KR200497050Y1 - 부품 캐리어 구조체의 변형을 억제하기 위한 온도 처리 중의 부품 캐리어 구조체의 핸들링 - Google Patents

부품 캐리어 구조체의 변형을 억제하기 위한 온도 처리 중의 부품 캐리어 구조체의 핸들링 Download PDF

Info

Publication number
KR200497050Y1
KR200497050Y1 KR2020210003370U KR20210003370U KR200497050Y1 KR 200497050 Y1 KR200497050 Y1 KR 200497050Y1 KR 2020210003370 U KR2020210003370 U KR 2020210003370U KR 20210003370 U KR20210003370 U KR 20210003370U KR 200497050 Y1 KR200497050 Y1 KR 200497050Y1
Authority
KR
South Korea
Prior art keywords
jig
carrier structure
component carrier
handling device
magnets
Prior art date
Application number
KR2020210003370U
Other languages
English (en)
Korean (ko)
Other versions
KR20220001075U (ko
Inventor
리 젠추안
Original Assignee
에이티 앤드 에스 (총칭) 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이티 앤드 에스 (총칭) 컴퍼니 리미티드 filed Critical 에이티 앤드 에스 (총칭) 컴퍼니 리미티드
Publication of KR20220001075U publication Critical patent/KR20220001075U/ko
Application granted granted Critical
Publication of KR200497050Y1 publication Critical patent/KR200497050Y1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Pinball Game Machines (AREA)
KR2020210003370U 2020-11-06 2021-11-05 부품 캐리어 구조체의 변형을 억제하기 위한 온도 처리 중의 부품 캐리어 구조체의 핸들링 KR200497050Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011231684.8 2020-11-06
CN202011231684.8A CN114449756B (zh) 2020-11-06 2020-11-06 在温度处理期间对部件承载件结构进行操纵以抑制部件承载件结构的变形

Publications (2)

Publication Number Publication Date
KR20220001075U KR20220001075U (ko) 2022-05-13
KR200497050Y1 true KR200497050Y1 (ko) 2023-07-10

Family

ID=80111334

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020210003370U KR200497050Y1 (ko) 2020-11-06 2021-11-05 부품 캐리어 구조체의 변형을 억제하기 위한 온도 처리 중의 부품 캐리어 구조체의 핸들링

Country Status (4)

Country Link
JP (1) JP3235830U (ja)
KR (1) KR200497050Y1 (ja)
CN (1) CN114449756B (ja)
TW (1) TWM628025U (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006005106A (ja) * 2004-06-16 2006-01-05 Sumitomo Metal Micro Devices Inc 基板固定用治具及び基板固定方法
KR101646546B1 (ko) * 2015-04-07 2016-08-08 주식회사 큐디씨솔루션 인쇄회로기판용 지그
KR101881897B1 (ko) * 2018-03-13 2018-07-25 주식회사 정일써키트 이어잭과 fpcb의 솔더링 지그장치 및 그를 이용한 솔더링 방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6175243B1 (en) * 1998-08-12 2001-01-16 Aql Manufacturing Services, Inc. Apparatus and method for assembling test fixtures
US6237832B1 (en) * 1999-10-18 2001-05-29 Henry Chung Wave soldering fixture
JP3514437B2 (ja) * 2000-02-22 2004-03-31 Ｔｄｋ株式会社 被加工物の加工装置および方法
US7517419B2 (en) * 2004-04-16 2009-04-14 Panasonic Corporation Substrate support jig, circuit board production apparatus, and method of producing circuit board
CN200944704Y (zh) * 2006-09-15 2007-09-05 深圳市宝安区西乡华兴新精密电子厂 一种柔性电路基板(fpc)装联用的夹具
KR100893124B1 (ko) * 2007-09-05 2009-04-14 백운재 인쇄회로기판 고정용 지그
JP5244701B2 (ja) * 2009-05-20 2013-07-24 株式会社 大昌電子 基板保持搬送用治具、基板押さえ部材、押さえ部材取り外し治具、メタルマスク版、プリント配線基板の搬送方法、電子部品付き配線基板の製造方法、基板搬送装置
KR101079277B1 (ko) * 2010-04-06 2011-11-04 (주)엠이씨 인쇄회로기판 고정용 지그
KR101306303B1 (ko) * 2011-12-08 2013-09-17 배상신 카메라 모듈 솔더링 장치
US20140055969A1 (en) * 2012-08-21 2014-02-27 Apple Inc. Board assemblies with minimized warpage and systems and methods for making the same
JP2014225593A (ja) * 2013-05-17 2014-12-04 パナソニック株式会社 電子部品実装装置および電子部品実装方法
JP6019406B2 (ja) * 2013-05-17 2016-11-02 パナソニックＩｐマネジメント株式会社 電子部品実装装置および電子部品実装方法
KR101422063B1 (ko) * 2014-01-08 2014-08-13 주식회사 에스제이솔루션 Ｐｃｂ 고정 지그 및 이를 이용한 pcb 제조 공정
JP6521678B2 (ja) * 2015-03-11 2019-05-29 Juki株式会社 基板支持装置、及び電子部品実装装置
JP6516889B2 (ja) * 2018-01-29 2019-05-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板スタックを取り扱うための、収容システム及び装置及び方法
EP3763175A1 (en) * 2018-03-07 2021-01-13 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Electronic device having an electronic component packaged in a compact component carrier with shielding cavities
CN209787552U (zh) * 2019-03-01 2019-12-13 奥特斯(中国)有限公司 部件承载件结构

