KR20200041836A - 레이저 캡슐화 장치 및 캡슐화 방법 - Google Patents

레이저 캡슐화 장치 및 캡슐화 방법 Download PDF

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Publication number: KR20200041836A
Authority: KR; South Korea
Prior art keywords: section; light; encapsulation; laser; laser beam
Prior art date: 2017-06-20

Application number

KR1020197038733A

Other languages

English (en)

Korean (ko)

Inventor

케 란

야핑 게

Original Assignee

상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-06-20

Filing date

2018-06-19

Publication date

2020-04-22

2018-06-19 Application filed by 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드 filed Critical 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드

2020-04-22 Publication of KR20200041836A publication Critical patent/KR20200041836A/ko

Links

238000005538 encapsulation Methods 0.000 title claims abstract description 111
238000000034 method Methods 0.000 title claims abstract description 45
239000000758 substrate Substances 0.000 claims abstract description 37
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230000009467 reduction Effects 0.000 claims abstract description 6
238000007493 shaping process Methods 0.000 claims description 14
230000006866 deterioration Effects 0.000 claims description 13
238000003384 imaging method Methods 0.000 claims description 13
230000015556 catabolic process Effects 0.000 claims description 11
238000006731 degradation reaction Methods 0.000 claims description 11
230000001678 irradiating effect Effects 0.000 claims description 8
230000003287 optical effect Effects 0.000 claims description 6
239000011521 glass Substances 0.000 description 42
239000000463 material Substances 0.000 description 19
238000000465 moulding Methods 0.000 description 8
238000007789 sealing Methods 0.000 description 7
238000010586 diagram Methods 0.000 description 4
230000008569 process Effects 0.000 description 4
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
239000010410 layer Substances 0.000 description 3
239000001301 oxygen Substances 0.000 description 3
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239000005357 flat glass Substances 0.000 description 2
230000005693 optoelectronics Effects 0.000 description 2
239000012044 organic layer Substances 0.000 description 2
239000004065 semiconductor Substances 0.000 description 2
VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
238000013459 approach Methods 0.000 description 1
238000004364 calculation method Methods 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
239000007789 gas Substances 0.000 description 1
230000010354 integration Effects 0.000 description 1
238000004093 laser heating Methods 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
238000005259 measurement Methods 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000011160 research Methods 0.000 description 1
230000004044 response Effects 0.000 description 1
239000010409 thin film Substances 0.000 description 1
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Images

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/206—Laser sealing
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0732—Shaping the laser spot into a rectangular shape
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- H01L51/5246—
- H01L51/56—
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Engineering & Computer Science (AREA)
Plasma & Fusion (AREA)
Mechanical Engineering (AREA)
Electromagnetism (AREA)
Manufacturing & Machinery (AREA)
Laser Beam Processing (AREA)
Electroluminescent Light Sources (AREA)

KR1020197038733A 2017-06-20 2018-06-19 레이저 캡슐화 장치 및 캡슐화 방법 KR20200041836A (ko)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
CN201710470990.9		2017-06-20
CN201710470990.9A CN109093251B (zh)	2017-06-20	2017-06-20	一种激光封装装置及封装方法
PCT/CN2018/091756 WO2018233585A1 (zh)	2017-06-20	2018-06-19	一种激光封装装置及封装方法

Publications (1)

Publication Number	Publication Date
KR20200041836A true KR20200041836A (ko)	2020-04-22

Family

ID=64737443

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020197038733A KR20200041836A (ko)	2017-06-20	2018-06-19	레이저 캡슐화 장치 및 캡슐화 방법

Country Status (5)

Country	Link
JP (1)	JP6872042B2 (ja)
KR (1)	KR20200041836A (ja)
CN (1)	CN109093251B (ja)
TW (1)	TWI674691B (ja)
WO (1)	WO2018233585A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN108908995A (zh) *	2018-06-28	2018-11-30	胡智晶	一种生活垃圾压缩设备
TWI765337B (zh) *	2019-12-13	2022-05-21	旺矽科技股份有限公司	雷射晶片檢測方法及設備
CN111055018B (zh) *	2019-12-29	2020-11-17	中国科学院西安光学精密机械研究所	一种减阻微结构加工方法
CN112630984A (zh) *	2020-12-30	2021-04-09	南京理工大学	可改变激光焦点位置光斑大小及形貌的激光扫描装置与扫描方法
CN113843499A (zh) *	2021-09-10	2021-12-28	深圳市海目星激光智能装备股份有限公司	激光开膜方法及装置

