KR20060072091A - 칩 제거 가공용 공구 홀더 - Google Patents

칩 제거 가공용 공구 홀더 Download PDF

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KR20060072091A
KR20060072091A KR1020050127993A KR20050127993A KR20060072091A KR 20060072091 A KR20060072091 A KR 20060072091A KR 1020050127993 A KR1020050127993 A KR 1020050127993A KR 20050127993 A KR20050127993 A KR 20050127993A KR 20060072091 A KR20060072091 A KR 20060072091A
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layer
tool holder
tool
colored
tool holders
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알그렌 마츠
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산드빅 인터렉츄얼 프로퍼티 에이비
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Publication of KR20060072091A publication Critical patent/KR20060072091A/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0617—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B29/00—Holders for non-rotary cutting tools; Boring bars or boring heads; Accessories for tool holders
    • B23B29/04—Tool holders for a single cutting tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C5/00—Milling-cutters
    • B23C5/006—Details of the milling cutter body
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0015—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterized by the colour of the layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0635—Carbides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0664—Carbonitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/006—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterized by the colour of the layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C23C16/303—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/32—Carbides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/36—Carbonitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2228/00—Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner
    • B23B2228/10—Coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2270/00—Details of turning, boring or drilling machines, processes or tools not otherwise provided for
    • B23B2270/36—Identification of tooling or other equipment

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  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Jigs For Machine Tools (AREA)
  • Gripping On Spindles (AREA)

Abstract

본 발명은 최외각에 얇은 착색 비산화물층을 갖는 공구 홀더에 관한 것이며, 색은 간섭에 의해 나타난다.

Description

칩 제거 가공용 공구 홀더{TOOL HOLDERS FOR CHIP REMOVING MACHINING}
본 발명은 최외각에 얇은 간섭 착색층 (outermost thin interference color layer) 을 구비하는 칩 제거 가공용 공구 홀더에 관한 것이다.
본 출원에서 공구 홀더는 하나 이상의 칩 제거 가공용 절삭 인서트용 홀더를 의미한다. 홀더는 본체를 포함하며, 상기 본체에 하나 이상의 인서트-수용 자리 또는 절단 인서트를 수용하기 위한 다른 구성이 배치된다. 선삭 용도를 위하여 공구 홀더는 일반적으로 기다란 형상이며, 밀링 용도를 위하여 회전 대칭이다. 상기 인서트는 초경합금 (cemented carbide), 서멧 (cermet), 세라믹 (ceramics), 고속도강 (high-speed steel), 공구강 (tool steel) 또는 입방정계 질화붕소 (cubic boron nitride) 또는 다이아몬드와 같은 초경재료 (superhard material) 이루어진다.
홀더는 공구강으로 만들어지며, 종래의 칩 제거 가공 방법에 의하여 원하는 형상 및 크기로 제조된다. 이후 표면처리하여 흑색 산화물 (black oxide) 표면을 갖도록 한다. 마지막으로, 상기 표면을 더욱 보호하도록 기름을 바른다.
단지 장식상의 이유뿐만 아니라 특정한 기계 작업을 위한 정확한 등급을 선 택하도록 최종 사용자 (end user) 에 대한 가이드로서 역할하는 상이한 색채를 인서트에 부여하는 것 또한 흥미롭다. 불행히도 이러한 목적에 적합한 착색된 화합물의 수는 한정되어 있다. 종종 사용되는 한 방법이 산화피막화 (anodization) 이다. 다른 방법으로 물리적 기상 증착 (Physical Vapor Deposition, PVD) 이 있다.
본 발명의 일목적은 특정 가공 작업을 위하여 정확한 것을 선택하도록 최종 사용자에 대한 가이드로서 역할하는 상이한 색을 갖는 공구 홀더를 제공하는 것이다.
본 발명의 다른 목적은 증가된 내마모성의 착색층 (coloring layer) 를 갖는 공구 홀더를 제공하는 것이다.
본 발명의 또 다른 목적은 용이하게 증착 (deposit) 될 수 있는 착색층을 갖는 공구 홀더를 제공하는 것이다.
본 발명의 또 다른 목적은 동일 코팅 내에서 또한 각 코팅마다 일관되는 색을 갖는 공구 홀더를 제공하는 것이다.
본 발명에 따른 공구 홀더는 주기율표의 4B, 5B, 6B 족의 금속, Al, Si 및 B 또는 이들의 혼합물 (mixture), 바람직하게는 Ti 및/또는 Al 을 포함하는 그룹으로부터 선택되는 금속의 최외각 얇은 투명 비산화물층, 바람직하게는 탄화물층, 질화물층 또는 탄화질화물층 (carbonitride layer) 에 의해 착색된다. 상기 층의 두께는 간섭에 의해 색이 나타나는 두께, 즉, 0.5 ㎛ 미만, 바람직하게는 0.05 ~ 0.3 ㎛, 가장 바람직하게는 0.05 ㎛ 이상 0.2 ㎛ 미만이다. 본체는 공구강으로 구성된다.
착색층은 유일한 층일 수 있으나, 또한 내마모 기능성 코팅 위에 있을 수도 있다. 바람직하게는 상기 착색층은 0.1 ~ 5.0 ㎛ 의 두께를 갖는 TiN-층과 접촉한다.
바람직한 실시예에서, 상기 착색층은 (Ti, Al)N, 보다 구체적으로 TixAl1-xN 이며 여기서 0.1<x<0.9, 바람직하게는 0.4<x<0.7, 가장 바람직하게는 0.4<x<0.6 이다.
바람직하게는, 상기층은 -20<a*<0, -40<b*<0, 그리고 0<L*<95 인 파랑색이다. 바람직한 실시예에서는 -20<a*<-10이다. 다른 바람직한 실시예에서 -40<b*<-20이다. 상기 a*, b*, c* 좌표는 당업계에서는 CIELab 시스템의 일부로서 잘 알려져 있으며, 이는 색채가 3차원 직교 좌표계에 위치하는 균일 장치 독립 색채 공간 (uniform device independent color space) 이다. 상기 3차원은 명도 (L*), 빨강/녹색 (a*) 그리고 노랑/파랑 (b*) 이다.
상기 층은 PVD 기법에 의해, 바람직하게는 마그네트론 스퍼터링 (magnetron sputtering) 또는 음극 아크 증발 (cathodic arc evaporation) 에 의해 증착된다. 상기 층은 기능성 내마모층용으로 사용되는 것과 동일한 양산 규모 장치 내에서 용이하게 제자리에 증착된다.
상기 색채층은 플라즈마 보조 화학적 증기 증착 (Plasma Assisted Chemical Vapor Deposition, PACVD). 에 의해서도 증착될 수 있다.
실시예 1
스퍼터링 공정 (sputtering process) 에 의해 파랑색의 외각 코팅이 엔드밀 공구 홀더에 제공된다. 원통 형상이며 20×20 ㎟ 인 박막 (foil) 이 동시에 코팅된다. 상기 공구 홀더와 박막에 동일한 3-폴드 회전 (3-fold rotation) 이 가해진다. Ar, Kr 그리고 N2 유동이 각각 150, 85 그리고 70 sccm 으로 조절된다. 100 V 의 음의 기판 바이어스가 가해진다. 먼저, 약 0.2 ㎛ 의 TiN 층이 증착된다. 상기 TiN 층위에 금속공급원 (metal source) 로서 두 개의 Ti0.5Al0.5-타겟을 사용하여 (Ti0.5Al0.5)N 층이 증착된다. 각각의 Ti0.5Al0.5-타겟에 23분동안 3.2kW 의 음극 전력 (cathode power) 을 사용하여 (Ti0.5Al0.5)N 층을 증착시킴으로써 양호한 파랑 색채를 얻었다. L*, a*, b* 값은 박막 상에서 Minolta Spectrophotometer CM-25000 을 다음과 같이 설정하여 측정하였다.
마스크/글로스 (Mask/Gloss) M/SCI
자외선 설정 (UV setting) UV 100%
광원 1 (Illuminant1) D65
관측기 (Observer) 10°
디스플레이 DIFF & ABS
다음의 결과가 얻어졌다. a* = -16, b* = -30, L* = 39
실시예 2
각각의 Ti0.5Al0.5-타겟에 23분동안 3.7kW 의 음극 전력 (cathode power) 을 사용하여 (Ti,Al)N 층을 증착시킨 것을 제외하고는 실시예 1 과 동일하다. 다음과 같은 결과의 파랑색이 얻어졌다. a* = -18, b* = -23, L* = 46
실시예 3
각각의 Ti0.5Al0.5-타겟에 23분동안 5.7kW 의 음극 전력 (cathode power) 을 사용하여 (Ti,Al)N 층을 증착시킨 것을 제외하고는 실시예 1 과 동일하다. 다음과 같은 결과의 녹색이 얻어졌다. a* = -14, b* = -7, L* = 56
실시예 4
Ar, Kr 그리고 N2 유동이 250, 150 그리고 70 sccm 으로 각각 변경되었으며, 각각의 Ti0.5Al0.5-타겟에 23분동안 3.2kW 의 음극 전력 (cathode power) 을 사용하여 (Ti,Al)N 층을 증착시킨 것을 제외하고는 실시예 1 과 동일하다. 다음과 같은 결과의 짙은 파랑색이 얻어졌다. a* = -3, b* = -39, L* = 29
실시예 5
일정 시간 후 실시예 4 가 반복되었다. 다시 다음과 같은 결과의 짙은 파랑색이 얻어졌다. a* = -5, b* = -37, L* = 31
본 발명을 통해 최외각에 얇은 간섭 착색층을 구비하는 칩 제거 가공용 공구 홀더를 얻을 수 있다.

