KR20130029560A - Backlight unit and liquid crystal display device having the same - Google Patents

Backlight unit and liquid crystal display device having the same Download PDF

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Publication number
KR20130029560A
KR20130029560A KR1020110092888A KR20110092888A KR20130029560A KR 20130029560 A KR20130029560 A KR 20130029560A KR 1020110092888 A KR1020110092888 A KR 1020110092888A KR 20110092888 A KR20110092888 A KR 20110092888A KR 20130029560 A KR20130029560 A KR 20130029560A
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KR
South Korea
Prior art keywords
light emitting
circuit board
printed circuit
light
liquid crystal
Prior art date
Application number
KR1020110092888A
Other languages
Korean (ko)
Inventor
김동휘
임기성
강용빈
Original Assignee
엘지디스플레이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 엘지디스플레이 주식회사 filed Critical 엘지디스플레이 주식회사
Priority to KR1020110092888A priority Critical patent/KR20130029560A/en
Publication of KR20130029560A publication Critical patent/KR20130029560A/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)

Abstract

PURPOSE: A backlight unit and a liquid crystal display including the same are provided to reduce an area for arranging a light source. CONSTITUTION: Filling grooves are formed in an area of a printed circuit board(151) and LED(Light Emitting Diode) packages(150). First and second optical sheets(131,132) condense or diffuse the light of a light source. A light guide plate(140) changes the light to surface illuminant. The light emitting package is buried in the filling groove of the printed circuit board.

Description

Backlight unit and liquid crystal display device having the same {Backlight Unit and Liquid Crystal Display Device having the same}

The present invention relates to a backlight unit and a liquid crystal display device having the same.

Liquid crystal display is a flat panel display that displays images using liquid crystal. It is thin, light, and has low power consumption compared to other display devices. It is used.

Such a liquid crystal display device includes a liquid crystal display panel for displaying an image and a backlight unit for supplying light to the liquid crystal display panel.

The liquid crystal display is classified into an edge type and a direct type according to the shape of the light source. The edge type backlight unit includes a light guide plate on a rear surface of the liquid crystal display panel, and a light source is disposed at a side of the light guide plate to supply a surface light source to the liquid crystal display panel. The direct type backlight unit is applied to a large liquid crystal display device of 12 inches or more, and arranges a plurality of light sources on a rear surface of the liquid crystal display panel, and supplies light emitted from the plurality of light sources to the front liquid crystal display panel.

As the light source of the backlight unit, EL (Electro Luminescence), CCFL (Cold Cathode Fluorescent Lamp), HCFL (Hot Cathode Fluorescent Lamp), and a light emitting diode (LED) are used. Recently, a light emitting diode having excellent light efficiency and high color reproducibility has been used as a light source of a backlight unit. The light source may be a package light source consisting of red, green, and blue light emitting diodes, or a white light emitting diode light source.

The light source using the light emitting diode is formed by forming an insulating film on a metal base substrate, and then forming power wirings on the insulating film, and connecting the lead frame and the power wiring of the light emitting package in which the light emitting diode is mounted.

As such, the metal base substrate on which the light emitting package is formed is disposed at a position corresponding to at least one side surface of the light guide plate. Since the light emitting package is formed on the metal base substrate, the area where the light emitting package is formed is greater than the thickness of the base substrate and the thickness of the light emitting package. Should be

As such, when the space in which the light emitting package is disposed becomes wider, the width of the corresponding bezel area becomes wider, making it difficult to implement a liquid crystal display device having a light and thin shape.

In addition, the heat dissipation of the light emitting package in which the light emitting diodes are mounted is performed through a heat dissipation plate disposed on the rear surface of the base substrate, and there is a distance as much as the thickness of the base substrate between the light emitting package and the heat dissipation plate, which makes it difficult to easily dissipate heat.

As described above, when the heat dissipation characteristics of the light emitting package are lowered, the lifespan of the light emitting diode is shortened and the brightness is lowered.

