KR20230060444A - 페놀성 수산기 함유 수지 - Google Patents

페놀성 수산기 함유 수지 Download PDF

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Publication number: KR20230060444A
Authority: KR; South Korea
Prior art keywords: group; phenolic hydroxyl; structural unit; hydroxyl group; compound
Prior art date: 2021-10-27

Application number

KR1020220088066A

Other languages

English (en)

Korean (ko)

Inventor

히로히토 나가타

다케시 이베

Original Assignee

디아이씨 가부시끼가이샤

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2021-10-27

Filing date

2022-07-18

Publication date

2023-05-04

2022-07-18 Application filed by 디아이씨 가부시끼가이샤 filed Critical 디아이씨 가부시끼가이샤

2023-05-04 Publication of KR20230060444A publication Critical patent/KR20230060444A/ko

Links

229920005989 resin Polymers 0.000 title claims abstract description 108
239000011347 resin Substances 0.000 title claims abstract description 108
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 title claims abstract description 95
125000002887 hydroxy group Chemical group [H]O* 0.000 title claims abstract description 84
-1 phenol compound Chemical class 0.000 claims abstract description 65
239000011342 resin composition Substances 0.000 claims abstract description 58
239000003795 chemical substances by application Substances 0.000 claims abstract description 21
125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 20
238000000576 coating method Methods 0.000 claims description 26
239000011248 coating agent Substances 0.000 claims description 24
239000003504 photosensitizing agent Substances 0.000 claims description 24
150000001875 compounds Chemical class 0.000 claims description 23
239000000203 mixture Substances 0.000 claims description 20
125000003545 alkoxy group Chemical group 0.000 claims description 13
238000004519 manufacturing process Methods 0.000 claims description 12
150000002989 phenols Chemical class 0.000 claims description 12
239000000758 substrate Substances 0.000 claims description 12
230000015572 biosynthetic process Effects 0.000 claims description 11
125000001931 aliphatic group Chemical group 0.000 claims description 10
125000003118 aryl group Chemical group 0.000 claims description 10
WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical compound [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 claims description 9
239000007864 aqueous solution Substances 0.000 claims description 9
125000005843 halogen group Chemical group 0.000 claims description 7
239000005011 phenolic resin Substances 0.000 claims description 5
125000004093 cyano group Chemical group *C#N 0.000 claims description 4
125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 4
239000002253 acid Substances 0.000 claims description 3
125000003710 aryl alkyl group Chemical group 0.000 claims description 3
229910017053 inorganic salt Inorganic materials 0.000 claims description 2
QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical class [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 claims description 2
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 29
239000010408 film Substances 0.000 description 48
238000001723 curing Methods 0.000 description 25
238000000034 method Methods 0.000 description 21
239000002904 solvent Substances 0.000 description 17
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 15
239000003513 alkali Substances 0.000 description 15
RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 14
SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 14
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 12
CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 12
UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 12
238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 11
239000000243 solution Substances 0.000 description 11
238000006243 chemical reaction Methods 0.000 description 10
230000000052 comparative effect Effects 0.000 description 10
238000011161 development Methods 0.000 description 10
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
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125000004432 carbon atom Chemical group C* 0.000 description 9
LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
DYNFCHNNOHNJFG-UHFFFAOYSA-N 2-formylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C=O DYNFCHNNOHNJFG-UHFFFAOYSA-N 0.000 description 8
125000000217 alkyl group Chemical group 0.000 description 8
238000002156 mixing Methods 0.000 description 8
229920003986 novolac Polymers 0.000 description 8
QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 8
239000003960 organic solvent Substances 0.000 description 8
JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 8
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
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239000003377 acid catalyst Substances 0.000 description 6
238000010438 heat treatment Methods 0.000 description 6
239000011572 manganese Substances 0.000 description 6
239000000463 material Substances 0.000 description 6
238000005259 measurement Methods 0.000 description 6
239000000843 powder Substances 0.000 description 6
229910000030 sodium bicarbonate Inorganic materials 0.000 description 6
235000017557 sodium bicarbonate Nutrition 0.000 description 6
229910000029 sodium carbonate Inorganic materials 0.000 description 6
238000003786 synthesis reaction Methods 0.000 description 6
239000000654 additive Substances 0.000 description 5
150000003934 aromatic aldehydes Chemical class 0.000 description 5
238000004090 dissolution Methods 0.000 description 5
230000007613 environmental effect Effects 0.000 description 5
239000010410 layer Substances 0.000 description 5
125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
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GOUHYARYYWKXHS-UHFFFAOYSA-N 4-formylbenzoic acid Chemical compound OC(=O)C1=CC=C(C=O)C=C1 GOUHYARYYWKXHS-UHFFFAOYSA-N 0.000 description 4
