CN109093251B - 一种激光封装装置及封装方法 - Google Patents

一种激光封装装置及封装方法 Download PDF

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Publication number
CN109093251B
CN109093251B CN201710470990.9A CN201710470990A CN109093251B CN 109093251 B CN109093251 B CN 109093251B CN 201710470990 A CN201710470990 A CN 201710470990A CN 109093251 B CN109093251 B CN 109093251B
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China
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section
laser
light
laser beam
light spot
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CN201710470990.9A
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English (en)
Chinese (zh)
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CN109093251A (zh
Inventor
蓝科
戈亚萍
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Shanghai Micro Electronics Equipment Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
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Application filed by Shanghai Micro Electronics Equipment Co Ltd filed Critical Shanghai Micro Electronics Equipment Co Ltd
Priority to CN201710470990.9A priority Critical patent/CN109093251B/zh
Priority to PCT/CN2018/091756 priority patent/WO2018233585A1/zh
Priority to KR1020197038733A priority patent/KR20200041836A/ko
Priority to JP2019568058A priority patent/JP6872042B2/ja
Priority to TW107121066A priority patent/TWI674691B/zh
Publication of CN109093251A publication Critical patent/CN109093251A/zh
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Publication of CN109093251B publication Critical patent/CN109093251B/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/206—Laser sealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Electroluminescent Light Sources (AREA)
CN201710470990.9A 2017-06-20 2017-06-20 一种激光封装装置及封装方法 Active CN109093251B (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201710470990.9A CN109093251B (zh) 2017-06-20 2017-06-20 一种激光封装装置及封装方法
PCT/CN2018/091756 WO2018233585A1 (zh) 2017-06-20 2018-06-19 一种激光封装装置及封装方法
KR1020197038733A KR20200041836A (ko) 2017-06-20 2018-06-19 레이저 캡슐화 장치 및 캡슐화 방법
JP2019568058A JP6872042B2 (ja) 2017-06-20 2018-06-19 レーザーパッケージング装置及びパッケージング方法
TW107121066A TWI674691B (zh) 2017-06-20 2018-06-20 一種雷射封裝裝置及封裝方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710470990.9A CN109093251B (zh) 2017-06-20 2017-06-20 一种激光封装装置及封装方法

Publications (2)

Publication Number Publication Date
CN109093251A CN109093251A (zh) 2018-12-28
CN109093251B true CN109093251B (zh) 2020-08-04

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JP (1) JP6872042B2 (ja)
KR (1) KR20200041836A (ja)
CN (1) CN109093251B (ja)
TW (1) TWI674691B (ja)
WO (1) WO2018233585A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108908995A (zh) * 2018-06-28 2018-11-30 胡智晶 一种生活垃圾压缩设备
TWI765337B (zh) * 2019-12-13 2022-05-21 旺矽科技股份有限公司 雷射晶片檢測方法及設備
CN111055018B (zh) * 2019-12-29 2020-11-17 中国科学院西安光学精密机械研究所 一种减阻微结构加工方法
CN112630984A (zh) * 2020-12-30 2021-04-09 南京理工大学 可改变激光焦点位置光斑大小及形貌的激光扫描装置与扫描方法
CN113843499A (zh) * 2021-09-10 2021-12-28 深圳市海目星激光智能装备股份有限公司 激光开膜方法及装置

Citations (11)