The present invention, by forming a buried groove in the printed circuit board on which the light emitting package is mounted, and by mounting the light emitting package in the buried groove, it is possible to reduce the light source arrangement area of the backlight unit as much as the thickness of the light emitting package to implement a light and thin shortened It is an object of the present invention to provide a backlight unit and a liquid crystal display device having the same.

In addition, the present invention, by embedding the light emitting package on the printed circuit board, thereby reducing the distance between the light emitting package and the heat sink disposed on the back of the printed circuit board to improve the heat dissipation characteristics and a liquid crystal display device having the same There is another purpose to provide.

The backlight unit of the present invention for solving the above problems of the prior art, the light emitting package for generating light; A printed circuit board having a plurality of buried grooves formed in areas corresponding to the light emitting packages; A first optical sheet and a second optical sheet for condensing and diffusing the light source, and a light guide plate for converting light generated from the light source into a surface light source, wherein the light emitting package is embedded in a buried groove of the printed circuit board, The upper surface of the light emitting package and one side of the printed circuit board may form the same plane.

In addition, the liquid crystal display device of the present invention, a liquid crystal display panel; And a backlight unit for supplying light to the liquid crystal display panel, wherein the backlight unit comprises: light emitting packages generating light; A printed circuit board having a plurality of buried grooves formed in areas corresponding to the light emitting packages; A first optical sheet and a second optical sheet for condensing and diffusing the light source, and a light guide plate for converting light generated from the light source into a surface light source, wherein the light emitting package is embedded in a buried groove of the printed circuit board, The upper surface of the light emitting package and one side of the printed circuit board may form the same plane.

According to the present invention, by forming a buried groove in a printed circuit board on which the light emitting package is mounted, and mounting the light emitting package in the buried groove, the light source arrangement area of the backlight unit as much as the thickness of the light emitting package can be reduced, thereby achieving light and short reduction. There is.

In addition, the present invention has the effect of improving the heat dissipation characteristics by reducing the distance between the light emitting package and the heat sink disposed on the back of the printed circuit board by embedding the light emitting package on the printed circuit board.

1 is an exploded perspective view of a liquid crystal display according to the present invention.
2 is a view illustrating a printed circuit board on which light emitting packages are mounted in the backlight unit of the present invention.
3 is a cross-sectional view taken along line II-II ′ of FIG. 2.
4 is an assembled cross-sectional view taken along the line II ′ of FIG. 1.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view of a liquid crystal display according to the present invention, and FIG. 4 is an assembled cross-sectional view taken along the line II ′ of FIG. 1.

1 and 4, the liquid crystal display of the present invention includes a liquid crystal display panel 110 and a backlight unit 120 that provides a surface light source to the liquid crystal display panel 110.

The liquid crystal display panel 110 includes an upper substrate 110a including red and green (RGB) color filter layers, and a lower substrate 110b including a thin film transistor (TFT) and a pixel electrode interposed therebetween. It is structured to be put together.

A gate driving circuit (not shown) for supplying a scan signal to a gate line and a data driving circuit (not shown) for supplying a data signal to a data line are provided at an edge of the liquid crystal display panel 110.

The gate and data driving circuit are electrically connected to the liquid crystal display panel 110 by a chip on film (COF). Here, the COF may be changed to a TCP (Tape Carrier Package).

In addition, the backlight unit 120 may include a light emitting diode package 150 including red (R), green (G), and blue (B) light emitting diodes (LEDs) or white (W) light emitting diodes (LEDs). A light emitting package), a printed circuit board 151 having a plurality of power patterns formed thereon to supply power to the light emitting package 150, and a light source supplied from the light emitting package 150 to a surface light source. A light guide plate 140, a reflector plate 180 disposed on the rear surface of the light guide plate 140 to improve light efficiency, and first and second optical sheets disposed in front (upper side) of the light guide plate 180 to condense and diffuse. 131 and 132, a lower cover 190 for receiving the light emitting package 150, the printed circuit board 151, the light guide plate 140, the reflecting plate 180, and the first and second optical sheets 131 and 132. ). Although shown in the figure, 191, which is not described, is a heat sink.

