KR20210133974A - 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판 - Google Patents

수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판 Download PDF

Info

Publication number
KR20210133974A
KR20210133974A KR1020217028420A KR20217028420A KR20210133974A KR 20210133974 A KR20210133974 A KR 20210133974A KR 1020217028420 A KR1020217028420 A KR 1020217028420A KR 20217028420 A KR20217028420 A KR 20217028420A KR 20210133974 A KR20210133974 A KR 20210133974A
Authority
KR
South Korea
Prior art keywords
resin composition
preferable
prepreg
group
mass
Prior art date
Application number
KR1020217028420A
Other languages
English (en)
Korean (ko)
Inventor
미카 스즈키
다카시 고바야시
게이이치 하세베
Original Assignee
미츠비시 가스 가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미츠비시 가스 가가쿠 가부시키가이샤 filed Critical 미츠비시 가스 가가쿠 가부시키가이샤
Publication of KR20210133974A publication Critical patent/KR20210133974A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36—Divinylbenzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/40—Imides, e.g. cyclic imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L35/06—Copolymers with vinyl aromatic monomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
KR1020217028420A 2019-02-28 2020-02-26 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판 KR20210133974A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019035457 2019-02-28
JPJP-P-2019-035457 2019-02-28
PCT/JP2020/007687 WO2020175538A1 (ja) 2019-02-28 2020-02-26 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板

Publications (1)

Publication Number Publication Date
KR20210133974A true KR20210133974A (ko) 2021-11-08

Family

ID=72239974

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217028420A KR20210133974A (ko) 2019-02-28 2020-02-26 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JPWO2020175538A1 (zh)
KR (1) KR20210133974A (zh)
CN (1) CN113490596A (zh)
TW (1) TW202039596A (zh)
WO (1) WO2020175538A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7190649B2 (ja) * 2018-04-27 2022-12-16 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
WO2022054867A1 (ja) * 2020-09-11 2022-03-17 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
KR20240019380A (ko) * 2021-08-25 2024-02-14 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 시트, 및 프린트 배선판
CN118019799A (zh) * 2021-09-27 2024-05-10 三菱瓦斯化学株式会社 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置
CN118019800A (zh) * 2021-09-27 2024-05-10 三菱瓦斯化学株式会社 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置
TW202317678A (zh) * 2021-09-30 2023-05-01 日商三菱瓦斯化學股份有限公司 預浸體、積層板、及印刷配線板
TW202342605A (zh) * 2022-03-11 2023-11-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置
TW202348646A (zh) * 2022-03-11 2023-12-16 日商三菱瓦斯化學股份有限公司 樹脂組成物、硬化物、預浸體、覆金屬箔疊層板、樹脂複合片、印刷配線板、及半導體裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010138364A (ja) 2008-02-12 2010-06-24 Mitsubishi Gas Chemical Co Inc 樹脂組成物、プリプレグおよび金属箔張り積層板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2013018A1 (en) * 1989-03-31 1990-09-30 Isao Kaneko Imide prepolymers, cured products, method for making, laminate preparation, and encapsulating compositions
JPH036293A (ja) * 1989-05-31 1991-01-11 Hitachi Chem Co Ltd 難燃性樹脂組成物及びプリプレグ
JP2002363232A (ja) * 2001-06-01 2002-12-18 Nof Corp 硬化性組成物、高分子絶縁材料、製造方法および基板
JP2007262191A (ja) * 2006-03-28 2007-10-11 Nippon Steel Chem Co Ltd 難燃硬化性樹脂組成物
US9455067B2 (en) * 2013-03-18 2016-09-27 Iteq Corporation Low dielectric materials
EP3216834B1 (en) * 2014-11-06 2019-06-12 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal-foil-clad laminated board, resin composite sheet, and printed circuit board
JP6580849B2 (ja) * 2015-03-30 2019-09-25 日鉄ケミカル＆マテリアル株式会社 末端変性可溶性多官能ビニル芳香族共重合体及びその製造方法
JP6589623B2 (ja) * 2015-12-24 2019-10-16 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、銅張積層板及びプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010138364A (ja) 2008-02-12 2010-06-24 Mitsubishi Gas Chemical Co Inc 樹脂組成物、プリプレグおよび金属箔張り積層板

Also Published As

Publication number Publication date
WO2020175538A1 (ja) 2020-09-03
TW202039596A (zh) 2020-11-01
JPWO2020175538A1 (zh) 2020-09-03
CN113490596A (zh) 2021-10-08

Similar Documents

Publication Publication Date Title
KR20210133974A (ko) 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판
JP7409369B2 (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板
KR101776560B1 (ko) 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및 프린트 배선판
CN107109049B (zh) 高频用热固性树脂组合物、利用其的预浸料、层叠片和印刷电路基板
JP4843944B2 (ja) 樹脂組成物並びにこれを用いたプリプレグ及び積層板
KR101920106B1 (ko) 프린트 배선판 재료용 수지 조성물, 그리고 그것을 사용한 프리프레그, 수지 시트, 금속박 피복 적층판 및 프린트 배선판
TW202003691A (zh) 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷配線板
TWI719382B (zh) 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂複合片、及印刷配線板
KR20210025526A (ko) 수지 조성물 및 그 응용
JP2016540851A (ja) 耐熱性及び低誘電損失特性を有する熱硬化性樹脂組成物、これを用いたプリプレグ及び銅張積層板
TWI706963B (zh) 可溶性多官能乙烯基芳香族共聚合物、其製造方法、硬化性組成物及其應用
CN115926426A (zh) 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片及印刷线路板
TW202010791A (zh) 硬化性組成物、預浸體、樹脂片、覆金屬箔疊層板以及印刷配線板
KR20180127301A (ko) 수지 조성물 및 다층 기판
JP2015189926A (ja) 硬化性樹脂組成物、その硬化物、複合材料
WO2023171553A1 (ja) 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2019065942A1 (ja) プリプレグ、並びに、それを用いた金属張積層板及び配線基板
KR20150068181A (ko) 저유전 손실 특성을 가진 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판
WO2022202346A1 (ja) 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
KR20160032075A (ko) 저유전 손실 특성을 가진 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 및 동박적층판
TWI713784B (zh) 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷電路板
JP3681170B2 (ja) 高周波用基板
KR20220011112A (ko) 수지 조성물, 프리프레그, 지지체가 형성된 레진 시트, 금속박 피복 적층판, 및 프린트 배선판
KR20170139032A (ko) 수지 조성물, 프리프레그, 금속박 피복 적층판, 수지 시트 및 프린트 배선판
CN118019802A (zh) 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板及半导体装置