KR20120063947A - Coating apparatus and method of fabricating liquid crystal display device using the same - Google Patents

Abstract

The coating liquid coating apparatus of the present invention and the manufacturing method of the liquid crystal display device using the same have a ratio to the coating liquid by coating Teflon after processing the nozzle side and the lower surface of the slit coater flat. In order to improve the coating uniformity by increasing the adhesiveness to prevent contamination of the nozzle and increasing the width of the lower surface of the nozzle, a slit coater and a slit coater for applying a coating liquid such as photoresist to a substrate in a predetermined direction In the coating liquid applying apparatus including a drive unit for moving, the slit coater is composed of a nozzle body including the nozzle, the inlet and the discharge port, the side and the lower surface of the nozzle is processed to be teflon coated It features.

Description

COATING APPARATUS AND METHOD OF FABRICATING LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating liquid coating device, and more particularly, to a coating liquid such as a photoresist, a developing solution, a color filter, or the like on a surface of an object such as a flat panel display (FPD) substrate or a semiconductor wafer. It relates to a coating liquid coating apparatus and a manufacturing method of a liquid crystal display device using the same.

The manufacturing process of a flat panel display device or a semiconductor device includes a thin film deposition process, a photolithography process for exposing a selected region of the thin film, and an etching process for removing the thin film of the selected region. A coating process for forming a photoresist film of a photosensitive material on a wafer and an exposure and development process for patterning the pattern using a mask having a predetermined pattern formed thereon.

In general, a spray coating method, a roll coating method, or a spin coating method is used for the coating process of forming a photoresist film on a substrate or a wafer.

In the case of the spray coating method and the roll coating method, the spin coating method is used for forming a high precision pattern because the coating film is not suitable for high precision in adjusting the uniformity and film thickness of the coating film.

Hereinafter, a spin coater used in the spin coating method will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view showing the structure of a general spin coater.

As shown in the figure, the spin coater not only surrounds the spin chuck 5 and the spin chuck 5 connected to the rotation shaft 6 from the outside, but also opens and closes a cover 7. ) And a nozzle 4 positioned above the spin chuck 5 and moving into the cover 7 when the cover 70 is opened.

The spin chuck 5 is mounted with the workpiece 10 to which the photoresist is applied, and a drain valve (not shown) is disposed below the cover 7 to discharge the photoresist falling downward. .

The spin coater constructed as described above sprays a photoresist on the surface of the workpiece 10, which is first lowered by the nozzle 4 and seated on the spin chuck 5, in order to form a coating film on the predetermined workpiece 10. Done.

When the photoresist is sprayed onto the workpiece 10, the cover 7 is sealed and the motor M rotates, and the rotating shaft 6 connected thereto rotates to mount the workpiece 10 on the workpiece 10. The spin chuck 5 is rotated at a predetermined rotational speed.

When the spin chuck 5 rotates, the photoresist sprayed on the upper surface of the object 10 is spread outward by centrifugal force so that the photoresist is applied to the entire surface of the object 10.

When the photoresist is applied to the entire surface of the workpiece 10 as described above, the photoresist is solidified and then exposed and developed using a photo mask to form a predetermined pattern on the surface of the workpiece 10.

However, the spin coating method using the spin coater is suitable for coating a photosensitive material on a small workpiece such as a wafer, and has a large and heavy substrate for a flat panel display device (for example, a liquid crystal display). It is not suitable for coating photosensitive material on panel glass substrate).

The spin coating method has a problem that waste of photoresist is severe because there is too much amount discarded compared to the amount of photoresist used for coating. That is, a large amount of photoresist applied to the surface of the substrate is scattered out of the spin chuck during high speed rotation. Substantially more photoresist is wasted than the photoresist used for photosensitization.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and provides a coating liquid coating device capable of uniformly applying a coating liquid, such as a photoresist, a developing solution, a color filter, to a large area substrate, and a method of manufacturing a liquid crystal display device using the same. The purpose is to.

Another object of the present invention is to provide a coating liquid applying apparatus and a method of manufacturing a liquid crystal display device using the same, which prevents contamination of a nozzle and enhances durability.

Other objects and features of the present invention will be described in the configuration and claims of the invention described below.

In order to achieve the above object, the coating liquid coating apparatus of the present invention is a coating liquid coating apparatus comprising a slit coater for applying a coating liquid such as photoresist to a substrate and a drive unit for moving the slit coater in a predetermined direction. The slit coater is composed of a nozzle body including an nozzle, an inlet and an outlet, and the side and bottom surfaces of the nozzle are flat, and then Teflon is coated.

At this time, the coating solution is characterized in that it comprises a photoresist, a developer or a color filter.

Side surface and the bottom surface of the nozzle is characterized in that the surface roughness is improved to about 0.1㎛, 0.025㎛ and 0.1㎛ in the maximum height (Rmax), arithmetic mean roughness (Ra) and 10-point average roughness (Rz), respectively.

One width of the lower surface of the nozzle is characterized in that about 60㎛ ~ 80㎛.

A method of manufacturing a liquid crystal display device of the present invention includes the steps of providing a first substrate and a second substrate; Providing a slit coater comprising a nozzle body including a nozzle, an inlet and an outlet; Forming a color filter layer by slit coating a color filter on the surface of the first substrate using the slit coater, and then rotating a first substrate coated with the color filter using a spin chuck; And bonding the first substrate and the second substrate to each other.

At this time, the step of providing the slit coater is a step of flattening the side and the bottom surface of the nozzle; And coating Teflon on the side and bottom surfaces of the flatly processed nozzle.

The forming of the color filter layer may include: slit coating a color filter on the surface of the first substrate using the slit coater; Rotating the first substrate coated with the color filter using a spin chuck; And exposing and developing the color filter to form a color filter layer.

The step of providing the slit coater is characterized in that the processing of one width of the nozzle lower surface of about 60㎛ ~ 80㎛.

The side and bottom surfaces of the nozzle may be flattened to be about 0.1 μm, 0.025 μm, and 0.1 μm at the maximum height Rmax, arithmetic mean roughness Ra, and ten-point average roughness Rz, respectively.

As described above, the coating liquid applying apparatus and the manufacturing method of the liquid crystal display device using the same according to the present invention provide the effect of improving the yield and productivity by securing the coating uniformity.

The coating liquid coating apparatus and the method of manufacturing the liquid crystal display device using the same according to the present invention provide an effect of improving the yield by preventing the contamination of the nozzle by increasing the non-adhesion to the coating liquid on the nozzle side and the lower surface. In addition, by preventing contamination of the nozzle, the maintenance time of the slit coater is reduced while the durability of the nozzle is strengthened, thereby providing an effect of increasing productivity as the number of nozzle repairs is reduced.

1 is a cross-sectional view showing the structure of a typical spin coater.
2A and 2B are perspective views illustrating a basic concept of a slit coater and a photosensitive material applied by the slit coater.
3 is a cross-sectional view illustrating a phenomenon in which a photosensitive material adheres to a nozzle surface of a slit coater.
4A and 4B show non-tackiness of liquid according to the roughness of the nozzle face;
5 is a cross-sectional view schematically showing a coating liquid applying apparatus according to an embodiment of the present invention.
Figure 6 is a perspective view schematically showing a slit coater according to an embodiment of the present invention.
7 is a cross-sectional view schematically showing a slit coater according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the coating liquid coating apparatus and a method of manufacturing a liquid crystal display device using the same according to the present invention.

In general, in the semiconductor manufacturing field and flat panel display device manufacturing field, a photolithography process is required as described above in order to pattern a thin film performing a specific function, for example, an oxide thin film, a metal thin film, or a semiconductor thin film, into a desired shape. Photolithography processes use photosensitive materials such as photoresists that chemically react with light.