101150022075 ADR1 gene Proteins 0.000 description 4
101100490566 Arabidopsis thaliana ADR2 gene Proteins 0.000 description 4
XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 4
IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
101100269260 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) ADH2 gene Proteins 0.000 description 4
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 4
IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 4
238000000206 photolithography Methods 0.000 description 4
LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 4
238000001226 reprecipitation Methods 0.000 description 4
230000035945 sensitivity Effects 0.000 description 4
229910052710 silicon Inorganic materials 0.000 description 4
239000010703 silicon Substances 0.000 description 4
238000003756 stirring Methods 0.000 description 4
YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 3
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ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 3
125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
125000002933 cyclohexyloxy group Chemical group C1(CCCCC1)O* 0.000 description 3
MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 3
125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
238000011156 evaluation Methods 0.000 description 3
239000000945 filler Substances 0.000 description 3
125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
125000003707 hexyloxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 3
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125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
125000004115 pentoxy group Chemical group [*]OC([H])([H])C([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 3
125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 3
229920001568 phenolic resin Polymers 0.000 description 3
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239000000049 pigment Substances 0.000 description 3
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125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
239000002994 raw material Substances 0.000 description 3
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125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
239000003921 oil Substances 0.000 description 1
235000006408 oxalic acid Nutrition 0.000 description 1
239000003973 paint Substances 0.000 description 1
SEVSMVUOKAMPDO-UHFFFAOYSA-N para-Acetoxybenzaldehyde Natural products CC(=O)OC1=CC=C(C=O)C=C1 SEVSMVUOKAMPDO-UHFFFAOYSA-N 0.000 description 1
229940044654 phenolsulfonic acid Drugs 0.000 description 1
229960005323 phenoxyethanol Drugs 0.000 description 1
125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
LSSGAGGYJWTEPQ-UHFFFAOYSA-N phenyl-(2,3,6-trihydroxyphenyl)methanone Chemical compound OC1=CC=C(O)C(C(=O)C=2C=CC=CC=2)=C1O LSSGAGGYJWTEPQ-UHFFFAOYSA-N 0.000 description 1
125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
230000036211 photosensitivity Effects 0.000 description 1
239000003880 polar aprotic solvent Substances 0.000 description 1
229920002312 polyamide-imide Polymers 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
238000006068 polycondensation reaction Methods 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920000573 polyethylene Polymers 0.000 description 1
229920001223 polyethylene glycol Polymers 0.000 description 1
229920000139 polyethylene terephthalate Polymers 0.000 description 1
239000005020 polyethylene terephthalate Substances 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
229920005862 polyol Polymers 0.000 description 1
229920001155 polypropylene Polymers 0.000 description 1
229920000166 polytrimethylene carbonate Polymers 0.000 description 1
238000012545 processing Methods 0.000 description 1
230000001737 promoting effect Effects 0.000 description 1
STNJZGLLOVUVMN-UHFFFAOYSA-N propan-2-yl 4-formylbenzoate Chemical compound CC(C)OC(=O)C1=CC=C(C=O)C=C1 STNJZGLLOVUVMN-UHFFFAOYSA-N 0.000 description 1
235000019260 propionic acid Nutrition 0.000 description 1
NSVFAQIEUHUHPQ-UHFFFAOYSA-N propyl 4-formylbenzoate Chemical compound CCCOC(=O)C1=CC=C(C=O)C=C1 NSVFAQIEUHUHPQ-UHFFFAOYSA-N 0.000 description 1
229940090181 propyl acetate Drugs 0.000 description 1
IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
230000035484 reaction time Effects 0.000 description 1
230000002829 reductive effect Effects 0.000 description 1
230000002441 reversible effect Effects 0.000 description 1
HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
229910010271 silicon carbide Inorganic materials 0.000 description 1
239000002356 single layer Substances 0.000 description 1
239000011343 solid material Substances 0.000 description 1
238000005507 spraying Methods 0.000 description 1
239000007858 starting material Substances 0.000 description 1
150000003460 sulfonic acids Chemical class 0.000 description 1
230000002194 synthesizing effect Effects 0.000 description 1
229920003002 synthetic resin Polymers 0.000 description 1
239000000057 synthetic resin Substances 0.000 description 1
KCNSDMPZCKLTQP-UHFFFAOYSA-N tetraphenylen-1-ol Chemical compound C12=CC=CC=C2C2=CC=CC=C2C2=CC=CC=C2C2=C1C=CC=C2O KCNSDMPZCKLTQP-UHFFFAOYSA-N 0.000 description 1
125000003944 tolyl group Chemical group 0.000 description 1
231100000331 toxic Toxicity 0.000 description 1
230000002588 toxic effect Effects 0.000 description 1
238000011282 treatment Methods 0.000 description 1
AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
229920006337 unsaturated polyester resin Polymers 0.000 description 1
229940005605 valeric acid Drugs 0.000 description 1
125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
229920002554 vinyl polymer Polymers 0.000 description 1
125000005023 xylyl group Chemical group 0.000 description 1
239000004246 zinc acetate Substances 0.000 description 1

