KR102657819B1 - 열경화성 수지 조성물, 절연성 필름, 층간 절연성 필름, 다층 배선판, 및 반도체 장치 - Google Patents

열경화성 수지 조성물, 절연성 필름, 층간 절연성 필름, 다층 배선판, 및 반도체 장치 Download PDF

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Publication number: KR102657819B1
Authority: KR; South Korea
Prior art keywords: thermosetting resin; insulating film; resin composition; cured product; interlayer insulating
Prior art date: 2017-11-24

Application number

KR1020207014837A

Other languages

English (en)

Korean (ko)

Other versions

KR20200079508A (ko

Inventor

츠요시 구로카와

준야 사토

마사키 요시다

신 데라키

Original Assignee

나믹스 가부시끼가이샤

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-11-24

Filing date

2018-11-22

Publication date

2024-04-15

2018-11-22 Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤

2020-07-03 Publication of KR20200079508A publication Critical patent/KR20200079508A/ko

2024-04-15 Application granted granted Critical

2024-04-15 Publication of KR102657819B1 publication Critical patent/KR102657819B1/ko

Links

229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 72
239000011342 resin composition Substances 0.000 title claims abstract description 66
239000011229 interlayer Substances 0.000 title claims description 29
239000004065 semiconductor Substances 0.000 title claims description 16
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 88
239000000377 silicon dioxide Substances 0.000 claims abstract description 42
239000000945 filler Substances 0.000 claims abstract description 38
229920005989 resin Polymers 0.000 claims abstract description 20
239000011347 resin Substances 0.000 claims abstract description 20
239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 15
125000000217 alkyl group Chemical group 0.000 claims abstract description 12
125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 6
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 12
125000004432 carbon atom Chemical group C* 0.000 claims description 12
125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 6
229920002725 thermoplastic elastomer Polymers 0.000 claims description 5
OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical group C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 claims description 4
NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
125000000524 functional group Chemical group 0.000 claims description 4
238000010521 absorption reaction Methods 0.000 abstract description 18
125000006850 spacer group Chemical group 0.000 abstract 1
239000010408 film Substances 0.000 description 68
-1 coverlay Substances 0.000 description 15
238000000034 method Methods 0.000 description 15
229920001955 polyphenylene ether Polymers 0.000 description 11
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
229920000139 polyethylene terephthalate Polymers 0.000 description 9
239000005020 polyethylene terephthalate Substances 0.000 description 9
238000003756 stirring Methods 0.000 description 8
239000002994 raw material Substances 0.000 description 7
229910000679 solder Inorganic materials 0.000 description 7
YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
239000000463 material Substances 0.000 description 6
239000002245 particle Substances 0.000 description 6
239000000758 substrate Substances 0.000 description 6
230000007423 decrease Effects 0.000 description 5
239000003960 organic solvent Substances 0.000 description 5
125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 5
XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 4
229920001400 block copolymer Polymers 0.000 description 4
230000000052 comparative effect Effects 0.000 description 4
150000001875 compounds Chemical class 0.000 description 4
239000011889 copper foil Substances 0.000 description 4
125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
238000004519 manufacturing process Methods 0.000 description 4
ZYMHKOVQDOFPHH-UHFFFAOYSA-N trimethoxy(oct-1-enyl)silane Chemical compound CCCCCCC=C[Si](OC)(OC)OC ZYMHKOVQDOFPHH-UHFFFAOYSA-N 0.000 description 4
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
GAYWTJPBIQKDRC-UHFFFAOYSA-N 8-trimethoxysilyloctyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCCCCCCOC(=O)C(C)=C GAYWTJPBIQKDRC-UHFFFAOYSA-N 0.000 description 3
239000012790 adhesive layer Substances 0.000 description 3
238000004891 communication Methods 0.000 description 3
229920001971 elastomer Polymers 0.000 description 3
239000000806 elastomer Substances 0.000 description 3
239000003063 flame retardant Substances 0.000 description 3
238000005227 gel permeation chromatography Methods 0.000 description 3
239000002184 metal Substances 0.000 description 3
229910052751 metal Inorganic materials 0.000 description 3
239000000243 solution Substances 0.000 description 3
239000002904 solvent Substances 0.000 description 3
150000003440 styrenes Chemical class 0.000 description 3
238000004381 surface treatment Methods 0.000 description 3
LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 2
239000004793 Polystyrene Substances 0.000 description 2