Here, the first optical sheet 131 functions as a prism sheet for condensing the surface light source supplied from the light guide plate 140, and the second optical sheet 132 is combined with the first optical sheet 131 to guide the light guide plate ( 140 to diffuse the surface light source supplied from.

The liquid crystal display panel 110 and the backlight unit 120 are integrally coupled to each other while the support main 115, the lower cover 190, and the upper cover 115 are assembled.

The printed circuit board 151 provided in the backlight unit 120 of the present invention has a plurality of buried grooves G in which the light emitting package 150 is buried. As shown in FIG. 4, the light emitting package 150 is completely embedded in the buried groove G formed in the printed circuit board 151, so that the upper surface of the light emitting package 150 and one of the printed circuit board 151 are provided. The sides are coplanar.

Therefore, in the present invention, the light source generating region of the backlight unit 120 has the width of the thickness of the printed circuit board 151, so that the assembly width d1 of the light source is reduced than before.

That is, in the prior art, the light emitting package 150 is mounted on the printed circuit board 151 and has a light source width that is equal to the sum of the thicknesses of the light emitting package 150 and the printed circuit board 151. The light emitting package 150 is embedded in the buried groove (G) of the printed circuit board 151 to reduce the width.

In addition, in the present invention, since the light emitting package 150 does not protrude on the printed circuit board 151, the non-light emitting area (the area where the light source is disposed) is reduced to the distance between the light guide plate 140 and the printed circuit board 151. .

As a result, the bezel width d2 disposed to block light leakage generated along the edge of the conventional liquid crystal display panel 110 can be reduced, so that the liquid crystal display device can be manufactured with light and small size.

In addition, since the light emitting package 150 is mounted in the buried groove G of the printed circuit board 151, the distance from the heat dissipation plate 191 attached to the rear surface of the printed circuit board 151 is closer, thereby improving heat dissipation characteristics.

According to the present invention, by forming a buried groove in the printed circuit board on which the light emitting package is mounted, and mounting the light emitting package in the buried groove, the light source arrangement area of the backlight unit as much as the thickness of the light emitting package can be reduced, thereby achieving a light and thin shortening. There is.

2 is a view illustrating a printed circuit board on which light emitting packages are mounted in the backlight unit of the present invention, and FIG. 3 is a cross-sectional view taken along the line II-II 'of FIG. 2.

2 and 3, the light emitting package 150 used as the light source of the backlight unit of the present invention is mounted on a printed circuit board 151 formed of a metal, and a plurality of buried on the printed circuit board 151. Since the grooves are formed, the light emitting package 150 does not protrude above the printed circuit board 151.

That is, the upper surface of the light emitting package 150 and one side of the printed circuit board 151 form the same plane.

The light emitting package 150 includes a base substrate 250, a light emitting diode 261 mounted on the base substrate 250, and first and second leads formed at both edges of the base substrate 250. Frames 220a and 220b. In addition, a wall 260 formed around the light emitting diode 261 and a mold layer 224 formed on the light emitting diode 261 inside the wall 260 are further formed on the base substrate 250. Include. Although shown in the figure, 214, which is not described, is a wire.

In addition, a first insulating film 201 is formed on one side of the printed circuit board 151, and power wirings 210 are formed on the first insulating film 201. In addition, the second insulating layer 202 is formed in a region where the light emitting package 150 is not mounted, so that the power wirings 210 are not exposed to the outside.

The printed circuit board 151 may be formed of any one of metals such as aluminum (Al), copper (Cu), stainless steel, and magnesium (Mg). In addition, the power wirings 210 may be formed of any one of copper (Cu), aluminum (Al), silver (Ag), gold (Au), nickel (Ni), platinum (Pt), and tungsten (W). Can be.

