KR20190112636A - 연마용 조성물 - Google Patents

연마용 조성물 Download PDF

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Publication number
KR20190112636A
KR20190112636A KR1020190021860A KR20190021860A KR20190112636A KR 20190112636 A KR20190112636 A KR 20190112636A KR 1020190021860 A KR1020190021860 A KR 1020190021860A KR 20190021860 A KR20190021860 A KR 20190021860A KR 20190112636 A KR20190112636 A KR 20190112636A
Authority
KR
South Korea
Prior art keywords
polishing
group
acid
polishing composition
formula
Prior art date
Application number
KR1020190021860A
Other languages
English (en)
Korean (ko)
Inventor
도시오 시노다
아야 니시무라
Original Assignee
가부시키가이샤 후지미인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 후지미인코퍼레이티드 filed Critical 가부시키가이샤 후지미인코퍼레이티드
Publication of KR20190112636A publication Critical patent/KR20190112636A/ko

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1409Abrasive particles per se
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR1020190021860A 2018-03-26 2019-02-25 연마용 조성물 KR20190112636A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-058603 2018-03-26
JP2018058603A JP7128005B2 (ja) 2018-03-26 2018-03-26 研磨用組成物

Publications (1)

Publication Number Publication Date
KR20190112636A true KR20190112636A (ko) 2019-10-07

Family

ID=68108497

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190021860A KR20190112636A (ko) 2018-03-26 2019-02-25 연마용 조성물

Country Status (3)

Country Link
JP (1) JP7128005B2 (ja)
KR (1) KR20190112636A (ja)
TW (1) TWI779169B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202120637A (zh) * 2019-11-15 2021-06-01 日商Jsr股份有限公司 化學機械研磨用組成物以及化學機械研磨方法
TWI743989B (zh) * 2019-11-15 2021-10-21 日商Jsr股份有限公司 化學機械研磨用組成物以及化學機械研磨方法
TWI755060B (zh) * 2019-11-15 2022-02-11 日商Jsr股份有限公司 化學機械研磨用組成物以及化學機械研磨方法
TWI747479B (zh) * 2019-11-15 2021-11-21 日商Jsr股份有限公司 化學機械研磨用組成物以及化學機械研磨方法
JP2021080441A (ja) * 2019-11-20 2021-05-27 株式会社フジミインコーポレーテッド 研磨組成物、研磨方法および基板の製造方法
CN117561143A (zh) 2021-06-01 2024-02-13 信越半导体株式会社 双面抛光方法及双面抛光硅晶圆

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011216581A (ja) 2010-03-31 2011-10-27 Fujifilm Corp 研磨液及び研磨方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003176479A (ja) 2001-09-27 2003-06-24 Sanyo Chem Ind Ltd Cmpプロセス用研磨組成物
US7931714B2 (en) 2007-10-08 2011-04-26 Uwiz Technology Co., Ltd. Composition useful to chemical mechanical planarization of metal
JP2009099819A (ja) 2007-10-18 2009-05-07 Daicel Chem Ind Ltd Cmp用研磨組成物及び該cmp用研磨組成物を使用したデバイスウェハの製造方法
WO2009096495A1 (ja) 2008-02-01 2009-08-06 Fujimi Incorporated 研磨用組成物及びそれを用いた研磨方法
JP5695367B2 (ja) 2010-08-23 2015-04-01 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
US9640407B2 (en) * 2011-06-14 2017-05-02 Fujimi Incorporated Polishing composition
JP2017114966A (ja) 2015-12-22 2017-06-29 Jsr株式会社 化学機械研磨用組成物およびそれを用いた化学機械研磨方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011216581A (ja) 2010-03-31 2011-10-27 Fujifilm Corp 研磨液及び研磨方法

Also Published As

Publication number Publication date
JP2019169687A (ja) 2019-10-03
JP7128005B2 (ja) 2022-08-30
TWI779169B (zh) 2022-10-01
TW201940646A (zh) 2019-10-16

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