At this time, the photosensitive material should be formed in a very uniform thickness on the substrate on which the thin film is formed so that no defect occurs during the process. For example, when the photosensitive material is formed thicker than the specified thickness, the desired portion of the thin film is not etched, and when the photosensitive material is formed thinner than the specified thickness, the thin film is etched more than the desired etching amount. .

In particular, the application of the uniform photosensitive material is one of the very important factors in the current trend of increasing the size of the substrate as the substrate for a flat panel display device, especially the liquid crystal display panel, becomes larger.

In order to solve the above problem, a nozzle method of spraying a predetermined photosensitive material using a nozzle without using a spinner like a conventional spin chuck has been proposed. Since the nozzle-type coating liquid coating device does not use a spinner, the photosensitive material is injected through a spinless coater or a slit and thus is called a slit coater. The slit coater is suitable for applying a photosensitive material to a large liquid crystal display panel by supplying the photosensitive material through a slit-shaped nozzle longer than its width to apply a photosensitive material to the surface of the substrate in the form of a surface.

2A and 2B are perspective views illustrating a basic concept of a slit coater and a photosensitive material applied by the slit coater.

As shown in the figure, the slit coater 140 of the present invention includes a nozzle 142 having a narrow width and a long length, and supplies a photoresist 145 through the nozzle 142 to provide a substrate ( 110, the photoresist 145 is coated on the surface.

That is, the slit coater 140 is a device for applying a predetermined amount of photoresist 145 to the substrate 110 through a bar-shaped long nozzle 142, the other side from one side of the substrate 110 By applying a predetermined amount of photoresist 145 through the fine nozzle 142 while moving at a constant speed, it is possible to form a uniform photoresist film on the surface of the substrate 110.

In addition, the slit coater 140 can apply the photoresist 145 only to the surface of the desired substrate 110, there is an advantage that the coating liquid can be used more wasteless than the above-described spin coater, the surface shape of the long width It is possible to apply the coating liquid, which is suitable for large substrates and rectangular substrates.

For reference, reference numeral 120 denotes a table on which the substrate 110 is seated, and reference numeral 141 denotes a body on which the nozzle 142 is installed.

However, such a structure alone does not prevent contamination of the nozzle face of the slit coater, because the present invention lacks recognition of the importance of the nozzle face processing technology of the slit coater. This is solved by increasing the non-tackiness.

3 is a cross-sectional view illustrating a phenomenon in which a photosensitive material is attached to a nozzle surface of a slit coater.

As shown in the figure, when applying an organic material, such as photoresist 145 on the substrate 110, the side and the bottom surface of the nozzle 142 of the slit coater 140 is due to the adhesive property of the organic material It is easily contaminated by the resist 145.

As described above, the photoresist 145 is formed on the side surface of the nozzle 142 due to the adhesive property of the photoresist 145, which acts as a defective source to cause horizontal staining or protrusion defects.

In order to prevent this, the operator frequently performs manual cleaning, which lowers the productivity, and poses a risk due to the initial failure occurring immediately after the manual cleaning.

4A and 4B show non-tackiness of liquids according to the roughness of the nozzle face.

As shown in FIG. 4A, when the roughness of the surface of the nozzle 110 is rough, the surface tension of the liquid 130 with respect to the surface of the nozzle 110 is high, so that the wettability of the liquid 130 is high and the contact angle α ' ) Becomes small.

On the other hand, as shown in FIG. 4B, when the nozzle 110 is flat, the surface tension of the liquid 130 with respect to the surface of the nozzle 110 is low, so that the wettability of the liquid 130 is lowered and the contact angle α is It becomes bigger. As a result, the adhesion of the liquid 130, such as the coating liquid, may be deteriorated and contamination of the nozzle by the coating liquid may be prevented.

To this end, the present invention is characterized by increasing the non-adhesiveness to the coating liquid by coating the Teflon (Teflon) after processing the nozzle side and the bottom surface of the slit coater, will be described in detail with reference to the drawings.

