KR102254056B1 - 프레임체 지그, 수지 공급 지그 및 그 계량 방법, 몰드 수지의 계량 장치 및 방법, 수지 공급 장치, 수지 공급 계량 장치 및 방법과, 수지 몰드 장치 및 방법 - Google Patents

프레임체 지그, 수지 공급 지그 및 그 계량 방법, 몰드 수지의 계량 장치 및 방법, 수지 공급 장치, 수지 공급 계량 장치 및 방법과, 수지 몰드 장치 및 방법 Download PDF

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Publication number
KR102254056B1
KR102254056B1 KR1020197019213A KR20197019213A KR102254056B1 KR 102254056 B1 KR102254056 B1 KR 102254056B1 KR 1020197019213 A KR1020197019213 A KR 1020197019213A KR 20197019213 A KR20197019213 A KR 20197019213A KR 102254056 B1 KR102254056 B1 KR 102254056B1
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KR
South Korea
Prior art keywords
resin
mold
film
jig
resin supply
Prior art date
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KR1020197019213A
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English (en)
Korean (ko)
Other versions
KR20190093607A (ko
Inventor
요시카즈 무라마츠
마사키 가와구치
미노루 하나자토
Original Assignee
아피쿠 야마다 가부시키가이샤
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Publication of KR20190093607A publication Critical patent/KR20190093607A/ko
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Publication of KR102254056B1 publication Critical patent/KR102254056B1/ko

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/34Feeding the material to the mould or the compression means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/58Measuring, controlling or regulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/58Measuring, controlling or regulating
    • B29C2043/5875Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR1020197019213A 2016-12-13 2017-07-06 프레임체 지그, 수지 공급 지그 및 그 계량 방법, 몰드 수지의 계량 장치 및 방법, 수지 공급 장치, 수지 공급 계량 장치 및 방법과, 수지 몰드 장치 및 방법 KR102254056B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016241266A JP6774865B2 (ja) 2016-12-13 2016-12-13 枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法
JPJP-P-2016-241266 2016-12-13
PCT/JP2017/024805 WO2018109967A1 (ja) 2016-12-13 2017-07-06 枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法

Publications (2)

Publication Number Publication Date
KR20190093607A KR20190093607A (ko) 2019-08-09
KR102254056B1 true KR102254056B1 (ko) 2021-05-20

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KR1020197019213A KR102254056B1 (ko) 2016-12-13 2017-07-06 프레임체 지그, 수지 공급 지그 및 그 계량 방법, 몰드 수지의 계량 장치 및 방법, 수지 공급 장치, 수지 공급 계량 장치 및 방법과, 수지 몰드 장치 및 방법

Country Status (5)

Country Link
JP (1) JP6774865B2 (zh)
KR (1) KR102254056B1 (zh)
CN (1) CN110099777B (zh)
TW (1) TWI735629B (zh)
WO (1) WO2018109967A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7213957B2 (ja) * 2019-04-19 2023-01-27 キヤノン株式会社 成形装置、成形方法、および物品の製造方法
JP7134926B2 (ja) * 2019-07-10 2022-09-12 Towa株式会社 樹脂成形装置、及び樹脂成形品の製造方法
CN110553785B (zh) * 2019-09-19 2020-12-01 嘉兴学院 一种高精度温度补偿型压力传感器
JP7291660B2 (ja) * 2020-04-17 2023-06-15 Towa株式会社 樹脂成形品の製造方法、樹脂成形装置
JP7406247B2 (ja) * 2020-05-22 2023-12-27 アピックヤマダ株式会社 樹脂モールド装置
JP7360365B2 (ja) * 2020-07-14 2023-10-12 Towa株式会社 樹脂材料供給装置、樹脂成形装置及び樹脂成形品の製造方法
JP7428384B2 (ja) * 2020-10-06 2024-02-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP7394732B2 (ja) * 2020-10-19 2023-12-08 Towa株式会社 樹脂供給方法、樹脂成形品の製造方法及び樹脂成形装置
JP7444453B2 (ja) * 2020-11-25 2024-03-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
CN112606330B (zh) * 2020-12-01 2022-06-21 博硕科技(江西)有限公司 一种ul三插自动成型的载具

Citations (4)

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JP2002014309A (ja) 2000-06-30 2002-01-18 Minolta Co Ltd フィルムホルダ、フィルム収容治具及びこれらを用いた液晶表示素子の製造方法
JP2005335117A (ja) 2004-05-25 2005-12-08 Sainekkusu:Kk 樹脂供給装置及び樹脂供給方法
JP2010036542A (ja) 2008-08-08 2010-02-18 Towa Corp 電子部品の圧縮成形方法及び金型装置
JP2013042017A (ja) 2011-08-17 2013-02-28 Apic Yamada Corp 樹脂モールド装置

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EP0711658B1 (en) * 1994-11-10 2002-10-23 Sumitomo Chemical Company Limited Multi-layer molded article and method for producing the same
WO1998002919A1 (fr) * 1996-07-12 1998-01-22 Fujitsu Limited Procede et moule de fabrication d'un dispositif a semiconducteur, dispositif a semiconducteur, et procede de montage du dispositif
JP4953619B2 (ja) * 2005-11-04 2012-06-13 Towa株式会社 電子部品の樹脂封止成形装置
JP5192749B2 (ja) * 2007-08-10 2013-05-08 Towa株式会社 光素子の樹脂封止成形方法及び装置
KR101950894B1 (ko) * 2011-11-08 2019-04-22 아피쿠 야마다 가부시키가이샤 수지 밀봉 장치
JP5786918B2 (ja) * 2013-10-23 2015-09-30 第一精工株式会社 樹脂封止金型およびこれを用いた樹脂封止装置、樹脂封止方法
JP6057880B2 (ja) * 2013-11-28 2017-01-11 Towa株式会社 圧縮成形装置の樹脂材料供給方法及び供給装置
JP6310773B2 (ja) * 2014-05-22 2018-04-11 Towa株式会社 樹脂成形装置及び樹脂成形方法
JP6456254B2 (ja) * 2015-06-16 2019-01-23 アピックヤマダ株式会社 フィルム搬送装置及びフィルム搬送方法並びに樹脂モールド装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002014309A (ja) 2000-06-30 2002-01-18 Minolta Co Ltd フィルムホルダ、フィルム収容治具及びこれらを用いた液晶表示素子の製造方法
JP2005335117A (ja) 2004-05-25 2005-12-08 Sainekkusu:Kk 樹脂供給装置及び樹脂供給方法
JP2010036542A (ja) 2008-08-08 2010-02-18 Towa Corp 電子部品の圧縮成形方法及び金型装置
JP2013042017A (ja) 2011-08-17 2013-02-28 Apic Yamada Corp 樹脂モールド装置

Also Published As

Publication number Publication date
TWI735629B (zh) 2021-08-11
KR20190093607A (ko) 2019-08-09
JP2018094797A (ja) 2018-06-21
TW201821236A (zh) 2018-06-16
CN110099777A (zh) 2019-08-06
JP6774865B2 (ja) 2020-10-28
WO2018109967A1 (ja) 2018-06-21
CN110099777B (zh) 2022-11-25

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