* Cited by examiner, † Cited by third party
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US20030179452A1 (en) * 2002-03-18 2003-09-25 Lizotte Todd E. Beam or wave front
CN2847319Y (zh) * 2005-11-04 2006-12-13 北京工业大学 一种用于获得大面积均匀方形光斑的激光均束装置
CN101236303A (zh) * 2007-01-30 2008-08-06 深圳市大族激光科技股份有限公司 激光光场分布整形光学镜头
CN201373947Y (zh) * 2009-03-11 2009-12-30 深圳市大族激光科技股份有限公司 紫外激光光束整形装置
CN101826591A (zh) * 2010-04-23 2010-09-08 江门市低碳照明科技有限公司 一种led封装工艺
CN103246067A (zh) * 2013-05-23 2013-08-14 上海交通大学 高斯激光束整形为能量均匀分布的矩形光束的方法及应用
CN204154995U (zh) * 2014-10-24 2015-02-11 北京润和微光科技有限公司 一种激光光斑形状调整装置
CN104795511A (zh) * 2014-01-20 2015-07-22 上海微电子装备有限公司 一种激光封装设备及其封装方法
CN105226204A (zh) * 2014-05-30 2016-01-06 上海微电子装备有限公司 一种激光封装设备及封装方法
CN106199782A (zh) * 2016-09-13 2016-12-07 山东镭泽智能科技有限公司 用于激光高斯光束整形的单非球面透镜
CN106449439A (zh) * 2016-09-27 2017-02-22 华中科技大学 一种玻璃芯片封装方法

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JP2668695B2 (ja) * 1988-02-19 1997-10-27 株式会社ニコン ビーム平坦化装置
US5864430A (en) * 1996-09-10 1999-01-26 Sandia Corporation Gaussian beam profile shaping apparatus, method therefor and evaluation thereof
JP5567319B2 (ja) * 2009-11-25 2014-08-06 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
KR101243920B1 (ko) * 2010-01-07 2013-03-14 삼성디스플레이 주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치, 기판 밀봉 방법, 및 유기 발광 디스플레이 장치의 제조 방법
KR102034252B1 (ko) * 2012-12-21 2019-10-21 삼성디스플레이 주식회사 레이저 빔 조사 장치 및 기판 밀봉 방법
CN105023880A (zh) * 2014-04-15 2015-11-04 上海微电子装备有限公司 玻璃封装体的密封装置
CN105336877B (zh) * 2014-07-29 2018-01-26 上海微电子装备（集团）股份有限公司 激光扫描密封玻璃封装体的***和方法
CN106159112B (zh) * 2015-03-26 2017-12-29 上海微电子装备（集团）股份有限公司 一种激光封装设备

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030179452A1 (en) * 2002-03-18 2003-09-25 Lizotte Todd E. Beam or wave front
CN2847319Y (zh) * 2005-11-04 2006-12-13 北京工业大学 一种用于获得大面积均匀方形光斑的激光均束装置
CN101236303A (zh) * 2007-01-30 2008-08-06 深圳市大族激光科技股份有限公司 激光光场分布整形光学镜头
CN201373947Y (zh) * 2009-03-11 2009-12-30 深圳市大族激光科技股份有限公司 紫外激光光束整形装置
CN101826591A (zh) * 2010-04-23 2010-09-08 江门市低碳照明科技有限公司 一种led封装工艺
CN103246067A (zh) * 2013-05-23 2013-08-14 上海交通大学 高斯激光束整形为能量均匀分布的矩形光束的方法及应用
CN104795511A (zh) * 2014-01-20 2015-07-22 上海微电子装备有限公司 一种激光封装设备及其封装方法
CN105226204A (zh) * 2014-05-30 2016-01-06 上海微电子装备有限公司 一种激光封装设备及封装方法
CN204154995U (zh) * 2014-10-24 2015-02-11 北京润和微光科技有限公司 一种激光光斑形状调整装置
CN106199782A (zh) * 2016-09-13 2016-12-07 山东镭泽智能科技有限公司 用于激光高斯光束整形的单非球面透镜
CN106449439A (zh) * 2016-09-27 2017-02-22 华中科技大学 一种玻璃芯片封装方法

Also Published As

Publication number Publication date
JP2020524400A (ja) 2020-08-13
CN109093251A (zh) 2018-12-28
TWI674691B (zh) 2019-10-11
WO2018233585A1 (zh) 2018-12-27
KR20200041836A (ko) 2020-04-22
TW201906213A (zh) 2019-02-01
JP6872042B2 (ja) 2021-05-19

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