KR101766088B1

KR101766088B1 - Clad Sheet and preparation method

Info

Publication number: KR101766088B1
Application number: KR1020150177329A
Authority: KR
Inventors: 김영석; 노현우; 홍경국; 강수빈
Original assignee: 현대자동차주식회사
Priority date: 2015-12-11
Filing date: 2015-12-11
Publication date: 2017-08-07
Also published as: KR20170069740A

Abstract

The present invention provides a clad sheet including a jump lead that conducts a printed circuit board and a device, and a manufacturing method thereof, wherein the jump lead includes a plurality of first plates spaced apart from each other, A third plate formed of copper (Cu) is disposed between the plurality of first plates, and the second plate and the third plate are sequentially disposed And a method of manufacturing the clad sheet.

Description

[0001] Clad sheet and preparation method [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a clad sheet and a manufacturing method thereof, and more particularly, to a clad sheet capable of maintaining a heat radiation performance and enabling efficient electric conduction and a manufacturing method thereof.

Generally, a clad sheet refers to a laminated composite steel sheet in which two or more surfaces of a metal material are metallurgically bonded and integrated, and is widely applied to construction, home appliances, automobiles, heavy industries, and the like.

In such a clad sheet, the clad metal (Cladder or Clad Metal) generally occupies about 5% to 20% of the base material thickness and functions to impart the function to the clad sheet and to protect the base material from the use environment Etc.), and the base material plays a role of supporting the load acting on the structure.

These clad materials have been applied to various fields such as automobile, kitchenware, and aviation by complementing and improving the disadvantages of existing metal materials with other metal materials. The clad material manufacturing process can be classified into fusion-based bonding and solid-phase bonding depending on the main interface mechanism.

It is known that the general plate material manufacturing method is manufactured by rolling bonding method, explosion welding method, spot welding method, resistance welding method, brazing method and the like, and it is possible to apply heat and pressure of high temperature or high temperature simultaneously, Through diffusion of the substance by activation.

Particularly, in the case of the rolling joining method of dissimilar metal materials, it is most widely used in consideration of the convenience of the process which can utilize the existing process, the economical efficiency considering the productivity, and the ease of material combination.

Meanwhile, until now, the production of clad using stainless steel excellent in corrosion resistance and mechanical properties and excellent in corrosion resistance against aluminum or salt water, which is easy to be plasticized and has high thermal conductivity, is mainly made come.

A problem to be solved by the present invention is to provide a clad sheet which does not deteriorate heat dissipation performance and electrical conductivity even though Invar which replaces aluminum type wire or CIC jump lead (Cu / Invar / Cu Jump Lead) is applied .

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, in a clad sheet according to an embodiment of the present invention and a manufacturing method thereof, a clad sheet including a jump lead for conducting a printed circuit board and a device, A plurality of first plate members spaced apart from each other by a predetermined distance and spaced apart from each other by a predetermined distance, and a second plate member formed of Invar between the plurality of first plate members, And the third plate is formed by sequentially arranging the second plate and the third plate laterally.

Further, the jump lead plate member is rolled through the roller between room temperature, and the second plate member and the third plate member can be arranged in the same direction as the direction in which the jump lead is rolled.

The second plate and the third plate are sequentially arranged, and the second plate may be disposed on both sides.

The second plate may be disposed on both sides of the third plate.

Further, the plurality of first plates may be formed of copper (Cu) and rolled.

The third plate and the second plate may be provided in a ratio of 1: 1 to 6.5.

The second plate and the third plate may be provided at a ratio of 1: 4.

The details of other embodiments are included in the detailed description and drawings.

According to the clad sheet of the present invention and its manufacturing method, one or more of the following effects can be obtained.

First, according to the clad sheet of the present invention, copper (Cu) is disposed between Invar, heat and electricity are passed, and the clad sheet is disposed in the same direction as the rolling process, thereby improving the ease of the rolling process have.

Secondly, according to the clad sheet of the present invention, in the case of maximum stress, the smaller the current density is, the better the characteristics are.

Thirdly, according to the clad sheet of the present invention, the heat radiation performance through the printed circuit board is higher than that of the wire part, and most of the heat is cooled through the printed circuit board, The same effect can be obtained.

Fourthly, according to the clad sheet of the present invention, the stress applied to a silicon carbide (SiC) element is low and a greatest stress is generated in the CIC bonded to the copper (Cu) of the printed circuit board, Considering the strength, there is an effect of having very excellent durability.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

1 is a perspective view showing a clad sheet and a method of manufacturing the clad sheet according to the present invention.
2 is a perspective view showing a jump lead according to the present invention.
Figs. 3A and 3B are perspective views showing a first embodiment of a partial cross-sectional view of AA of Fig.
4A and 4B are perspective views showing a second embodiment.
5A and 5B are perspective views showing a third embodiment.
6A and 6B are perspective views showing a fourth embodiment.
7A and 7B are perspective views showing a fifth embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Hereinafter, the present invention will be described with reference to the drawings for explaining a clad sheet and a manufacturing method thereof according to embodiments of the present invention.

