021309 A KR 20240021309A
Authority
KR
South Korea
Prior art keywords
cold air
wafer
ring
unit
sheet member
Prior art date
Application number
KR1020247001850A
Other languages
English (en)
Korean (ko)
Inventor
요시쿠니 스즈키
Original Assignee
야마하하쓰도키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야마하하쓰도키 가부시키가이샤 filed Critical 야마하하쓰도키 가부시키가이샤
Publication of KR20240021309A publication Critical patent/KR20240021309A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Packaging Frangible Articles (AREA)
KR1020247001850A 2021-09-14 2021-09-14 익스팬드 장치 KR20240021309A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/033749 WO2023042263A1 (ja) 2021-09-14 2021-09-14 エキスパンド装置

Publications (1)

Publication Number Publication Date
KR20240021309A true KR20240021309A (ko) 2024-02-16

Family

ID=85601994

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247001850A KR20240021309A (ko) 2021-09-14 2021-09-14 익스팬드 장치

Country Status (5)

Country Link
JP (1) JPWO2023042263A1 (zh)
KR (1) KR20240021309A (zh)
CN (1) CN117981053A (zh)
TW (1) TWI828058B (zh)
WO (1) WO2023042263A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243101Y2 (zh) 1972-11-02 1977-09-30

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3657190B2 (ja) * 2000-11-13 2005-06-08 Ｎｅｃセミコンパッケージ・ソリューションズ株式会社 エキスパンド装置
JP5243101B2 (ja) * 2008-05-14 2013-07-24 株式会社ディスコ 破断装置
US10008405B2 (en) * 2012-12-26 2018-06-26 Hitachi Chemical Company, Ltd Expansion method, method for manufacturing semiconductor device, and semiconductor device
JP6298635B2 (ja) * 2014-01-10 2018-03-20 株式会社ディスコ 分割装置及び被加工物の分割方法
JP2016004832A (ja) * 2014-06-13 2016-01-12 株式会社ディスコ テープ拡張装置
JP2019029363A (ja) * 2017-07-25 2019-02-21 株式会社ディスコ 接着フィルムの破断方法
JP7030469B2 (ja) * 2017-10-02 2022-03-07 株式会社ディスコ テープ拡張装置及びテープ拡張方法
JP7030006B2 (ja) * 2018-04-12 2022-03-04 株式会社ディスコ 拡張方法及び拡張装置
JP7242130B2 (ja) * 2019-02-06 2023-03-20 株式会社ディスコ エキスパンド装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243101Y2 (zh) 1972-11-02 1977-09-30

Also Published As

Publication number Publication date
TWI828058B (zh) 2024-01-01
CN117981053A (zh) 2024-05-03
TW202312315A (zh) 2023-03-16
WO2023042263A1 (ja) 2023-03-23
JPWO2023042263A1 (zh) 2023-03-23

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