KR102392848B1 - 정렬 장치 및 정렬 방법 - Google Patents

정렬 장치 및 정렬 방법 Download PDF

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Publication number
KR102392848B1
KR102392848B1 KR1020150121548A KR20150121548A KR102392848B1 KR 102392848 B1 KR102392848 B1 KR 102392848B1 KR 1020150121548 A KR1020150121548 A KR 1020150121548A KR 20150121548 A KR20150121548 A KR 20150121548A KR 102392848 B1 KR102392848 B1 KR 102392848B1
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KR
South Korea
Prior art keywords
holding surface
holding
alignment
chip
adhesive sheet
Prior art date
Application number
KR1020150121548A
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English (en)
Korean (ko)
Other versions
KR20160027924A (ko
Inventor
기미히코 가와사키
Original Assignee
린텍 가부시키가이샤
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Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20160027924A publication Critical patent/KR20160027924A/ko
Application granted granted Critical
Publication of KR102392848B1 publication Critical patent/KR102392848B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02304—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment formation of intermediate layers, e.g. buffer layers, layers to improve adhesion, lattice match or diffusion barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020150121548A 2014-09-02 2015-08-28 정렬 장치 및 정렬 방법 KR102392848B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-178407 2014-09-02
JP2014178407A JP6371641B2 (ja) 2014-09-02 2014-09-02 整列装置および整列方法

Publications (2)

Publication Number Publication Date
KR20160027924A KR20160027924A (ko) 2016-03-10
KR102392848B1 true KR102392848B1 (ko) 2022-04-29

Family

ID=55422561

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150121548A KR102392848B1 (ko) 2014-09-02 2015-08-28 정렬 장치 및 정렬 방법

Country Status (4)

Country Link
JP (1) JP6371641B2 (zh)
KR (1) KR102392848B1 (zh)
CN (1) CN105390420B (zh)
TW (1) TWI650280B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109417045B (zh) * 2016-06-28 2023-06-23 琳得科株式会社 调准夹具、调准方法及转移粘接方法
CN107812719B (zh) * 2017-10-24 2019-11-29 上海理工大学 钥匙坯分拣排序***
JP7320932B2 (ja) * 2017-11-10 2023-08-04 芝浦メカトロニクス株式会社 成膜装置及び部品剥離装置
JP6970432B2 (ja) * 2017-11-30 2021-11-24 三星ダイヤモンド工業株式会社 基板整列装置
CN108364900B (zh) * 2018-04-02 2024-03-08 无锡星微科技有限公司 一种气缸校准台
CN108946004B (zh) * 2018-05-30 2020-04-07 江苏易高烟草机械有限公司 用于分拣或缓存输送过程中的可移动订单分隔装置及方法
KR102157647B1 (ko) * 2018-11-30 2020-09-18 (주)플렉스컴 웨이퍼 전사 장치 및 방법
CN111153195B (zh) * 2019-12-30 2021-11-09 中山市威定机械制造有限公司 一种双模条自动绕线生产线

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000327070A (ja) 1999-05-18 2000-11-28 Hitachi Ltd 梱包方法および搬送方法ならびに半導体装置の製造方法
JP2001113420A (ja) 1999-10-19 2001-04-24 Sharp Corp 位置決め方法及びその装置
JP2002064131A (ja) 2000-08-18 2002-02-28 Lintec Corp チップ状部品の剥離方法
JP2002071337A (ja) * 2000-08-25 2002-03-08 Noozeru Engineering Kk 位置決め装置および位置決め方法
JP2013219245A (ja) * 2012-04-10 2013-10-24 Canon Machinery Inc 半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09183024A (ja) * 1995-12-28 1997-07-15 Taiyo Yuden Co Ltd ワーク挿入方法及びその装置
TWI225279B (en) * 2002-03-11 2004-12-11 Hitachi Ltd Semiconductor device and its manufacturing method
JP5912274B2 (ja) 2011-03-28 2016-04-27 株式会社東京精密 チップ分割離間装置、及びチップ分割離間方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000327070A (ja) 1999-05-18 2000-11-28 Hitachi Ltd 梱包方法および搬送方法ならびに半導体装置の製造方法
JP2001113420A (ja) 1999-10-19 2001-04-24 Sharp Corp 位置決め方法及びその装置
JP2002064131A (ja) 2000-08-18 2002-02-28 Lintec Corp チップ状部品の剥離方法
JP2002071337A (ja) * 2000-08-25 2002-03-08 Noozeru Engineering Kk 位置決め装置および位置決め方法
JP2013219245A (ja) * 2012-04-10 2013-10-24 Canon Machinery Inc 半導体装置の製造方法

Also Published As

Publication number Publication date
JP6371641B2 (ja) 2018-08-08
KR20160027924A (ko) 2016-03-10
CN105390420B (zh) 2020-07-28
TWI650280B (zh) 2019-02-11
CN105390420A (zh) 2016-03-09
JP2016054169A (ja) 2016-04-14
TW201628949A (zh) 2016-08-16

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