FIG. 1 is a perspective view showing a clad sheet according to the present invention and a manufacturing method thereof, FIG. 2 is a perspective view showing a jump lead according to the present invention, FIGS. 3a and 3b are cross- 4A and 4B are perspective views showing a second embodiment, Figs. 5A and 5B are perspective views showing a third embodiment, Figs. 6A and 6B are perspective views showing a fourth embodiment, 7 is a perspective view showing the fifth embodiment.

A preferred clad sheet of a vehicle and its manufacturing method can be changed by a person skilled in the art, and in this embodiment, the clad sheet and the manufacturing method thereof are used.

FIG. 1 is a perspective view showing a clad sheet according to the present invention and a manufacturing method thereof, FIG. 2 is a perspective view showing a jump lead according to the present invention, FIGS. 3a and 3b are cross- Fig.

First, in the case of maximum stress, the smaller the current density is, the more stable the current density is, and the better the current density is, the better the current density is. However, while the thermal stress pattern is the same, the balance is maintained, while the embodiments are displayed in different colors in the middle, and the balance is broken through thermal stress. In addition, a balance due to thermal stress is maintained on the basis of merely selecting a range, apart from a trade-off relationship.

The clad sheet according to the present invention includes a jump lead 30 connecting the printed circuit board 10 and the element 20 with reference to FIG. The bundle fly 30 has a plurality of first plate members 135 spaced upward and downward and a second plate member 140 formed of Invar is disposed between the plurality of first plate members 135 A third plate 150 formed of copper (Cu) is disposed between the plurality of first plates 135 and the second plate 140 and the third plate 150 are sequentially arranged in a row.

The jump lead 30 has a plurality of first plate members 140 spaced upward and downward. The plurality of first plates 135 may be formed of copper (Cu) and rolled. The jump lead 30 is provided with a second plate member 150 formed of Invar between the plurality of first plate members 135. The jump lead 30 is provided with a third plate 150 formed of copper (Cu) between the plurality of first plates 135. The second plate 140 and the third plate 150 are sequentially arranged in the lateral . The entire width of the third plate and the entire width of the second plate may be in a ratio of 1: 1 to 6.5. The jump lead 30 passes between the rollers at room temperature and is rolled, 140 and the third plate 150 can be arranged in the same direction as the direction in which the jump lead 30 is rolled.

The plurality of first plate members 135 are provided with a first upper plate member 135a disposed on the upper side of the second plate member 140 and the third plate member 150 and a first lower plate member 135b disposed on the lower side Rolled by rollers. The first plate member 140 and the third plate member 150 are disposed between the first upper plate member 135b and the first lower plate member 135b. The width of the second plate member 140 is 0.2 mm, and the width of the third plate member 150 is 0.2 mm. The number of the second plate members 140 and the number of the third plate member 150 are 1: 1, 1: 1, 1: 1, .

4A and 4B are perspective views showing a second embodiment.

4A and 4B, a plurality of first plate members 235 are disposed on the upper side of the second plate member 240 and the third plate member 250, And a first lower plate 235b disposed on the lower side, and is rolled by a roller. The first plate member 140 and the third plate member 150 are disposed between the first upper plate member 235b and the first lower plate member 235b.

The second plate 240 and the third plate 250 may be sequentially arranged and the second plate 240 may be disposed on both sides. The width of the second plate 240 is 0.1 mm, and the width of the third plate 250 is 0.32 mm. According to the embodiment, the total number of the second plate members 240 is 1.6 mm, the total number of the third plate members 250 is 0.4 mm and the number of the second plate member 240 and the third plate member 250 is 4 : 1.

In the case of both the first embodiment and the fifth embodiment to be described later, since the position of the first plate copper (Cu) is located close to one side in the case of a high temperature of 200 DEG C or more, . Since this can potentially be a major cause of deformation of the module, it is possible to relocate the position of the first plate copper (Cu) so that it is balanced to the left and right so as to prevent this.

On the other hand, the silicon carbide (SiC) device has a high efficiency at a high temperature. Therefore, it is preferable to configure the ratio of 1: 4 in the second embodiment in consideration of the electrical performance and the mechanical performance.

5A and 5B are perspective views showing a third embodiment.

5A and 5B, a plurality of first plate members 335 are disposed on the upper side of the second plate member 340 and the third plate member 350, And a first lower plate member 335b disposed on the lower side, and is rolled by a roller. The second upper plate 340 and the third plate 350 are disposed between the first upper plate 335b and the first lower plate 335b.

