KR20010112627A - Pb를 함유하지 않은 솔더 조성물 및 솔더링된 물품 - Google Patents
Pb를 함유하지 않은 솔더 조성물 및 솔더링된 물품 Download PDFInfo
- Publication number
- KR20010112627A KR20010112627A KR1020010032846A KR20010032846A KR20010112627A KR 20010112627 A KR20010112627 A KR 20010112627A KR 1020010032846 A KR1020010032846 A KR 1020010032846A KR 20010032846 A KR20010032846 A KR 20010032846A KR 20010112627 A KR20010112627 A KR 20010112627A
- Authority
- KR
- South Korea
- Prior art keywords
- solder composition
- metal element
- solder
- weight
- composition
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12681—Ga-, In-, Tl- or Group VA metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
시료 | 솔더 조성(질량 %) | 용융특성(℃) | ||||||||||||
Bi | Ag | Sn | Cu | Sb | In | Zn | Ge | P | Pb | 고상선온도 | 액상선온도 | 고체-액체 공존영역 | ||
실시예 | 1 | 97.40 | 2.50 | 0.10 | 259 | 271 | 12 | |||||||
2 | 97.00 | 2.50 | 0.50 | 255 | 272 | 17 | ||||||||
3 | 97.40 | 2.50 | 0.10 | 257 | 270 | 13 | ||||||||
4 | 97.20 | 2.50 | 3.00 | 258 | 313 | 55 | ||||||||
5 | 97.40 | 2.50 | 0.10 | 263 | 280 | 17 | ||||||||
6 | 94.50 | 2.50 | 3.00 | 264 | 318 | 54 | ||||||||
7 | 97.40 | 2.50 | 0.10 | 260 | 271 | 11 | ||||||||
8 | 97.00 | 2.50 | 0.50 | 255 | 272 | 17 | ||||||||
9 | 97.40 | 2.50 | 0.10 | 261 | 272 | 11 | ||||||||
10 | 94.50 | 2.50 | 3.00 | 256 | 277 | 21 | ||||||||
11 | 99.55 | 0.30 | 0.15 | 257 | 277 | 20 | ||||||||
12 | 96.80 | 0.50 | 2.70 | 245 | 263 | 18 | ||||||||
13 | 96.99 | 2.50 | 0.50 | 0.01 | 255 | 275 | 20 | |||||||
14 | 96.99 | 2.50 | 0.50 | 0.01 | 255 | 277 | 22 | |||||||
비교예 | 1 | 60.00 | 40.00 | 181 | 190 | 9 | ||||||||
2 | 50.00 | 50.00 | 183 | 219 | 36 | |||||||||
3 | 3.50 | 96.50 | 221 | 226 | 5 | |||||||||
4 | 3.50 | 95.75 | 0.75 | 217 | 226 | 9 | ||||||||
5 | 97.50 | 2.50 | 264 | 270 | 6 | |||||||||
6 | 96.50 | 2.50 | 1.00 | *1 137 | 247 | 110 | ||||||||
7 | 97.00 | 2.50 | 0.50 | 257 | 366 | 109 | ||||||||
