KR20070110900A - 고주파 모듈 - Google Patents
고주파 모듈 Download PDFInfo
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- KR20070110900A KR20070110900A KR1020077022659A KR20077022659A KR20070110900A KR 20070110900 A KR20070110900 A KR 20070110900A KR 1020077022659 A KR1020077022659 A KR 1020077022659A KR 20077022659 A KR20077022659 A KR 20077022659A KR 20070110900 A KR20070110900 A KR 20070110900A
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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Abstract
Description
Claims (7)
- 제1주파수대를 이용한 제1무선시스템을 구성하는 회로소자의 적어도 일부분과, 제2주파수대를 이용한 제2무선시스템을 구성하는 회로소자의 적어도 일부분이 일체적으로 형성된 고주파 모듈에 있어서,거의 직방체상의 소체로 구성되어 있으며, 상기 각 회로소자를 구성하는 능동소자 및 수동소자 중 적어도 한쪽을 가지는 기판과,상기 기판의 제1의 표면에 배치되어, 상기 제1의 표면을 구성하고 있는 4개의 변 중, 제1의 변에 따르도록 복수의 단자가 배열된 제1의 단자군과,상기 제1의 표면에 배치되어, 상기 제1의 변과는 다른 제2의 변에 따르도록 복수의 단자가 배열된 제2의 단자군을 구비하고,상기 제1의 단자군은 상기 제1무선시스템의 제1안테나단자를 포함하며,상기 제2의 단자군은 상기 제2무선시스템의 제2안테나단자를 포함하는 것을 특징으로 하는 고주파 모듈.
- 제1항에 있어서, 상기 기판은 복수의 유전체층이 적층되어 거의 직방체의 형상을 가지는 다층기판인 것을 특징으로 하는 고주파 모듈.
- 제1항 또는 제2항에 있어서, 상기 제2의 단자군은 상기 제1의 변에 인접하는 상기 제2의 변에 따르도록 형성된 것을 특징으로 하는 고주파 모듈.
- 제3항에 있어서, 상기 제2안테나단자는 상기 제2의 변이 연장하는 방향에 있어서, 상기 제1의 변보다도 상기 제1의 변에 대향하는 제3의 변 쪽에 가까워지도록 배치된 것을 특징으로 하는 고주파 모듈.
- 제1항 내지 제4항 중 어느 한 항에 있어서, 상기 제1의 표면에 있어서, 상기 제1안테나단자와 상기 제2안테나단자 사이에 캐비티가 형성된 것을 특징으로 하는 고주파 모듈.
- 제1항 내지 제5항 중 어느 한 항에 있어서, 상기 제1의 표면에 있어서, 상기 제1안테나단자와 상기 제2안테나단자 사이에 그라운드단자가 배치되어 있는 것을 특징으로 하는 고주파 모듈.
- 제2항 내지 제6항 중 어느 한 항에 있어서, 상기 제1의 표면과 반대측의 제2의 표면에, 상기 수동소자 또는 상기 능동소자를 구성하는 실장부품을 구비하고,상기 제1안테나단자 및 상기 제2안테나단자 중 적어도 한쪽은 상기 다층기판을 상기 유전체의 적층방향에 관통하는 비아홀도체에 의해, 실질적으로 상기 유전체층의 적층방향에 대하여 수직방향으로 연장하는 면내도체를 통하지 않고, 상기 다층기판의 표면에 배치된 실장부품에 접속되어 있는 것을 특징으로 하는 고주파 모듈.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2005120152 | 2005-04-18 | ||
JPJP-P-2005-00120152 | 2005-04-18 |
Publications (2)
Publication Number | Publication Date |
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KR20070110900A true KR20070110900A (ko) | 2007-11-20 |
KR100880800B1 KR100880800B1 (ko) | 2009-02-02 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020077022659A KR100880800B1 (ko) | 2005-04-18 | 2006-02-13 | 고주파 모듈 |
Country Status (6)
Country | Link |
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US (1) | US7579930B2 (ko) |
EP (1) | EP1873923A4 (ko) |
JP (1) | JP4020159B2 (ko) |
KR (1) | KR100880800B1 (ko) |
CN (1) | CN101160733B (ko) |
WO (1) | WO2006114928A1 (ko) |
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CN103155427B (zh) * | 2010-09-29 | 2015-11-25 | 株式会社村田制作所 | 高频模块 |
US8811922B2 (en) * | 2011-04-18 | 2014-08-19 | Apple Inc. | LTE/1X dual-standby with single-chip radio |
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CN107278029A (zh) * | 2012-12-21 | 2017-10-20 | 华为终端有限公司 | 电子装置和栅格阵列模块 |
JP5838978B2 (ja) * | 2013-01-24 | 2016-01-06 | 株式会社村田製作所 | セラミック積層部品 |
CN104602366B (zh) * | 2013-10-30 | 2018-09-25 | 太阳诱电株式会社 | 通信模块 |
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WO2018200804A1 (en) | 2017-04-28 | 2018-11-01 | 3D Glass Solutions, Inc. | Rf circulator |
JP2019016618A (ja) * | 2017-07-03 | 2019-01-31 | 株式会社村田製作所 | インダクタ及び電力増幅モジュール |
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JP2001119201A (ja) | 1999-10-18 | 2001-04-27 | Nec Kansai Ltd | 高周波切り替え回路ic |
JP3519666B2 (ja) * | 2000-03-30 | 2004-04-19 | シャープ株式会社 | Pcカード型無線通信装置 |
JP2002064400A (ja) * | 2000-06-09 | 2002-02-28 | Hitachi Metals Ltd | 高周波スイッチモジュール |
JP4399755B2 (ja) * | 2000-06-09 | 2010-01-20 | 日立金属株式会社 | 高周波スイッチモジュール |
JP2002270762A (ja) * | 2001-03-09 | 2002-09-20 | Sony Corp | 半導体装置 |
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JP2004297456A (ja) * | 2003-03-27 | 2004-10-21 | Kyocera Corp | 高周波モジュール |
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JP2004350068A (ja) | 2003-05-23 | 2004-12-09 | New Japan Radio Co Ltd | アンテナスイッチ半導体集積回路 |
JP3642062B2 (ja) * | 2003-07-03 | 2005-04-27 | 日立金属株式会社 | 高周波スイッチ |
US7245882B1 (en) * | 2003-07-17 | 2007-07-17 | Atheros Communications, Inc. | Method and apparatus for a signal selective RF transceiver system |
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JP4020159B2 (ja) | 2007-12-12 |
CN101160733B (zh) | 2011-10-05 |
US7579930B2 (en) | 2009-08-25 |
KR100880800B1 (ko) | 2009-02-02 |
US20070296520A1 (en) | 2007-12-27 |
EP1873923A1 (en) | 2008-01-02 |
WO2006114928A1 (ja) | 2006-11-02 |
EP1873923A4 (en) | 2013-12-04 |
CN101160733A (zh) | 2008-04-09 |
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