KR20230140504A - 점착제층, 적층 시트, 점착제 조성물 및 광반도체 장치 - Google Patents

점착제층, 적층 시트, 점착제 조성물 및 광반도체 장치 Download PDF

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Publication number
KR20230140504A
KR20230140504A KR1020230036373A KR20230036373A KR20230140504A KR 20230140504 A KR20230140504 A KR 20230140504A KR 1020230036373 A KR1020230036373 A KR 1020230036373A KR 20230036373 A KR20230036373 A KR 20230036373A KR 20230140504 A KR20230140504 A KR 20230140504A
Authority
KR
South Korea
Prior art keywords
layer
optical semiconductor
adhesive layer
meth
sealing
Prior art date
Application number
KR1020230036373A
Other languages
English (en)
Korean (ko)
Inventor
아츠시 야마모토
료코 아사이
슈헤이 후쿠토미
다케시 나카노
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20230140504A publication Critical patent/KR20230140504A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Adhesive Tapes (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
KR1020230036373A 2022-03-25 2023-03-21 점착제층, 적층 시트, 점착제 조성물 및 광반도체 장치 KR20230140504A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022049426 2022-03-25
JPJP-P-2022-049426 2022-03-25
JPJP-P-2022-162870 2022-10-11
JP2022162870A JP7289008B1 (ja) 2022-03-25 2022-10-11 粘着剤層、積層シート、粘着剤組成物、および光半導体装置

Publications (1)

Publication Number Publication Date
KR20230140504A true KR20230140504A (ko) 2023-10-06

Family

ID=86611061

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230036373A KR20230140504A (ko) 2022-03-25 2023-03-21 점착제층, 적층 시트, 점착제 조성물 및 광반도체 장치

Country Status (4)

Country Link
JP (1) JP7289008B1 (zh)
KR (1) KR20230140504A (zh)
CN (2) CN117801715A (zh)
TW (1) TW202409231A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7495003B1 (ja) 2023-08-23 2024-06-04 ａｒｔｉｅｎｃｅ株式会社 封止シート及び、樹脂組成物層を有するディスプレイ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11335639A (ja) 1998-03-26 1999-12-07 Tomoegawa Paper Co Ltd 電子ディスプレイ用貼着フィルム
JP2020164702A (ja) 2019-03-29 2020-10-08 リンテック株式会社 着色粘着シートおよび表示体
JP2021138825A (ja) 2020-03-04 2021-09-16 リンテック株式会社 粘着シート、バックライトユニットおよび表示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000096035A (ja) * 1998-09-25 2000-04-04 Sekisui Chem Co Ltd シーリング用シートもしくはテープ
JP4992280B2 (ja) * 2006-04-14 2012-08-08 ソニー株式会社 液晶表示装置
JP2010072453A (ja) * 2008-09-19 2010-04-02 Toppan Printing Co Ltd 光拡散部材、光学シート、バックライトユニット、ディスプレイ装置
JP7198009B2 (ja) * 2018-07-11 2022-12-28 リンテック株式会社 表示体の製造方法
JP6945090B1 (ja) * 2020-08-31 2021-10-06 日東電工株式会社 粘着シート、表示装置および積層体
JP2022157898A (ja) * 2021-03-31 2022-10-14 株式会社巴川製紙所 光学フィルム積層体、偏光板付光学フィルム積層体及びディスプレイ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11335639A (ja) 1998-03-26 1999-12-07 Tomoegawa Paper Co Ltd 電子ディスプレイ用貼着フィルム
JP2020164702A (ja) 2019-03-29 2020-10-08 リンテック株式会社 着色粘着シートおよび表示体
JP2021138825A (ja) 2020-03-04 2021-09-16 リンテック株式会社 粘着シート、バックライトユニットおよび表示装置

Also Published As

Publication number Publication date
JP2023143639A (ja) 2023-10-06
JP7289008B1 (ja) 2023-06-08
CN116254071A (zh) 2023-06-13
TW202409231A (zh) 2024-03-01
CN117801715A (zh) 2024-04-02

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