8 | 92.50 | 2.50 | 5.00 | 264 | 348 | 84 | ||||||||
9 | 96.50 | 2.50 | 1.00 | *1 108 | 271 | 163 | ||||||||
10 | 92.50 | 2.50 | 5.00 | 255 | 280 | 25 | ||||||||
11 | 99.85 | 0.15 | 272 | 278 | 6 | |||||||||
12 | 97.30 | 2.70 | 256 | 262 | 6 |
시료 | 크랙 발생율(%) | 브리징 불량발생율 (%) | 솔더 열저항성 불량발생율(%) | |
실시예 | 1 | 0.1 | 0.0 | 0.0 |
2 | 0.0 | 0.0 | 0.0 | |
3 | 0.1 | 0.0 | 0.0 | |
4 | 0.0 | 0.0 | 0.0 | |
5 | 0.1 | 0.0 | 0.0 | |
6 | 0.0 | 0.0 | 0.0 | |
7 | 0.1 | 0.5 | 0.0 | |
8 | 0.0 | 0.9 | 0.0 | |
9 | 0.1 | 1.0 | 0.0 | |
10 | 0.0 | 3.2 | 0.0 | |
11 | 0.0 | 0.0 | 0.0 | |
12 | 0.0 | 9.5 | 0.0 | |
13 | 0.0 | 0.0 | 0.0 | |
14 | 0.0 | 0.0 | 0.0 | |
비교예 | 1 | 1.5 | 0.0 | 100.0 |
2 | 0.0 | 0.0 | 100.0 | |
3 | 100.0 | 0.0 | 100.0 | |
4 | 20.3 | 0.0 | 100.0 | |
5 | 0.5 | 0.0 | 0.0 | |
6 | 0.0 | 0.0 | 100.0 | |
7 | 0.0 | 100.0 | 0.0 | |
8 | 0.0 | 100.0 | 0.0 | |
9 | 0.0 | 23.0 | 100.0 | |
10 | 0.0 | 100.0 | 0.0 | |
11 | 0.4 | 0.0 | 0.0 | |
12 | 0.8 | 9.80 | 0.0 |
Claims (11)
- 제 1 금속 원소로서 Bi; 90중량% 이상의 상기 제 1 금속 원소를 기준으로 9.9중량% 이하의 비율로 상기 제 1 금속 원소와 2원 공정 형성할 수 있는 제 2 금속 원소; 및 제 3 금속 원소; 를 포함하는 Pb를 함유하지 않은 솔더 조성물로, 전체 솔더 조성물에 대해 상기 제 1 금속 원소는 90중량%, 상기 제 3 금속 원소는 0.1중량%∼3.0중량% 를 함유하는 것을 특징으로 하는 Pb를 함유하지 않은 솔더 조성물.
- 제 1항에 있어서, 상기 솔더 조성물은 고상선 온도가 200℃ 미만인 저융점 공정을 함유하지 않는 것을 특징으로 하는 Pb를 함유하지 않은 솔더 조성물.
- 제 1항에 있어서, 상기 제 3 금속 원소는 Sn, Cu, In, Sb 및 Zn으로 이루어진 그룹에서 선택된 적어도 하나의 원소인 것을 특징으로 하는 Pb를 함유하지 않은 솔더 조성물.
- 제 1항에 있어서, 상기 제 2 금속 원소는 Ag, Cu 및 Zn으로 이루어진 그룹에서 선택된 적어도 하나의 원소인 것을 특징으로 하는 Pb를 함유하지 않은 솔더 조성물.
- 제 1항에 있어서, 상기 제 2 금속 원소는 전체 솔더 조성물에 대해 0.1중량%∼9.9중량%인 것을 특징으로 하는 Pb를 함유하지 않은 솔더 조성물.
- 제 3항에 있어서, 상기 제 2 금속 원소는 Ag이고, 상기 제 3 금속 원소는 전체 솔더 조성물에 대해 0.1중량%∼0.5중량%의 Sn, 0.1중량%∼0.3중량%의 Cu, 0.1중량%∼0.5중량%의 In, 0.1중량%∼3.0중량%의 Sb, 0.1중량%∼3.0중량%의 Zn으로 이루어진 그룹에서 선택된 적어도 하나를 포함하는 것을 특징으로 하는 Pb를 함유하지 않은 솔더 조성물.
- 제 3항에 있어서, 상기 제 3 금속 원소는 Ge 및 P로 이루어진 그룹에서 선택된 적어도 하나를 더 포함하는 것을 특징으로 하는 Pb를 함유하지 않은 솔더 조성물.
- 제 7항에 있어서, 상기 제 3 금속 원소는 전체 솔더 조성물에 대해 0.01중량%∼0.1중량%인 것을 특징으로 하는 Pb를 함유하지 않은 솔더 조성물.
- 제 1항에 있어서, 전체 솔더 조성물에 대해 상기 제 1 금속 원소는 94.5중량% 이하이고, 상기 제 2 금속 원소는 0.15중량%∼3.0중량%인 것을 특징으로 하는 Pb를 함유하지 않은 솔더 조성물.
- 표면 상에 도체패턴을 갖는 기판; 상기 도체패턴에 전기적, 기계적으로 접속되도록 배치된 제 1∼제 9항 중 어느 한 항에 따른 Pb를 함유하지 않은 솔더 조성물을 포함하는 것을 특징으로 하는 Pb를 함유하지 않은 솔더링된 물품.
- 제 10항에 있어서, 상기 기판은 표면 상에 전극패턴을 갖는 유리기판이고, 리드선은 상기 Pb를 함유하지 않은 솔더 조성물을 개재하여 상기 전극에 접속되는 것을 특징으로 하는 Pb를 함유하지 않은 솔더링된 물품.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000175757A JP3671815B2 (ja) | 2000-06-12 | 2000-06-12 | はんだ組成物およびはんだ付け物品 |
JP2000-175757 | 2000-06-12 |
Publications (2)
Publication Number | Publication Date |
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KR20010112627A true KR20010112627A (ko) | 2001-12-20 |
KR100419274B1 KR100419274B1 (ko) | 2004-02-19 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR10-2001-0032846A KR100419274B1 (ko) | 2000-06-12 | 2001-06-12 | Pb를 함유하지 않은 솔더 조성물 및 솔더링된 물품 |
Country Status (5)
Country | Link |
---|---|
US (2) | US6703113B2 (ko) |
JP (1) | JP3671815B2 (ko) |
KR (1) | KR100419274B1 (ko) |
CN (1) | CN1181948C (ko) |
FR (1) | FR2810051B1 (ko) |
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JP3592486B2 (ja) * | 1997-06-18 | 2004-11-24 | 株式会社東芝 | ハンダ付け装置 |
DE19729545A1 (de) * | 1997-07-10 | 1999-01-14 | Euromat Gmbh | Lotlegierung |
JP3761678B2 (ja) * | 1997-07-17 | 2006-03-29 | 松下電器産業株式会社 | 錫含有鉛フリーはんだ合金及びそのクリームはんだ並びにその製造方法 |
US6210860B1 (en) * | 1998-04-09 | 2001-04-03 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Recording medium |
JP3829475B2 (ja) * | 1998-05-13 | 2006-10-04 | 株式会社村田製作所 | Cu系母材接合用のはんだ組成物 |
-
2000
- 2000-06-12 JP JP2000175757A patent/JP3671815B2/ja not_active Expired - Lifetime
-
2001
- 2001-06-11 US US09/878,818 patent/US6703113B2/en not_active Expired - Lifetime
- 2001-06-12 CN CNB011210079A patent/CN1181948C/zh not_active Expired - Lifetime
- 2001-06-12 KR KR10-2001-0032846A patent/KR100419274B1/ko active IP Right Grant
- 2001-06-12 FR FR0107647A patent/FR2810051B1/fr not_active Expired - Lifetime
-
2003
- 2003-11-12 US US10/704,814 patent/US20040096632A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20040096632A1 (en) | 2004-05-20 |
US20020012608A1 (en) | 2002-01-31 |
US6703113B2 (en) | 2004-03-09 |
CN1328898A (zh) | 2002-01-02 |
JP2001353590A (ja) | 2001-12-25 |
KR100419274B1 (ko) | 2004-02-19 |
JP3671815B2 (ja) | 2005-07-13 |
FR2810051B1 (fr) | 2006-01-27 |
FR2810051A1 (fr) | 2001-12-14 |
CN1181948C (zh) | 2004-12-29 |
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