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006005106A (ja) * 2004-06-16 2006-01-05 Sumitomo Metal Micro Devices Inc 基板固定用治具及び基板固定方法
KR101646546B1 (ko) * 2015-04-07 2016-08-08 주식회사 큐디씨솔루션 인쇄회로기판용 지그
KR101881897B1 (ko) * 2018-03-13 2018-07-25 주식회사 정일써키트 이어잭과 fpcb의 솔더링 지그장치 및 그를 이용한 솔더링 방법

Also Published As

Publication number Publication date
TWM628025U (zh) 2022-06-11
CN114449756B (zh) 2024-03-26
CN114449756A (zh) 2022-05-06
JP3235830U (ja) 2022-01-13
KR20220001075U (ko) 2022-05-13

Similar Documents

Publication Publication Date Title
US20200163223A1 (en) Method of Manufacturing a Component Carrier Using a Separation Component, the Component Carrier, and a Semifinished Product
CN105472865B (zh) 包括传热结构的电路板
US11450587B2 (en) Heat removal mechanism for stack-based electronic device with process control component and processing components
CN113284864B (zh) 嵌入式电力***的冷却配置集成
US11799198B2 (en) Component carrier-based device with antenna coupling of electronic component and thermal coupling on opposing sides
CN113645750A (zh) 部件承载件及其制造方法
CN214374383U (zh) 用于对部件承载件进行检查的装置及设备
KR200497050Y1 (ko) 부품 캐리어 구조체의 변형을 억제하기 위한 온도 처리 중의 부품 캐리어 구조체의 핸들링
US11439018B2 (en) Component carrier and method of manufacturing the same
US11810844B2 (en) Component carrier and method of manufacturing the same
CN217563838U (zh) 部件承载件
CN213960402U (zh) 部件承载件及用于制造部件承载件的制造***
EP4250878A1 (en) Direct resin embedding
CN219923551U (zh) 处理装置、部件承载件固化装置和部件承载件制造设备
CN217883966U (zh) 包括至少两个部件的部件承载件
CN213960397U (zh) 用于部件承载件的层结构
CN214507503U (zh) 用于处理部件承载件的夹具***
CN214281750U (zh) 用于对部件进行承载的部件承载件
US20230245971A1 (en) Module Comprising a Semiconductor-based Component and Method of Manufacturing the Same
CN113260170B (zh) 制造部件承载件的方法、混合芯和半成品
EP4276899A1 (en) Package with ic substrate and electronic component connected with direct physical contact
US20220319943A1 (en) Embedding Methods for Fine-Pitch Components and Corresponding Component Carriers
US20230245990A1 (en) Component Carrier With Embedded IC Substrate Inlay, and Manufacturing Method
EP4345895A1 (en) Ic substrate with embedded bridge element, arrangement, and manufacture method
US20220386464A1 (en) Component Carrier Interconnection and Manufacturing Method

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment