KR102392848B1 - 정렬 장치 및 정렬 방법 - Google Patents
정렬 장치 및 정렬 방법 Download PDFInfo
- Publication number
- KR102392848B1 KR102392848B1 KR1020150121548A KR20150121548A KR102392848B1 KR 102392848 B1 KR102392848 B1 KR 102392848B1 KR 1020150121548 A KR1020150121548 A KR 1020150121548A KR 20150121548 A KR20150121548 A KR 20150121548A KR 102392848 B1 KR102392848 B1 KR 102392848B1
- Authority
- KR
- South Korea
- Prior art keywords
- holding surface
- holding
- alignment
- chip
- adhesive sheet
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02304—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment formation of intermediate layers, e.g. buffer layers, layers to improve adhesion, lattice match or diffusion barriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2014-178407 | 2014-09-02 | ||
JP2014178407A JP6371641B2 (ja) | 2014-09-02 | 2014-09-02 | 整列装置および整列方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160027924A KR20160027924A (ko) | 2016-03-10 |
KR102392848B1 true KR102392848B1 (ko) | 2022-04-29 |
Family
ID=55422561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150121548A KR102392848B1 (ko) | 2014-09-02 | 2015-08-28 | 정렬 장치 및 정렬 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6371641B2 (zh) |
KR (1) | KR102392848B1 (zh) |
CN (1) | CN105390420B (zh) |
TW (1) | TWI650280B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109417045B (zh) * | 2016-06-28 | 2023-06-23 | 琳得科株式会社 | 调准夹具、调准方法及转移粘接方法 |
CN107812719B (zh) * | 2017-10-24 | 2019-11-29 | 上海理工大学 | 钥匙坯分拣排序*** |
JP7320932B2 (ja) * | 2017-11-10 | 2023-08-04 | 芝浦メカトロニクス株式会社 | 成膜装置及び部品剥離装置 |
JP6970432B2 (ja) * | 2017-11-30 | 2021-11-24 | 三星ダイヤモンド工業株式会社 | 基板整列装置 |
CN108364900B (zh) * | 2018-04-02 | 2024-03-08 | 无锡星微科技有限公司 | 一种气缸校准台 |
CN108946004B (zh) * | 2018-05-30 | 2020-04-07 | 江苏易高烟草机械有限公司 | 用于分拣或缓存输送过程中的可移动订单分隔装置及方法 |
KR102157647B1 (ko) * | 2018-11-30 | 2020-09-18 | (주)플렉스컴 | 웨이퍼 전사 장치 및 방법 |
CN111153195B (zh) * | 2019-12-30 | 2021-11-09 | 中山市威定机械制造有限公司 | 一种双模条自动绕线生产线 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000327070A (ja) | 1999-05-18 | 2000-11-28 | Hitachi Ltd | 梱包方法および搬送方法ならびに半導体装置の製造方法 |
JP2001113420A (ja) | 1999-10-19 | 2001-04-24 | Sharp Corp | 位置決め方法及びその装置 |
JP2002064131A (ja) | 2000-08-18 | 2002-02-28 | Lintec Corp | チップ状部品の剥離方法 |
JP2002071337A (ja) * | 2000-08-25 | 2002-03-08 | Noozeru Engineering Kk | 位置決め装置および位置決め方法 |
JP2013219245A (ja) * | 2012-04-10 | 2013-10-24 | Canon Machinery Inc | 半導体装置の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09183024A (ja) * | 1995-12-28 | 1997-07-15 | Taiyo Yuden Co Ltd | ワーク挿入方法及びその装置 |
TWI225279B (en) * | 2002-03-11 | 2004-12-11 | Hitachi Ltd | Semiconductor device and its manufacturing method |
JP5912274B2 (ja) | 2011-03-28 | 2016-04-27 | 株式会社東京精密 | チップ分割離間装置、及びチップ分割離間方法 |
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2014
- 2014-09-02 JP JP2014178407A patent/JP6371641B2/ja active Active
-
2015
- 2015-08-21 TW TW104127330A patent/TWI650280B/zh active
- 2015-08-28 KR KR1020150121548A patent/KR102392848B1/ko active IP Right Grant
- 2015-09-02 CN CN201510555842.8A patent/CN105390420B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000327070A (ja) | 1999-05-18 | 2000-11-28 | Hitachi Ltd | 梱包方法および搬送方法ならびに半導体装置の製造方法 |
JP2001113420A (ja) | 1999-10-19 | 2001-04-24 | Sharp Corp | 位置決め方法及びその装置 |
JP2002064131A (ja) | 2000-08-18 | 2002-02-28 | Lintec Corp | チップ状部品の剥離方法 |
JP2002071337A (ja) * | 2000-08-25 | 2002-03-08 | Noozeru Engineering Kk | 位置決め装置および位置決め方法 |
JP2013219245A (ja) * | 2012-04-10 | 2013-10-24 | Canon Machinery Inc | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6371641B2 (ja) | 2018-08-08 |
KR20160027924A (ko) | 2016-03-10 |
CN105390420B (zh) | 2020-07-28 |
TWI650280B (zh) | 2019-02-11 |
CN105390420A (zh) | 2016-03-09 |
JP2016054169A (ja) | 2016-04-14 |
TW201628949A (zh) | 2016-08-16 |
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GRNT | Written decision to grant |