239000011324 bead Substances 0.000 description 2
230000001588 bifunctional effect Effects 0.000 description 2
230000005540 biological transmission Effects 0.000 description 2
239000007822 coupling agent Substances 0.000 description 2
238000001035 drying Methods 0.000 description 2
239000011888 foil Substances 0.000 description 2
239000005350 fused silica glass Substances 0.000 description 2
238000002156 mixing Methods 0.000 description 2
239000000203 mixture Substances 0.000 description 2
229920002223 polystyrene Polymers 0.000 description 2
239000007787 solid Substances 0.000 description 2
229920006132 styrene block copolymer Polymers 0.000 description 2
VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 2
BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
229920002633 Kraton (polymer) Polymers 0.000 description 1
PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
239000005062 Polybutadiene Substances 0.000 description 1
239000000654 additive Substances 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
239000002518 antifoaming agent Substances 0.000 description 1
239000003963 antioxidant agent Substances 0.000 description 1
239000003849 aromatic solvent Substances 0.000 description 1
238000011088 calibration curve Methods 0.000 description 1
238000005119 centrifugation Methods 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
239000012787 coverlay film Substances 0.000 description 1
229910002026 crystalline silica Inorganic materials 0.000 description 1
XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
125000004122 cyclic group Chemical group 0.000 description 1
230000007547 defect Effects 0.000 description 1
239000002270 dispersing agent Substances 0.000 description 1
238000009826 distribution Methods 0.000 description 1
238000007606 doctor blade method Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
BXOUVIIITJXIKB-UHFFFAOYSA-N ethene;styrene Chemical group C=C.C=CC1=CC=CC=C1 BXOUVIIITJXIKB-UHFFFAOYSA-N 0.000 description 1
238000006266 etherification reaction Methods 0.000 description 1
238000001914 filtration Methods 0.000 description 1
238000009472 formulation Methods 0.000 description 1
239000007789 gas Substances 0.000 description 1
230000002068 genetic effect Effects 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
150000002430 hydrocarbons Chemical group 0.000 description 1
230000003301 hydrolyzing effect Effects 0.000 description 1
125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
239000005453 ketone based solvent Substances 0.000 description 1
238000010030 laminating Methods 0.000 description 1
230000007774 longterm Effects 0.000 description 1
MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
229960003493 octyltriethoxysilane Drugs 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
125000000962 organic group Chemical group 0.000 description 1
150000001451 organic peroxides Chemical class 0.000 description 1
238000005691 oxidative coupling reaction Methods 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
229920002857 polybutadiene Polymers 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920001225 polyester resin Polymers 0.000 description 1
239000004645 polyester resin Substances 0.000 description 1
229920013716 polyethylene resin Polymers 0.000 description 1
229920001296 polysiloxane Polymers 0.000 description 1
229920005996 polystyrene-poly(ethylene-butylene)-polystyrene Polymers 0.000 description 1
QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
230000009257 reactivity Effects 0.000 description 1
230000035939 shock Effects 0.000 description 1
235000012239 silicon dioxide Nutrition 0.000 description 1
239000002002 slurry Substances 0.000 description 1
238000005476 soldering Methods 0.000 description 1
238000005507 spraying Methods 0.000 description 1
239000011550 stock solution Substances 0.000 description 1
238000003860 storage Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
230000008961 swelling Effects 0.000 description 1
239000013008 thixotropic agent Substances 0.000 description 1
JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
RKLXSINPXIQKIB-UHFFFAOYSA-N trimethoxy(oct-7-enyl)silane Chemical compound CO[Si](OC)(OC)CCCCCCC=C RKLXSINPXIQKIB-UHFFFAOYSA-N 0.000 description 1
239000008096 xylene Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate

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Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Compositions Of Macromolecular Compounds (AREA)
Laminated Bodies (AREA)
Macromonomer-Based Addition Polymer (AREA)
Formation Of Insulating Films (AREA)

KR1020207014837A 2017-11-24 2018-11-22 열경화성 수지 조성물, 절연성 필름, 층간 절연성 필름, 다층 배선판, 및 반도체 장치 KR102657819B1 (ko)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JPJP-P-2017-225470		2017-11-24
JP2017225470		2017-11-24
PCT/JP2018/043120 WO2019103082A1 (ja)	2017-11-24	2018-11-22	熱硬化性樹脂組成物、絶縁性フィルム、層間絶縁性フィルム、多層配線板、および半導体装置

Publications (2)

Publication Number	Publication Date
KR20200079508A KR20200079508A (ko)	2020-07-03
KR102657819B1 true KR102657819B1 (ko)	2024-04-15

Family

ID=66631558

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020207014837A KR102657819B1 (ko)	2017-11-24	2018-11-22	열경화성 수지 조성물, 절연성 필름, 층간 절연성 필름, 다층 배선판, 및 반도체 장치

Country Status (5)

Country	Link
JP (1)	JP7204214B2 (zh)
KR (1)	KR102657819B1 (zh)
CN (1)	CN111372960B (zh)
TW (1)	TWI772562B (zh)
WO (1)	WO2019103082A1 (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2007056170A (ja)	2005-08-25	2007-03-08	Matsushita Electric Works Ltd	ポリフェニレンエーテル樹脂組成物、プリプレグ及び積層体
JP2010111758A (ja)	2008-11-06	2010-05-20	Hitachi Chem Co Ltd	樹脂組成物、プリプレグ、積層板及びプリント基板
JP2013111758A (ja)	2011-11-25	2013-06-10	Canon Inc	プリント装置および測色装置
JP2017009715A (ja) *	2015-06-18	2017-01-12	太陽インキ製造株式会社	光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6352782B2 (en) *	1999-12-01	2002-03-05	General Electric Company	Poly(phenylene ether)-polyvinyl thermosetting resin
JP5885585B2 (ja) *	2012-05-21	2016-03-15	昭和電工株式会社	硬化性組成物およびその硬化物
JP6672630B2 (ja) *	2015-08-07	2020-03-25	味の素株式会社	樹脂組成物
JP6638380B2 (ja)	2015-12-22	2020-01-29	日立化成株式会社	先供給型アンダーフィル材及びその硬化物、並びに電子部品装置及びその製造方法

2018
- 2018-11-22 JP JP2019555355A patent/JP7204214B2/ja active Active
- 2018-11-22 TW TW107141680A patent/TWI772562B/zh active
- 2018-11-22 KR KR1020207014837A patent/KR102657819B1/ko active IP Right Grant
- 2018-11-22 WO PCT/JP2018/043120 patent/WO2019103082A1/ja active Application Filing
- 2018-11-22 CN CN201880074803.8A patent/CN111372960B/zh active Active

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2007056170A (ja)	2005-08-25	2007-03-08	Matsushita Electric Works Ltd	ポリフェニレンエーテル樹脂組成物、プリプレグ及び積層体
JP2010111758A (ja)	2008-11-06	2010-05-20	Hitachi Chem Co Ltd	樹脂組成物、プリプレグ、積層板及びプリント基板
JP2013111758A (ja)	2011-11-25	2013-06-10	Canon Inc	プリント装置および測色装置
JP2017009715A (ja) *	2015-06-18	2017-01-12	太陽インキ製造株式会社	光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Also Published As

Publication number	Publication date
JPWO2019103082A1 (ja)	2020-12-03
CN111372960B (zh)	2023-01-24
TW201930463A (zh)	2019-08-01
JP7204214B2 (ja)	2023-01-16
TWI772562B (zh)	2022-08-01
KR20200079508A (ko)	2020-07-03
CN111372960A (zh)	2020-07-03
WO2019103082A1 (ja)	2019-05-31

Legal Events

Date	Code	Title
2021-09-09	A201	Request for examination
2021-09-09	AMND	Amendment
2023-09-15	E902	Notification of reason for refusal
2023-11-10	AMND	Amendment
2024-02-13	E601	Decision to refuse application
2024-02-13	X091	Application refused [patent]
2024-03-20	AMND	Amendment
2024-04-01	X701	Decision to grant (after re-examination)
2024-04-11	GRNT	Written decision to grant

Publication	Publication Date	Title
JP7202691B2 (ja)	2023-01-12	樹脂組成物、フィルム、積層板および半導体装置
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JP6443735B2 (ja)	2018-12-26	樹脂組成物、それを用いた絶縁フィルムおよび半導体装置
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JP6917636B2 (ja)	2021-08-11	樹脂組成物、それを用いた熱硬化性フィルム、樹脂硬化物、積層板、プリント配線板、および半導体装置
JP6570259B2 (ja)	2019-09-04	樹脂組成物、絶縁フィルム、および半導体装置
JP6675183B2 (ja)	2020-04-01	熱硬化性樹脂組成物、熱硬化性樹脂フィルム、プリント配線板、および半導体装置
JP7264485B2 (ja)	2023-04-25	熱硬化性樹脂組成物、絶縁性フィルム、層間絶縁性フィルム、多層配線板、および半導体装置
TWI818994B (zh)	2023-10-21	熱硬化性樹脂組成物、包含其之薄膜，以及使用該等之多層配線板
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