5 is a cross-sectional view schematically showing a coating liquid applying apparatus according to an embodiment of the present invention.

At this time, the coating liquid applying apparatus of this embodiment uses a rectangular glass substrate for manufacturing the screen panel of the liquid crystal display device as the substrate to be treated, and in the photolithography process for selectively patterning electrode layers, color filter layers, etc. formed on the surface of the substrate. It is used for the coating liquid coating process of apply | coating a coating liquid to the surface of a board | substrate. In addition, the coating liquid applying apparatus may be modified as a device for applying a processing liquid (coating liquid) to not only glass substrates for liquid crystal display devices but also various substrates for flat panel displays in general.

As shown in the drawing, the coating liquid applying apparatus according to an embodiment of the present invention is a table 220, the substrate (not shown) is seated, the coating unit 200 for applying a coating liquid, such as photoresist to the substrate and The driving unit 260 is installed at both ends of the applicator 200 to move the applicator 200 at a constant speed. In addition, the coating liquid coating device is a supply unit (not shown) for supplying the coating liquid coated on the substrate and pumping the photosensitive material is injected by applying a constant pressure while supplying the photosensitive material from the supply to the coating unit 200 ) Means (not shown).

At this time, although not shown in the drawing, the supply unit is composed of a storage tank for storing the coating liquid and a supply pipe for supplying the photosensitive material stored therein to the coating unit 200 and the flow rate adjusting device.

The storage tank stores a coating liquid such as a photoresist, a developing solution, and a color filter supplied to the coating unit 200 and may be attached to the driving unit 260.

The pumping means applies a predetermined pressure to the applicator 200 and causes the coating liquid stored in the applicator 200 to be injected by the pressure. In this case, the pumping means may be installed in the storage tank, and pressurizes the inside of the storage tank to serve to supply the coating liquid stored in the storage tank to the applicator 200.

An object to be processed, such as a glass substrate, is mounted on the table 220, and a plurality of pins (not shown) are provided on the table surface to lift the substrate from the table 220.

At this time, the table 220 is made of a rectangular stone (stone), the upper surface and the side is processed flat.

The upper surface of the table 220 is a horizontal plane, the substrate is seated, a plurality of vacuum suction holes (not shown) are formed on the upper surface, through the adsorption of the substrate during processing of the substrate in the coating liquid application device Keep the substrate in a predetermined horizontal position.

At this time, although not shown in the drawing, one side of the table 220 is provided with a preliminary ejection device is installed when the first start of coating or after the coating is completed each time by performing a preliminary ejection from the coating unit 200, The coating liquid may be uniformly applied on the entire surface of the coating unit 200.

The driving unit 260 is installed at both ends of the coating unit 200 and the pair of Z-axis driving unit 261 and the coating unit 200 to move the coating unit 200 in the vertical direction (Z-axis direction). It includes a pair of X-axis drive unit 262 to move the at a constant speed in the front and rear direction (X-axis direction) to uniformly spray the photosensitive material on the substrate surface.

At this time, the X-axis driving device 262 may be composed of a motor (not shown), a moving rail, a moving means 270 such as a guide rail, a non-contact type linear (linear) motor can be used as the motor. .

The moving means 270 guides the movement of the applicator 200 together with the support block 290 fixed and installed at both ends of the table 220. That is, the moving means 270 serves as a guide for moving the applicator 200 in the horizontal X axis direction of the surface of the table 220 in order to apply the coating liquid to the substrate through the applicator 200.

An upper part of the table 220 is provided with an applicator 200 placed almost horizontally on both sides of the table 220, and the applicator 200 crosses the upper part of the substrate and corresponds to the width of the substrate. The slit coater 240 has a length to be composed of a head 250 is mounted on the slit coater 240. In addition, the applicator 200 includes a gap sensor 255 for measuring gaps between the slit coaters 240.

At this time, the slit coater 240 is composed of a nozzle body 241 including a nozzle 242, an inlet (not shown) and discharge port (not shown), to store the photosensitive material in the nozzle body 241 It has a storage space for, the inlet is formed in the nozzle body 241 and the discharge port is formed in the nozzle 242 facing the substrate of the nozzle body 241. At this time, the discharge port has a slit shape longer than the width.

In addition, the slit coater 240 uniformly applies the coating liquid to the surface of the substrate by spraying the coating liquid while moving from one side of the substrate to the other side through the X-axis driving device 262. Alternatively, the same coating process may be performed by sliding the substrate while the slit coater 240 is fixed.

The head 250 and the slit coater 240 are fixed with a plurality of bolts (not shown), and adjusts the bolts to adjust the height deviation in the vertical direction of both ends of the slit coater 240.

The slit coater according to the embodiment of the present invention configured as described above has a flat surface of the nozzle side and the bottom surface, and then coated Teflon to increase the non-adhesiveness to the coating liquid to prevent contamination of the nozzle, while By increasing the width it is possible to improve the coating uniformity, which will be described in detail with reference to the drawings.

6 is a perspective view schematically showing a slit coater according to an embodiment of the present invention, Figure 5 is a cross-sectional view schematically showing a slit coater according to an embodiment of the present invention.

As shown in the figure, the slit coater 240 is largely composed of a first nozzle body 241a, a second nozzle body 241b, a nozzle 242, an inlet 245 and an outlet 247.

As described above, the slit coater 240 has a structure in which two parts of the nozzle body 241 are coupled to each other, and the coating liquid supplied between the first nozzle body 241a and the second nozzle body 241b may be temporarily stored. The storage space 246 is formed. The storage space 246 serves to uniformly spray the coating liquid pressurized by the pumping means to the entire slit coater 240 without being directly injected through the discharge port 247. The storage space 246 may be formed in an arcuate shape having a large space at the center and a relatively small space at the edge of the inner surface of the second nozzle body 241b.

The inlet 245 is formed on the second nozzle body 241b to supply the coating liquid to the accommodation space 246, and the discharge port 247 faces the substrate in a slit shape longer than a width. The beam is formed inside the nozzle 242 to apply a surface-type coating liquid to the surface of the substrate.

In this case, the inlet 245 is formed in the upper portion of the second nozzle body 241b, for example, but the present invention is not limited to this, the inlet 245 of the present embodiment is the first It may be formed between the nozzle body 241a and the second nozzle body 241a.

The gap between the first nozzle body 241a and the second nozzle body 241b is determined and maintained by a very thin shim 247 made of stainless steel.

The slit coater 240 according to the embodiment of the present invention configured as described above is characterized in that the teflon is coated after the side surface 243 and the lower surface 244 of the nozzle 242 is flattened, and thus the coating liquid Increasing the non-adhesiveness to the can prevent the contamination of the nozzle.

To this end, the side surfaces 243 and the lower surface 244 of the nozzle 242 are 1.0 μm, 0.25 μm, and 1.0 in terms of the maximum height Rmax, the arithmetic mean roughness Ra, and the ten point average roughness Rz, respectively. Surface roughness is improved from 0.1 μm to 0.1 μm, 0.025 μm and 0.1 μm.

For reference, the maximum height Rmax, arithmetic mean roughness Ra, and ten-point average roughness Rz may be defined as parameters for surface roughness as follows.

When the multi-sided curve is cut into the average line, the section of the cross-section curve that is divided like an island that rises above the water is called the cross-section mountain. The height from the center line to each cross section peak is called cross section peak height Yp, and the depth from the average line to each cross section valley is also called cross section valley depth Yv.

At this time, the absolute value obtained by adding the heights of the cross-sectional mountains adjacent to each other and the depth of the cross-sectional valleys is called the cross-sectional uneven height.