According to this, as compared with 1: 4 in the second embodiment, the maximum stress value was increased to 48.2 MPa as compared with the existing CIC. However, the current density was increased to 10 kA / cm 2 as compared to the second embodiment.

The second plate material 340 and the third plate material 350 may be sequentially arranged, and the second plate material 340 may be disposed on both sides. The width of the second plate member 340 is 0.36 mm, and the width of the third plate member 350 is 0.05 mm. The second plate material 340 and the third plate material 350 may have a ratio of 9: 1 to 1: 1, As shown in FIG.

6A and 6B are perspective views showing a fourth embodiment.

6A and 6B, the plurality of first plate members 435 includes a second upper plate member 440 and a first upper plate member 435a disposed on the upper side of the third plate 450, And a first lower plate member 435b disposed on the lower side, and is rolled by a roller. The first plate material 440 and the third plate material 450 are disposed between the first upper plate material 435b and the first lower plate material 435b.

The second plate 440 may be disposed on both sides and the third plate 450 may be disposed in the center of the second plate 440. [ The width of the second plate 440 may be 0.875 mm, and the width of the third plate 450 may be 0.25 mm. The second plate member 440 and the third plate member 450 have a ratio of 7: 1 (1: 1) to 5: 1 As shown in FIG.

6B, the maximum stress value is 46.37 MPa and the current density is 9.7 kA / cm 2. FIGS. 7A and 7B are perspective views showing the fifth embodiment.

7A and 7B, the plurality of first plate members 635 are disposed on the upper side of the second plate member 640 and the third plate 650, And a first lower plate 635b disposed on the lower side, and is rolled by a roller. The first plate material 640 and the third plate material 650 are disposed between the first upper plate material 635b and the first lower plate material 635b while being spaced apart from each other.

The second plate 640 and the third plate 650 may be sequentially arranged and the second plate 640 may be disposed on both sides. The width of the second plate 640 is 0.2 mm, and the width of the third plate 650 is 0.05 mm. The second plate 640 and the third plate 650 are formed to have a total length of 4 mm and a width of 4 mm. : 1. &Lt; / RTI >

According to this, as shown in FIG. 7B, the maximum stress was 53.67 MPa, and the current density was 8 kA / ㎠.

Therefore, copper (Cu), which is a third plate, is disposed between Invar, which is a second plate, and heat and electricity are passed. By arranging the clad sheet in the same direction as the rolling process, the ease of the rolling process is improved, In the case of stress, the more stable the current is, the lower the current density, the better the characteristics. The heat dissipation performance through the printed circuit board is improved than the wire part, and most of the heat is cooled through the printed circuit board, And the surface temperature distribution of the device become equal.

As described above, according to the present invention, since the device and the substrate are heated by applying 1200V and 20A, thermal stress and current density are minimized, and thermal stress is minimized and electric resistance is low, that is, .

The clad sheet according to the embodiment and the method of manufacturing the clad sheet according to the embodiment are not limited to the configuration and the method of the embodiments described above but the embodiments may be modified so that all or some of the embodiments Or may be selectively combined.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention.

<Detailed Description of Main Drawings>
10: printed circuit board 20: element
30: Jump lead

Claims

CLAIMS 1. A clad sheet comprising a jump lead for connecting a printed circuit board and an element,
The jump lead
And a plurality of first plate members spaced apart from each other,
A second plate member formed of Invar is disposed between the plurality of first plate members,
A third plate formed of copper (Cu) is disposed between the plurality of first plates,
The second plate member and the third plate member are sequentially arranged transversely,
Wherein the total width of the third plate and the total width of the second plate are in a ratio of 1: 1 to 6.5.

The method according to claim 1,
The first plate is passed between rollers at room temperature and rolled,
The second plate member and the third plate member,
The clad sheet being disposed in the same direction as the direction of rolling the jump leads.

The method according to claim 1,
Wherein the second plate and the third plate are sequentially arranged, and the second plate is disposed on both sides.

delete

The method according to claim 1,
And the second plate member is disposed on both sides of the third plate member.

The method according to claim 1,
Wherein the plurality of first plate members are formed of copper (Cu) and rolled.

delete

The method according to claim 1,
Wherein the total width of the third plate and the total width of the second plate are 1: 4.

Disposing a plurality of first plates, the first plate and the second plate being separated from each other;
Disposing a second plate formed of Invar between the plurality of first plates; And
Rolling a plurality of first plates by rolling a third plate formed of copper (Cu) between the plurality of first plates in sequence with the second plate and a roller of room temperature or high temperature;
Wherein the total width of the third plate and the total width of the second plate are in a ratio of 1: 1 to 6.5.

10. The method of claim 9,
In the step of rolling the plurality of first plates,
And the second plate and the third plate are disposed so as to face the same direction as the direction of rolling the plurality of first plates.