Images

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/18—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenols substituted by carboxylic or sulfonic acid groups
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions

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Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
General Physics & Mathematics (AREA)
Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Materials For Photolithography (AREA)
Photosensitive Polymer And Photoresist Processing (AREA)
Phenolic Resins Or Amino Resins (AREA)

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JP (1)	JP2023065292A (zh)
KR (1)	KR20230060444A (zh)
CN (1)	CN116023607A (zh)
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2001114853A (ja)	1999-10-21	2001-04-24	Nippon Shokubai Co Ltd	カルボキシル基を有するノボラック型フェノール樹脂および該フェノール樹脂を用いたポジ型感光性樹脂組成物
JP2008112134A (ja)	2006-10-06	2008-05-15	Hitachi Chem Co Ltd	電極パターンの形成方法

2022
- 2022-06-28 JP JP2022103529A patent/JP2023065292A/ja active Pending
- 2022-07-18 KR KR1020220088066A patent/KR20230060444A/ko unknown
- 2022-10-25 TW TW111140369A patent/TW202330684A/zh unknown
- 2022-10-27 CN CN202211323239.3A patent/CN116023607A/zh active Pending

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2001114853A (ja)	1999-10-21	2001-04-24	Nippon Shokubai Co Ltd	カルボキシル基を有するノボラック型フェノール樹脂および該フェノール樹脂を用いたポジ型感光性樹脂組成物
JP2008112134A (ja)	2006-10-06	2008-05-15	Hitachi Chem Co Ltd	電極パターンの形成方法

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JP2023065292A (ja)	2023-05-12
CN116023607A (zh)	2023-04-28
TW202330684A (zh)	2023-08-01

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JP5988122B1 (ja)	2016-09-07	ナフトール型カリックスアレーン化合物及びその製造方法、感光性組成物、レジスト材料、並びに塗膜
TWI711655B (zh)	2020-12-01	含酚性羥基之樹脂及抗蝕劑膜
JPWO2015190233A1 (ja)	2017-04-20	永久膜用感光性組成物、レジスト材料、塗膜、及び永久膜用感光性組成物の製造方法
JP6025011B1 (ja)	2016-11-16	フェノール性水酸基含有化合物、これを含む組成物及びその硬化膜
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CN107848926B (zh)	2021-04-20	酚醛清漆型含酚性羟基树脂以及抗蚀膜
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JP2018083786A (ja)	2018-05-31	フェノール性水酸基含有化合物及びレジスト材料
TWI722135B (zh)	2021-03-21	酚醛清漆型樹脂及抗蝕劑材料
KR20230060444A (ko)	2023-05-04	페놀성 수산기 함유 수지
JP2009075436A (ja)	2009-04-09	フォトレジスト用樹脂組成物
KR20240112191A (ko)	2024-07-18	페놀성 수산기 함유 수지, 감광성 수지 조성물, 경화성 조성물 및 레지스트막
JP7380951B2 (ja)	2023-11-15	フェノール性水酸基含有樹脂
JP7318820B2 (ja)	2023-08-01	レジストパターンの製造方法、及びレジストパターン、並びに透明積層部材製造用ポジ型感光性樹脂組成物
JP6590085B2 (ja)	2019-10-16	フェノール性水酸基含有樹脂及びレジスト材料
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