Claims (8)

  1. 간섭에 의해 색이 나타나는 얇은 최외각 착색 비산화물층을 갖는 것을 특징으로 하는 공구 홀더.
  2. 제 1 항에 있어서, 상기 착색층의 두께는 0.5 ㎛ 미만인 것을 특징으로 하는 공구 홀더.
  3. 제 1 항에 있어서, 상기 착색층은 주기율표의 4B, 5B 또는 6B 족의 금속, Al, Si 그리고 B 또는 이들의 혼합물로 이루어진 그룹으로부터 선택되는 금속의 탄화물, 질화물 또는 탄화질화물인 것을 특징으로 하는 공구 홀더.
  4. 제 3 항에 있어서, 상기 금속은 Ti 및/또는 Al 인 것을 특징으로 하는 공구 홀더.
  5. 제 4 항에 있어서, 상기 층은 TixAl1-xN 인 것을 특징으로 하는 공구 홀더
  6. 제 5 항에 있어서, 0.1<x<0.9, 바람직하게는 0.4<x<0.7, 가장 바람직하게는 0.4<x<0.6 인 것을 특징으로 하는 공구 홀더.
  7. 제 1 항에 있어서, 상기 층은 -20<a*<0, -40<b*<0 그리고 0<L*<95 인 파랑색인 것을 특징으로 하는 공구 홀더
  8. 제 5 항에 있어서, 상기 층은 바람직하게는 0.1 ~ 5 ㎛ 두께로 TiN 층 위에 증착되는 것을 특징으로 하는 공구 홀더.
KR1020050127993A 2004-12-22 2005-12-22 칩 제거 가공용 공구 홀더 KR20060072091A (ko)

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