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JP2668695B2 (ja) *	1988-02-19	1997-10-27	株式会社ニコン	ビーム平坦化装置
US5864430A (en) *	1996-09-10	1999-01-26	Sandia Corporation	Gaussian beam profile shaping apparatus, method therefor and evaluation thereof
US6884962B2 (en) *	2002-03-18	2005-04-26	Hitachi Via Mechanics, Ltd.	Beam or wave front
CN2847319Y (zh) *	2005-11-04	2006-12-13	北京工业大学	一种用于获得大面积均匀方形光斑的激光均束装置
CN100538438C (zh) *	2007-01-30	2009-09-09	深圳市大族激光科技股份有限公司	激光光场分布整形光学镜头
CN201373947Y (zh) *	2009-03-11	2009-12-30	深圳市大族激光科技股份有限公司	紫外激光光束整形装置
JP5567319B2 (ja) *	2009-11-25	2014-08-06	浜松ホトニクス株式会社	ガラス溶着方法及びガラス層定着方法
KR101243920B1 (ko) *	2010-01-07	2013-03-14	삼성디스플레이 주식회사	기판 밀봉에 사용되는 레이저 빔 조사 장치, 기판 밀봉 방법, 및 유기 발광 디스플레이 장치의 제조 방법
CN101826591B (zh) *	2010-04-23	2012-03-28	广东聚科照明股份有限公司	一种led封装工艺
KR102034252B1 (ko) *	2012-12-21	2019-10-21	삼성디스플레이 주식회사	레이저 빔 조사 장치 및 기판 밀봉 방법
CN103246067B (zh) *	2013-05-23	2015-04-15	上海交通大学	高斯激光束整形为能量均匀分布的矩形光束的方法及应用
CN104795511A (zh) *	2014-01-20	2015-07-22	上海微电子装备有限公司	一种激光封装设备及其封装方法
CN105023880A (zh) *	2014-04-15	2015-11-04	上海微电子装备有限公司	玻璃封装体的密封装置
CN105226204A (zh) *	2014-05-30	2016-01-06	上海微电子装备有限公司	一种激光封装设备及封装方法
CN105336877B (zh) *	2014-07-29	2018-01-26	上海微电子装备（集团）股份有限公司	激光扫描密封玻璃封装体的***和方法
CN204154995U (zh) *	2014-10-24	2015-02-11	北京润和微光科技有限公司	一种激光光斑形状调整装置
CN106159112B (zh) *	2015-03-26	2017-12-29	上海微电子装备（集团）股份有限公司	一种激光封装设备
CN106199782B (zh) *	2016-09-13	2019-08-02	山东镭泽智能科技有限公司	用于激光高斯光束整形的单非球面透镜
CN106449439B (zh) *	2016-09-27	2018-11-02	华中科技大学	一种玻璃芯片封装方法

2017
- 2017-06-20 CN CN201710470990.9A patent/CN109093251B/zh active Active
2018
- 2018-06-19 JP JP2019568058A patent/JP6872042B2/ja active Active
- 2018-06-19 KR KR1020197038733A patent/KR20200041836A/ko not_active Application Discontinuation
- 2018-06-19 WO PCT/CN2018/091756 patent/WO2018233585A1/zh active Application Filing
- 2018-06-20 TW TW107121066A patent/TWI674691B/zh active

Also Published As

Publication number	Publication date
JP2020524400A (ja)	2020-08-13
CN109093251A (zh)	2018-12-28
TWI674691B (zh)	2019-10-11
CN109093251B (zh)	2020-08-04
WO2018233585A1 (zh)	2018-12-27
TW201906213A (zh)	2019-02-01
JP6872042B2 (ja)	2021-05-19

Legal Events

Date	Code	Title	Description
2021-06-28	E902	Notification of reason for refusal
2022-01-03	E601	Decision to refuse application

Publication	Publication Date	Title
KR20200041836A (ko)	2020-04-22	레이저 캡슐화 장치 및 캡슐화 방법
JP5323843B2 (ja)	2013-10-23	可変レーザビームによるフリット封止
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US10515832B2 (en)	2019-12-24	Laser processing apparatus and method for manufacturing the same
KR101267220B1 (ko)	2013-05-24	레이저를 이용한 마스크 제조방법
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CN103943648A (zh)	2014-07-23	显示装置及其封装方法
JP2017056469A (ja)	2017-03-23	レーザ加工方法及びレーザ加工装置
US9096042B2 (en)	2015-08-04	Lighting apparatus
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US9201245B2 (en)	2015-12-01	Optical system and substrate sealing method
CN104761132B (zh)	2017-05-31	一种双光束耦合的激光辅助玻璃料封装***和方法
KR102366996B1 (ko)	2022-02-24	제한된 시각적 접근성에 의한 웨이퍼 정렬
US11664476B2 (en)	2023-05-30	LED surface modification with ultraviolet laser
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KR101606674B1 (ko)	2016-03-25	Ｌｅｄ 패키지의 봉지재 에칭 시스템
Kuna et al.	2012	Femtosecond laser processing as a versatile tool for advanced solid state lighting sources: From efficacy enhancement to colour temperature control
KR101543605B1 (ko)	2015-08-11	레이저를 이용한 프릿 실링장치
US20110080926A1 (en)	2011-04-07	Laser irradiation system