KR102015702B1 - 기판 처리 방법 및 기판 처리 장치 - Google Patents

기판 처리 방법 및 기판 처리 장치 Download PDF

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Publication number
KR102015702B1
KR102015702B1 KR1020170115926A KR20170115926A KR102015702B1 KR 102015702 B1 KR102015702 B1 KR 102015702B1 KR 1020170115926 A KR1020170115926 A KR 1020170115926A KR 20170115926 A KR20170115926 A KR 20170115926A KR 102015702 B1 KR102015702 B1 KR 102015702B1
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KR
South Korea
Prior art keywords
substrate
liquid
organic solvent
pattern
filler
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KR1020170115926A
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English (en)
Korean (ko)
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KR20180034229A (ko
Inventor
야스노리 가네마츠
Original Assignee
가부시키가이샤 스크린 홀딩스
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Publication of KR20180034229A publication Critical patent/KR20180034229A/ko
Application granted granted Critical
Publication of KR102015702B1 publication Critical patent/KR102015702B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020170115926A 2016-09-27 2017-09-11 기판 처리 방법 및 기판 처리 장치 KR102015702B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016188638 2016-09-27
JPJP-P-2016-188638 2016-09-27
JP2017153163A JP6983571B2 (ja) 2016-09-27 2017-08-08 基板処理方法および基板処理装置
JPJP-P-2017-153163 2017-08-08

Publications (2)

Publication Number Publication Date
KR20180034229A KR20180034229A (ko) 2018-04-04
KR102015702B1 true KR102015702B1 (ko) 2019-08-28

Family

ID=61837178

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170115926A KR102015702B1 (ko) 2016-09-27 2017-09-11 기판 처리 방법 및 기판 처리 장치

Country Status (3)

Country Link
JP (1) JP6983571B2 (zh)
KR (1) KR102015702B1 (zh)
TW (1) TWI648767B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7013309B2 (ja) * 2018-04-10 2022-01-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7308105B2 (ja) 2019-09-02 2023-07-13 東京エレクトロン株式会社 現像処理方法及び現像処理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011124313A (ja) * 2009-12-09 2011-06-23 Tokyo Electron Ltd 基板処理システム、基板処理装置、基板処理方法及び基板処理プログラムを記録した記録媒体
JP2012243869A (ja) * 2011-05-17 2012-12-10 Tokyo Electron Ltd 基板乾燥方法及び基板処理装置
JP2013016699A (ja) * 2011-07-05 2013-01-24 Toshiba Corp 基板処理方法及び基板処理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3300624B2 (ja) * 1997-01-24 2002-07-08 東京エレクトロン株式会社 基板端面の洗浄方法
JP5188216B2 (ja) * 2007-07-30 2013-04-24 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5806645B2 (ja) * 2012-06-12 2015-11-10 株式会社東芝 基板の乾燥方法、電子装置の製造方法及び基板の乾燥装置
JP5857001B2 (ja) * 2013-07-19 2016-02-10 東京エレクトロン株式会社 基板処理装置、基板処理方法及び基板処理用記録媒体
JP2015092539A (ja) * 2013-09-30 2015-05-14 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP6117711B2 (ja) * 2014-02-06 2017-04-19 信越化学工業株式会社 半導体基板の洗浄乾燥方法
KR102342131B1 (ko) * 2014-08-15 2021-12-21 가부시키가이샤 스크린 홀딩스 기판 처리 장치 및 기판 처리 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011124313A (ja) * 2009-12-09 2011-06-23 Tokyo Electron Ltd 基板処理システム、基板処理装置、基板処理方法及び基板処理プログラムを記録した記録媒体
JP2012243869A (ja) * 2011-05-17 2012-12-10 Tokyo Electron Ltd 基板乾燥方法及び基板処理装置
JP2013016699A (ja) * 2011-07-05 2013-01-24 Toshiba Corp 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
TW201820406A (zh) 2018-06-01
TWI648767B (zh) 2019-01-21
JP2018056553A (ja) 2018-04-05
KR20180034229A (ko) 2018-04-04
JP6983571B2 (ja) 2021-12-17

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