KR102236542B1 - 마스크 지지 템플릿, 마스크 금속막 지지 템플릿, 마스크 지지 템플릿의 제조 방법 및 프레임 일체형 마스크의 제조 방법 - Google Patents

마스크 지지 템플릿, 마스크 금속막 지지 템플릿, 마스크 지지 템플릿의 제조 방법 및 프레임 일체형 마스크의 제조 방법 Download PDF

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KR102236542B1
KR102236542B1 KR1020180153934A KR20180153934A KR102236542B1 KR 102236542 B1 KR102236542 B1 KR 102236542B1 KR 1020180153934 A KR1020180153934 A KR 1020180153934A KR 20180153934 A KR20180153934 A KR 20180153934A KR 102236542 B1 KR102236542 B1 KR 102236542B1
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KR1020180153934A
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KR20200067049A (ko
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이병일
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주식회사 오럼머티리얼
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Priority to KR1020180153934A priority Critical patent/KR102236542B1/ko
Priority to TW108142957A priority patent/TWI731482B/zh
Priority to CN201911213854.7A priority patent/CN111261802B/zh
Publication of KR20200067049A publication Critical patent/KR20200067049A/ko
Priority to KR1020210021174A priority patent/KR102404745B1/ko
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Publication of KR102236542B1 publication Critical patent/KR102236542B1/ko

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L51/0018—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
KR1020180153934A 2018-12-03 2018-12-03 마스크 지지 템플릿, 마스크 금속막 지지 템플릿, 마스크 지지 템플릿의 제조 방법 및 프레임 일체형 마스크의 제조 방법 KR102236542B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020180153934A KR102236542B1 (ko) 2018-12-03 2018-12-03 마스크 지지 템플릿, 마스크 금속막 지지 템플릿, 마스크 지지 템플릿의 제조 방법 및 프레임 일체형 마스크의 제조 방법
TW108142957A TWI731482B (zh) 2018-12-03 2019-11-26 掩模支撐模板、掩模金屬膜支撐模板、掩模支撐模板的製造方法及框架一體型掩模的製造方法
CN201911213854.7A CN111261802B (zh) 2018-12-03 2019-12-02 掩模支撑模板、掩模金属膜支撑模板、掩模支撑模板制造方法及框架一体型掩模制造方法
KR1020210021174A KR102404745B1 (ko) 2018-12-03 2021-02-17 마스크 지지 템플릿 및 프레임 일체형 마스크의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180153934A KR102236542B1 (ko) 2018-12-03 2018-12-03 마스크 지지 템플릿, 마스크 금속막 지지 템플릿, 마스크 지지 템플릿의 제조 방법 및 프레임 일체형 마스크의 제조 방법

Related Child Applications (1)

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KR1020210021174A Division KR102404745B1 (ko) 2018-12-03 2021-02-17 마스크 지지 템플릿 및 프레임 일체형 마스크의 제조 방법

Publications (2)

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KR20200067049A KR20200067049A (ko) 2020-06-11
KR102236542B1 true KR102236542B1 (ko) 2021-04-06

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KR1020180153934A KR102236542B1 (ko) 2018-12-03 2018-12-03 마스크 지지 템플릿, 마스크 금속막 지지 템플릿, 마스크 지지 템플릿의 제조 방법 및 프레임 일체형 마스크의 제조 방법

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KR (1) KR102236542B1 (zh)
CN (1) CN111261802B (zh)
TW (1) TWI731482B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102442459B1 (ko) * 2020-10-07 2022-09-14 주식회사 오럼머티리얼 마스크 지지 템플릿의 제조 방법, 마스크 지지 템플릿 및 프레임 일체형 마스크의 제조 방법
CN114481018A (zh) * 2020-10-23 2022-05-13 悟劳茂材料公司 掩模制造方法
KR102618776B1 (ko) * 2021-02-25 2023-12-29 주식회사 오럼머티리얼 프레임 일체형 마스크의 제조 방법
KR102560421B1 (ko) * 2021-03-29 2023-07-28 주식회사 오럼머티리얼 마스크 지지 템플릿, 프레임 일체형 마스크 및 이의 제조 방법
KR102660591B1 (ko) * 2021-09-16 2024-04-26 안병철 마스크세트 및 마스크 제조방법
KR102405552B1 (ko) * 2021-11-16 2022-06-07 (주)세우인코퍼레이션 Oled 증착용 메탈 마스크의 제조 방법
KR20240024587A (ko) * 2022-08-17 2024-02-26 엘지이노텍 주식회사 Oled 화소 증착을 위한 증착용 마스크
KR20240028214A (ko) * 2022-08-24 2024-03-05 엘지이노텍 주식회사 Oled 화소 증착을 위한 증착용 마스크

Citations (2)

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KR101274155B1 (ko) * 2012-02-09 2013-06-13 엘지디스플레이 주식회사 금속 마스크 제조방법
JP2018111879A (ja) * 2017-01-10 2018-07-19 大日本印刷株式会社 金属板、金属板の製造方法、マスクの製造方法およびマスク装置の製造方法

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KR200183547Y1 (ko) * 1997-12-24 2000-06-01 김영환 반도체 다이 본딩장치
JP2011195907A (ja) * 2010-03-19 2011-10-06 Tokyo Electron Ltd マスク保持装置及び薄膜形成装置
EP2592123B1 (en) * 2010-07-09 2020-02-19 Mitsui Chemicals, Inc. Pellicle and mask adhesive agent for use in same
JP6123301B2 (ja) * 2013-01-11 2017-05-10 大日本印刷株式会社 蒸着マスクの製造方法、金属マスク付き樹脂層、及び有機半導体素子の製造方法
KR102162790B1 (ko) * 2013-05-02 2020-10-08 삼성디스플레이 주식회사 마스크 프레임 조립체용 용접기
JP6341434B2 (ja) * 2016-03-29 2018-06-13 株式会社ブイ・テクノロジー 成膜マスク、その製造方法及び成膜マスクのリペア方法
JP7121918B2 (ja) * 2016-12-14 2022-08-19 大日本印刷株式会社 蒸着マスク装置及び蒸着マスク装置の製造方法

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
KR101274155B1 (ko) * 2012-02-09 2013-06-13 엘지디스플레이 주식회사 금속 마스크 제조방법
JP2018111879A (ja) * 2017-01-10 2018-07-19 大日本印刷株式会社 金属板、金属板の製造方法、マスクの製造方法およびマスク装置の製造方法

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CN111261802B (zh) 2023-04-07
KR20200067049A (ko) 2020-06-11
TWI731482B (zh) 2021-06-21
CN111261802A (zh) 2020-06-09
TW202023092A (zh) 2020-06-16

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