In the present invention, a plurality of buried grooves are formed on the printed circuit board 151, and the light emitting package 150 is mounted in the buried grooves. The first insulating film 201 and the power wiring 210 are also formed inside the buried groove, so that the first and second lead frames 220a and 220b of the light emitting package 150 are powered by solder 300. It is electrically connected to the wirings 210.

The method of forming the buried groove on the printed circuit board 151 may use a method by die casting injection molding. That is, after the metal is injected into the mold mold in which the groove corresponding to the buried groove is formed, it may be formed by molding. However, this is only one embodiment, and any known method for forming a groove in a metal substrate may be applied.

As shown in the drawing, the buried depth of the printed circuit board 151 has a plane in which the wall 260 of the light emitting package 150, the upper part of the mold layer 224, and one side of the printed circuit board 151 are the same. It can be set to a depth that can be achieved.

According to the present invention, by forming a buried groove in a printed circuit board on which the light emitting package is mounted, and mounting the light emitting package in the buried groove, the light source arrangement area of the backlight unit as much as the thickness of the light emitting package can be reduced, thereby achieving light and short reduction. There is.

In addition, the present invention has the effect of improving the heat dissipation characteristics by reducing the distance between the light emitting package and the heat sink disposed on the back of the printed circuit board by embedding the light emitting package on the printed circuit board.

110: liquid crystal display panel 120: backlight unit
115: support main 150: light emitting package
151: printed circuit board 131: first optical sheet
132: second optical sheet 261: light emitting diode
260: month 224: mold layer
300: solder 210: power wiring

Claims (7)

Light emitting packages for generating light;
A printed circuit board having a plurality of buried grooves formed in areas corresponding to the light emitting packages;
A first optical sheet and a second optical sheet for condensing and diffusing the light source;
It includes a light guide plate for converting the light generated from the light source into a surface light source,
And the light emitting package is embedded in the recess of the printed circuit board, and the upper surface of the light emitting package and one side of the printed circuit board form the same plane.
The backlight unit of claim 1, wherein the first and second lead frames of the light emitting package are electrically connected to power wires formed inside the buried groove of the printed circuit board.
The backlight unit of claim 2, wherein the printed circuit board has first and second insulating layers formed therebetween with the power lines therebetween.
A liquid crystal display panel; And
It includes a backlight unit for supplying light to the liquid crystal display panel,
The backlight unit includes:
Light emitting packages for generating light;
A printed circuit board having a plurality of buried grooves formed in areas corresponding to the light emitting packages;
A first optical sheet and a second optical sheet for condensing and diffusing the light source;
It includes a light guide plate for converting the light generated from the light source into a surface light source,
And the light emitting package is embedded in the recess of the printed circuit board, and an upper surface of the light emitting package and one side of the printed circuit board form the same plane.
5. The liquid crystal display of claim 4, wherein the first and second lead frames of the light emitting package are electrically connected to power lines formed inside the buried groove of the printed circuit board. 6.
6. The liquid crystal display of claim 5, wherein the printed circuit board has first and second insulating layers formed therebetween with the power lines therebetween.
The liquid crystal display of claim 4, wherein a heat sink is further formed on a rear surface of the printed circuit board.
KR1020110092888A 2011-09-15 2011-09-15 Backlight unit and liquid crystal display device having the same KR20130029560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110092888A KR20130029560A (en) 2011-09-15 2011-09-15 Backlight unit and liquid crystal display device having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110092888A KR20130029560A (en) 2011-09-15 2011-09-15 Backlight unit and liquid crystal display device having the same

Publications (1)

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KR20130029560A true KR20130029560A (en) 2013-03-25

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107632459A (en) * 2017-10-13 2018-01-26 惠州市华星光电技术有限公司 Liquid crystal display and its backlight module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107632459A (en) * 2017-10-13 2018-01-26 惠州市华星光电技术有限公司 Liquid crystal display and its backlight module
WO2019071700A1 (en) * 2017-10-13 2019-04-18 惠州市华星光电技术有限公司 Liquid crystal display and backlight module thereof

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