KR200497050Y1 - 부품 캐리어 구조체의 변형을 억제하기 위한 온도 처리 중의 부품 캐리어 구조체의 핸들링 - Google Patents
부품 캐리어 구조체의 변형을 억제하기 위한 온도 처리 중의 부품 캐리어 구조체의 핸들링 Download PDFInfo
- Publication number
- KR200497050Y1 KR200497050Y1 KR2020210003370U KR20210003370U KR200497050Y1 KR 200497050 Y1 KR200497050 Y1 KR 200497050Y1 KR 2020210003370 U KR2020210003370 U KR 2020210003370U KR 20210003370 U KR20210003370 U KR 20210003370U KR 200497050 Y1 KR200497050 Y1 KR 200497050Y1
- Authority
- KR
- South Korea
- Prior art keywords
- jig
- carrier structure
- component carrier
- handling device
- magnets
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Developing Agents For Electrophotography (AREA)
- Pinball Game Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011231684.8 | 2020-11-06 | ||
CN202011231684.8A CN114449756B (zh) | 2020-11-06 | 2020-11-06 | 在温度处理期间对部件承载件结构进行操纵以抑制部件承载件结构的变形 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20220001075U KR20220001075U (ko) | 2022-05-13 |
KR200497050Y1 true KR200497050Y1 (ko) | 2023-07-10 |
Family
ID=80111334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2020210003370U KR200497050Y1 (ko) | 2020-11-06 | 2021-11-05 | 부품 캐리어 구조체의 변형을 억제하기 위한 온도 처리 중의 부품 캐리어 구조체의 핸들링 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3235830U (ja) |
KR (1) | KR200497050Y1 (ja) |
CN (1) | CN114449756B (ja) |
TW (1) | TWM628025U (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006005106A (ja) * | 2004-06-16 | 2006-01-05 | Sumitomo Metal Micro Devices Inc | 基板固定用治具及び基板固定方法 |
KR101646546B1 (ko) * | 2015-04-07 | 2016-08-08 | 주식회사 큐디씨솔루션 | 인쇄회로기판용 지그 |
KR101881897B1 (ko) * | 2018-03-13 | 2018-07-25 | 주식회사 정일써키트 | 이어잭과 fpcb의 솔더링 지그장치 및 그를 이용한 솔더링 방법 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6175243B1 (en) * | 1998-08-12 | 2001-01-16 | Aql Manufacturing Services, Inc. | Apparatus and method for assembling test fixtures |
US6237832B1 (en) * | 1999-10-18 | 2001-05-29 | Henry Chung | Wave soldering fixture |
JP3514437B2 (ja) * | 2000-02-22 | 2004-03-31 | Tdk株式会社 | 被加工物の加工装置および方法 |
US7517419B2 (en) * | 2004-04-16 | 2009-04-14 | Panasonic Corporation | Substrate support jig, circuit board production apparatus, and method of producing circuit board |
CN200944704Y (zh) * | 2006-09-15 | 2007-09-05 | 深圳市宝安区西乡华兴新精密电子厂 | 一种柔性电路基板(fpc)装联用的夹具 |
KR100893124B1 (ko) * | 2007-09-05 | 2009-04-14 | 백운재 | 인쇄회로기판 고정용 지그 |
JP5244701B2 (ja) * | 2009-05-20 | 2013-07-24 | 株式会社 大昌電子 | 基板保持搬送用治具、基板押さえ部材、押さえ部材取り外し治具、メタルマスク版、プリント配線基板の搬送方法、電子部品付き配線基板の製造方法、基板搬送装置 |
KR101079277B1 (ko) * | 2010-04-06 | 2011-11-04 | (주)엠이씨 | 인쇄회로기판 고정용 지그 |
KR101306303B1 (ko) * | 2011-12-08 | 2013-09-17 | 배상신 | 카메라 모듈 솔더링 장치 |
US20140055969A1 (en) * | 2012-08-21 | 2014-02-27 | Apple Inc. | Board assemblies with minimized warpage and systems and methods for making the same |
JP2014225593A (ja) * | 2013-05-17 | 2014-12-04 | パナソニック株式会社 | 電子部品実装装置および電子部品実装方法 |
JP6019406B2 (ja) * | 2013-05-17 | 2016-11-02 | パナソニックIpマネジメント株式会社 | 電子部品実装装置および電子部品実装方法 |
KR101422063B1 (ko) * | 2014-01-08 | 2014-08-13 | 주식회사 에스제이솔루션 | Pcb 고정 지그 및 이를 이용한 pcb 제조 공정 |
JP6521678B2 (ja) * | 2015-03-11 | 2019-05-29 | Juki株式会社 | 基板支持装置、及び電子部品実装装置 |