The height from the lowest point to the highest point of the cross-sectional curve within one reference length is called the maximum height Rmax. The maximum height Rmax is a parameter in which roughness representativeness is a problem, but since it is relatively easy to measure, it has been used as a roughness parameter since the early days when the roughness measurement technology has not developed, and has reached the present.

The 10-point average roughness Rz is the absolute value of the absolute value of the elevation Yp from the highest peak to the fifth peak measured in the direction of the longitudinal magnification from the average line of the sample by drawing the reference length in the direction of the average line from the roughness curve. The sum of the average value and the average value of the absolute values of the elevations Yv of the fifth bone bottom to the lowest valley bottom is obtained, and this value is expressed in micrometers. The ten-point average roughness (Rz) is not a relatively widely used parameter, but it is not easy to measure such as small valve seats, grooves, bottoms or sides where high mountains or deep valleys affect performance. In this case, it is a parameter that can be measured easily.

The arithmetic mean roughness Ra is extracted from the roughness curve by the reference length in the direction of the average line, the X axis is held in the average line direction of the sample portion, the Y axis is in the vertical magnification direction, and the roughness curve is represented by y = f (x). When it cuts out, it is what shows the value calculated | required by the following formula by micrometer.

[Mathematical Expression]

Where l represents the reference length.

Since the arithmetic mean roughness Ra is not significantly affected by abnormally protruding or recessed portions, the arithmetic mean roughness Ra is representative of the surface roughness relatively well, but it is not considered complete.

As described above, the Teflon is coated after the side surfaces 243 and the lower surface 244 of the nozzle 242 are increased, thereby increasing the non-adhesiveness to the coating liquid, and improving durability.

The Teflon forms a very stable compound due to the strong chemical bonding of fluorine and carbon, and thus has almost perfect chemical inertness and heat resistance, non-tackiness, excellent insulation stability, and low coefficient of friction. For example, FK-018BL Can be used.

In addition, the slit coater 240 according to the embodiment of the present invention by increasing the width (d) of the lower surface 244 from the existing 30㎛ ~ 50㎛ 60㎛ ~ 80㎛ coating uniformity of the nozzle surface It can be improved.

Hereinafter, the manufacturing method of the liquid crystal display device using the coating liquid application device of this invention is demonstrated, for example.

The manufacturing method of the liquid crystal display device is largely composed of an array process for forming an array substrate, a color filter process for forming a color filter substrate, and a cell process for forming a unit liquid crystal display panel by combining the array substrate and the color filter substrate. Looking in more detail as follows.

First, a thin film transistor which is a switching element which is arranged vertically and horizontally on a transparent insulating substrate such as glass to define a plurality of pixel regions and is connected to the gate line and the data line in each pixel region. To form. In addition, the pixel electrode is connected to the thin film transistor through the array process and drives the liquid crystal layer as a signal is applied through the thin film transistor. In the transverse electric field mode, the pixel electrode and the common electrode for forming a horizontal electric field are formed together in the liquid crystal layer through the array process.

In addition, a color matrix is formed on the color filter substrate by a color filter process to form a black matrix that distinguishes between the color filter layer made up of red, green, and blue colors and the sub color filter, and blocks light transmitted through the liquid crystal layer. do.

The black matrix may be an organic film made of a resin material, for example, colored acrylic, epoxy, or polyimide resin including any one of carbon black and black pigment. Organic resin etc. can be applied.

Next, an overcoat layer made of a transparent insulating material is formed on the entire surface of the substrate.

The overcoat layer may be formed of a transparent resin having insulating properties in order to planarize the substrate on which the color filter layer is formed and to prevent elution of the pigment ions, and in particular, may be formed of an acrylic resin or an epoxy resin.

As described above, the array process and the color filter process require a plurality of photolithography processes to form patterns of thin film transistors and color filter layers.

The photolithography process is a series of processes for transferring a pattern drawn on a mask onto a substrate on which a thin film is deposited to form a desired pattern. The photolithography process includes a plurality of processes such as photoresist coating, exposure, and development.

At this time, for example, when the coating liquid coating apparatus of the present invention is used to apply the photosensitive liquid, a desired pattern can be obtained by applying a uniform photosensitive liquid to the entire surface of the substrate. As a result, the yield and productivity can be improved.

In particular, the slit coating method and the spin coating method may be sequentially applied to the formation of the color filter layer. First, after the slit coating of the color filter using the coating liquid applying apparatus of the present invention, the spin chuck is secondly coated to rotate the spin chuck. The color filter is characterized in that to spread evenly.

Next, a spacer is formed of an organic layer on the color filter substrate or the array substrate.

As the spacers are gradually enlarged in size, column spacers (or patterned spacers) fixed to an array substrate or a color filter substrate are used.

Subsequently, an alignment layer is applied to the array substrate and the color filter substrate, respectively, and then the alignment layer is provided to provide alignment control force or surface fixation force (ie, pretilt angle and alignment direction) to the liquid crystal molecules of the liquid crystal layer formed between the two substrates. Orientation treatment. In this case, a rubbing or photoalignment method may be applied as the alignment treatment method.

Next, a predetermined failure turn is formed with a sealant on the color filter substrate, and a liquid crystal layer is formed on the array substrate.

Thereafter, pressure is applied to the array substrate and the color filter substrate to form a unit liquid crystal display panel.

Many details are set forth in the foregoing description but should be construed as illustrative of preferred embodiments rather than to limit the scope of the invention. Therefore, the invention should not be defined by the described embodiments, but should be defined by the claims and their equivalents.

110: substrate 120,220: table
140,240: Slit coater 241,241a, 241b: Body
242: nozzle 245: inlet
246: storage space 247: discharge port

Claims (9)

In the coating liquid applying apparatus comprising a slit coater for applying a coating liquid such as photoresist to the substrate and a drive unit for moving the slit coater in a predetermined direction,
The slit coater is composed of a nozzle body including the nozzle, the inlet and the discharge port, the side and the bottom surface of the nozzle is coated with a Teflon coating after the flat surface is processed. The coating liquid coating apparatus of claim 1, wherein the coating liquid comprises a photoresist, a developing solution, or a color filter. The surface roughness of claim 1, wherein the side and bottom surfaces of the nozzle have improved surface roughnesses of about 0.1 μm, 0.025 μm, and 0.1 μm at the maximum height Rmax, arithmetic mean roughness Ra, and ten-point average roughness Rz, respectively. Coating liquid coating device, characterized in that. The coating liquid coating apparatus according to claim 1, wherein one width of the lower surface of the nozzle is about 60 µm to 80 µm. Providing a first substrate and a second substrate;
Providing a slit coater comprising a nozzle body including a nozzle, an inlet and an outlet;
Forming a color filter layer by slit coating a color filter on the surface of the first substrate using the slit coater, and then rotating a first substrate coated with the color filter using a spin chuck; And
And attaching the first substrate and the second substrate to each other. The method of claim 5, wherein providing the slit coater
Flattening the side and bottom surfaces of the nozzle; And
And coating Teflon on the side and bottom surfaces of the flatly processed nozzle. The method of claim 5, wherein the forming of the color filter layer
Slit coating a color filter on the surface of the first substrate using the slit coater;
Rotating the first substrate coated with the color filter using a spin chuck; And
Exposing and developing the color filter to form a color filter layer. The method of claim 5, wherein the providing of the slit coater comprises processing one width of the lower surface of the nozzle to about 60 μm to 80 μm. The side and bottom surfaces of the nozzle are flattened to have a thickness of about 0.1 μm, 0.025 μm, and 0.1 μm at the maximum height Rmax, arithmetic mean roughness Ra, and ten-point average roughness Rz, respectively. Method of manufacturing a liquid crystal display device characterized in that.

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