KR102522237B1 - 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 터치 패널의 제조 방법 - Google Patents

감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 터치 패널의 제조 방법 Download PDF

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Publication number
KR102522237B1
KR102522237B1 KR1020187008152A KR20187008152A KR102522237B1 KR 102522237 B1 KR102522237 B1 KR 102522237B1 KR 1020187008152 A KR1020187008152 A KR 1020187008152A KR 20187008152 A KR20187008152 A KR 20187008152A KR 102522237 B1 KR102522237 B1 KR 102522237B1
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KR
South Korea
Prior art keywords
photosensitive
component
layer
resin composition
meth
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KR1020187008152A
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English (en)
Korean (ko)
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KR20180061173A (ko
Inventor
나오키 히라마츠
하루히사 타마다
노리요 키무라
후우카 히라야마
Original Assignee
가부시끼가이샤 레조낙
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Publication of KR20180061173A publication Critical patent/KR20180061173A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020187008152A 2015-09-28 2016-03-28 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 터치 패널의 제조 방법 KR102522237B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015190016 2015-09-28
JPJP-P-2015-190016 2015-09-28
PCT/JP2016/059927 WO2017056530A1 (ja) 2015-09-28 2016-03-28 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びタッチパネルの製造方法

Publications (2)

Publication Number Publication Date
KR20180061173A KR20180061173A (ko) 2018-06-07
KR102522237B1 true KR102522237B1 (ko) 2023-04-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187008152A KR102522237B1 (ko) 2015-09-28 2016-03-28 감광성 수지 조성물, 감광성 엘리먼트, 레지스터 패턴의 형성 방법 및 터치 패널의 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2017056530A1 (ja)
KR (1) KR102522237B1 (ja)
CN (1) CN108027556B (ja)
TW (1) TWI707202B (ja)
WO (1) WO2017056530A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7455954B2 (ja) * 2020-03-02 2024-03-26 富士フイルム株式会社 感光性転写材料、及び回路配線の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
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JP2004212805A (ja) * 2003-01-07 2004-07-29 Asahi Kasei Electronics Co Ltd 光重合性樹脂組成物
WO2009125940A2 (ko) 2008-04-10 2009-10-15 주식회사 엘지화학 광활성 화합물 및 이를 포함하는 감광성 수지 조성물
WO2015005546A1 (ko) 2013-07-11 2015-01-15 제일모직 주식회사 흑색 감광성 수지 조성물 및 이를 이용한 차광층

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US6197480B1 (en) * 1995-06-12 2001-03-06 Toray Industries, Inc. Photosensitive paste, a plasma display, and a method for the production thereof
JP2003107695A (ja) 1999-05-27 2003-04-09 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP3419744B2 (ja) 2000-07-26 2003-06-23 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP3487294B2 (ja) 2001-03-08 2004-01-13 日立化成工業株式会社 感光性樹脂組成物とその利用
JP4219641B2 (ja) 2002-08-26 2009-02-04 新日鐵化学株式会社 アルカリ現像型感光性樹脂組成物
JP4992633B2 (ja) 2006-10-04 2012-08-08 日立化成工業株式会社 感光性樹脂組成物及びこれを用いた感光性エレメント
JP5151446B2 (ja) 2007-07-18 2013-02-27 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP5056301B2 (ja) * 2007-09-20 2012-10-24 Ｊｓｒ株式会社 感放射線性樹脂組成物および液晶表示素子用スペーサーとその製造法
JP5516844B2 (ja) * 2008-03-24 2014-06-11 Ｊｓｒ株式会社 感放射線性樹脂組成物、スペーサーおよびその製造方法ならびに液晶表示素子
JP4855536B1 (ja) 2010-12-20 2012-01-18 日本写真印刷株式会社 防錆性に優れたタッチ入力シートの製造方法
CN104246611B (zh) * 2012-03-30 2018-12-04 富士胶片株式会社 黑色树脂膜、静电电容型输入装置及它们的制造方法及具备其的图像显示装置
WO2014050567A1 (ja) * 2012-09-27 2014-04-03 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びタッチパネルの製造方法
JP6158765B2 (ja) * 2013-09-02 2017-07-05 富士フイルム株式会社 感放射線性組成物、カラーフィルタおよびその製造方法、ならびに、固体撮像素子
JP6167017B2 (ja) * 2013-10-31 2017-07-19 富士フイルム株式会社 積層体、有機半導体製造用キットおよび有機半導体製造用レジスト組成物
JP6361191B2 (ja) * 2014-03-14 2018-07-25 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びタッチパネルの製造方法
JP6165805B2 (ja) * 2014-07-04 2017-07-19 富士フイルム株式会社 硬化性組成物、硬化膜の製造方法、硬化膜、並びに、タッチパネル及び表示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004212805A (ja) * 2003-01-07 2004-07-29 Asahi Kasei Electronics Co Ltd 光重合性樹脂組成物
WO2009125940A2 (ko) 2008-04-10 2009-10-15 주식회사 엘지화학 광활성 화합물 및 이를 포함하는 감광성 수지 조성물
WO2015005546A1 (ko) 2013-07-11 2015-01-15 제일모직 주식회사 흑색 감광성 수지 조성물 및 이를 이용한 차광층

Also Published As

Publication number Publication date
CN108027556B (zh) 2022-05-06
JPWO2017056530A1 (ja) 2018-08-30
TWI707202B (zh) 2020-10-11
KR20180061173A (ko) 2018-06-07
TW201728998A (zh) 2017-08-16
WO2017056530A1 (ja) 2017-04-06
CN108027556A (zh) 2018-05-11

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