JP6516889B2 (ja) * | 2018-01-29 | 2019-05-22 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 基板スタックを取り扱うための、収容システム及び装置及び方法 |
EP3763175A1 (en) * | 2018-03-07 | 2021-01-13 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic device having an electronic component packaged in a compact component carrier with shielding cavities |
CN209787552U (zh) * | 2019-03-01 | 2019-12-13 | 奥特斯(中国)有限公司 | 部件承载件结构 |
-
2020
- 2020-11-06 CN CN202011231684.8A patent/CN114449756B/zh active Active
-
2021
- 2021-11-04 TW TW110213006U patent/TWM628025U/zh unknown
- 2021-11-05 KR KR2020210003370U patent/KR200497050Y1/ko active IP Right Grant
- 2021-11-05 JP JP2021004280U patent/JP3235830U/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006005106A (ja) * | 2004-06-16 | 2006-01-05 | Sumitomo Metal Micro Devices Inc | 基板固定用治具及び基板固定方法 |
KR101646546B1 (ko) * | 2015-04-07 | 2016-08-08 | 주식회사 큐디씨솔루션 | 인쇄회로기판용 지그 |
KR101881897B1 (ko) * | 2018-03-13 | 2018-07-25 | 주식회사 정일써키트 | 이어잭과 fpcb의 솔더링 지그장치 및 그를 이용한 솔더링 방법 |
Also Published As
Publication number | Publication date |
---|---|
TWM628025U (zh) | 2022-06-11 |
CN114449756B (zh) | 2024-03-26 |
CN114449756A (zh) | 2022-05-06 |
JP3235830U (ja) | 2022-01-13 |
KR20220001075U (ko) | 2022-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20200163223A1 (en) | Method of Manufacturing a Component Carrier Using a Separation Component, the Component Carrier, and a Semifinished Product | |
CN105472865B (zh) | 包括传热结构的电路板 | |
US11450587B2 (en) | Heat removal mechanism for stack-based electronic device with process control component and processing components | |
CN113284864B (zh) | 嵌入式电力***的冷却配置集成 | |
US11799198B2 (en) | Component carrier-based device with antenna coupling of electronic component and thermal coupling on opposing sides | |
CN113645750A (zh) | 部件承载件及其制造方法 | |
CN214374383U (zh) | 用于对部件承载件进行检查的装置及设备 | |
KR200497050Y1 (ko) | 부품 캐리어 구조체의 변형을 억제하기 위한 온도 처리 중의 부품 캐리어 구조체의 핸들링 | |
US11439018B2 (en) | Component carrier and method of manufacturing the same | |
US11810844B2 (en) | Component carrier and method of manufacturing the same | |
CN217563838U (zh) | 部件承载件 | |
CN213960402U (zh) | 部件承载件及用于制造部件承载件的制造*** | |
EP4250878A1 (en) | Direct resin embedding | |
CN219923551U (zh) | 处理装置、部件承载件固化装置和部件承载件制造设备 | |
CN217883966U (zh) | 包括至少两个部件的部件承载件 | |
CN213960397U (zh) | 用于部件承载件的层结构 | |
CN214507503U (zh) | 用于处理部件承载件的夹具*** | |
CN214281750U (zh) | 用于对部件进行承载的部件承载件 | |
US20230245971A1 (en) | Module Comprising a Semiconductor-based Component and Method of Manufacturing the Same | |
CN113260170B (zh) | 制造部件承载件的方法、混合芯和半成品 | |
EP4276899A1 (en) | Package with ic substrate and electronic component connected with direct physical contact | |
US20220319943A1 (en) | Embedding Methods for Fine-Pitch Components and Corresponding Component Carriers | |
US20230245990A1 (en) | Component Carrier With Embedded IC Substrate Inlay, and Manufacturing Method | |
EP4345895A1 (en) | Ic substrate with embedded bridge element, arrangement, and manufacture method | |
US20220386464A1 (en) | Component Carrier Interconnection and Manufacturing Method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment |