KR101762597B1 - Substrate for semiconductor light emitting device - Google Patents
Substrate for semiconductor light emitting device Download PDFInfo
- Publication number
- KR101762597B1 KR101762597B1 KR1020150179294A KR20150179294A KR101762597B1 KR 101762597 B1 KR101762597 B1 KR 101762597B1 KR 1020150179294 A KR1020150179294 A KR 1020150179294A KR 20150179294 A KR20150179294 A KR 20150179294A KR 101762597 B1 KR101762597 B1 KR 101762597B1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor light
- light emitting
- emitting device
- substrate
- bonding portion
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 203
- 239000000758 substrate Substances 0.000 title claims abstract description 172
- 239000010949 copper Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011651 chromium Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The present disclosure relates to a substrate for a semiconductor light emitting device on which a semiconductor light emitting device including a junction portion and a semiconductor light emitting device chip is mounted and a semiconductor light emitting device having a semiconductor light emitting device chip, A substrate, comprising: a substrate electrode formed on one surface of a substrate for a semiconductor light emitting device and electrically connected to an electrode of the semiconductor light emitting device chip; And a substrate bonding portion to which a bonding portion of the semiconductor light emitting device is bonded, wherein the substrate bonding portion is formed on a substrate surface of the semiconductor light emitting device substrate identical to the substrate electrode.
Description
The present disclosure relates generally to a substrate for a semiconductor light emitting device, and more particularly to a substrate for a semiconductor light emitting device having improved adhesion to a semiconductor light emitting device.
Herein, the background art relating to the present disclosure is provided, and these are not necessarily meant to be known arts. Also, in this specification, directional indication such as up / down, up / down, etc. is based on the drawings.
1 is a view showing an example of a conventional semiconductor light emitting device chip.
The semiconductor light emitting device chip includes a
2 is a view showing another example of the semiconductor light-emitting device chip disclosed in U.S. Patent No. 7,262,436. For ease of explanation, the drawing symbols have been changed.
The semiconductor light emitting device chip includes a
3 is a view showing an example of a conventional semiconductor light emitting device.
The semiconductor
4 is a view showing an example of a substrate for a semiconductor light emitting device disclosed in Korean Patent Laid-Open No. 10-2011-0119155. For ease of explanation, the drawing symbols have been changed.
The
The present disclosure relates to a substrate for a semiconductor light emitting device and provides a substrate for a semiconductor light emitting device having improved adhesion between a semiconductor light emitting device and a substrate for a semiconductor light emitting device when the semiconductor light emitting device and the substrate for a semiconductor light emitting device are electrically connected.
This will be described later in the Specification for Enforcement of the Invention.
SUMMARY OF THE INVENTION Herein, a general summary of the present disclosure is provided, which should not be construed as limiting the scope of the present disclosure. of its features).
According to one aspect of the present disclosure, this is provided.
This will be described later in the Specification for Enforcement of the Invention.
1 is a view showing an example of a conventional semiconductor light emitting device chip,
2 is a view showing another example of the semiconductor light-emitting device chip disclosed in U.S. Patent No. 7,262,436,
3 is a view showing an example of a conventional semiconductor light emitting device,
4 is a view showing an example of a substrate for a semiconductor light emitting device disclosed in Korean Patent Laid-Open No. 10-2011-0119155,
5 is a view illustrating an example of a semiconductor light emitting device used in a substrate for a semiconductor light emitting device according to the present disclosure;
6 is a view showing an example of a substrate for a semiconductor light emitting device according to the present disclosure,
7 is a view showing another example of a substrate for a semiconductor light emitting device according to the present disclosure,
8 is a view showing another example of the substrate for a semiconductor light emitting device according to the present disclosure,
9 is a view showing another example of a substrate for a semiconductor light emitting device according to the present disclosure,
10 is a view showing another example of a semiconductor light emitting device used in a substrate for a semiconductor light emitting device according to the present disclosure,
11 is a view showing various embodiments of a substrate for a semiconductor light emitting element according to the present disclosure;
The present disclosure will now be described in detail with reference to the accompanying drawings.
5 is a view showing an example of a semiconductor light emitting device used in a substrate for a semiconductor light emitting device according to the present disclosure.
Fig. 5 (a) is a perspective view, Fig. 5 (b) is a sectional view along AA ', and Fig. 5 (c) is a bottom view.
The semiconductor
The
The semiconductor light emitting
The
The joint 340 is located on the
6 is a view showing an example of a substrate for a semiconductor light emitting device according to the present disclosure. Sectional view (Fig. 6 (a)) and a plan view (Fig. 6 (b)) of a substrate portion for a semiconductor light emitting element in which a semiconductor light emitting element is mounted for convenience of explanation.
The
7 is a view showing another example of a substrate for a semiconductor light emitting device according to the present disclosure.
In the
8 is a view showing another example of the substrate for a semiconductor light emitting device according to the present disclosure.
A
9 is a view showing another example of a substrate for a semiconductor light emitting device according to the present disclosure. For convenience of explanation, is shown in a sectional view coupled with the semiconductor light emitting device.
The
10 is a view showing another example of a semiconductor light emitting device used in a substrate for a semiconductor light emitting device according to the present disclosure. 10 (a) and 10 (c) are bottom plan views, FIG. 10 (b) is a cross-sectional view taken along AA 'in FIG. 10 FIG.
The semiconductor
11 is a view showing various embodiments of a substrate for a semiconductor light emitting device according to the present disclosure.
A plurality of semiconductor light emitting devices may be mounted on the
Various embodiments of the present disclosure will be described.
(1) A substrate for a semiconductor light emitting device on which a semiconductor light emitting device including a junction and a semiconductor light emitting device chip is mounted, the semiconductor light emitting device comprising: a substrate for a semiconductor light emitting device in which an electrode of the semiconductor light emitting device chip is directly connected electrically to a substrate A substrate electrode formed on one surface of the substrate for a semiconductor light emitting device and electrically connected to an electrode of the semiconductor light emitting device chip; And a substrate bonding portion to which a bonding portion of the semiconductor light emitting device is bonded, the substrate bonding portion being formed on a surface of the substrate for a semiconductor light emitting device identical to the substrate electrode.
(2) A substrate for a semiconductor light-emitting element, wherein a substrate bonding portion surrounds a substrate electrode.
(3) The substrate for a semiconductor light-emitting device according to any one of (1) to (3), wherein the substrate bonding portion is formed of at least one of silver (Ag), copper (Cu), and gold (Au).
(4) The substrate for a semiconductor light-emitting element as set forth in any one of the above (1) to (4), wherein the substrate bonding portion is separated from the substrate electrode by 0.5 mm or more.
(5) A substrate for a semiconductor light emitting device, wherein a solder resist is formed between the substrate bonding portion and the substrate electrode.
(6) A substrate for a semiconductor light emitting device, wherein a substrate electrode is formed on a substrate bonding portion, and a solder resist is formed between a portion of the substrate bonding portion where the bonding portion of the semiconductor light emitting device and the substrate bonding portion are bonded to the substrate electrode.
(7) A substrate for a semiconductor light emitting device, wherein a substrate electrode is electrically coupled to an electrode and a junction of a semiconductor light emitting device chip of the semiconductor light emitting device.
(8) A substrate for a semiconductor light-emitting device, characterized in that the shape of the substrate bonding portion is the same as the shape of the semiconductor light-emitting device bonding portion.
(9) A substrate for a semiconductor light-emitting element, wherein a planar area of the substrate junction is larger than a planar area of the junction of the semiconductor light-emitting device.
(10) A substrate electrode is formed on the substrate bonding portion, a solder resist is formed between a portion of the substrate bonding portion where the bonding portion of the semiconductor light emitting device and the substrate bonding portion are bonded to the substrate electrode, Is electrically coupled to the electrode and the bonding portion of the semiconductor light emitting device.
According to the present disclosure, when a semiconductor light emitting device is electrically connected to a substrate for a semiconductor light emitting device, a substrate for a semiconductor light emitting device having improved adhesion between the semiconductor light emitting device and the substrate for a semiconductor light emitting device can be obtained.
Semiconductor light emitting device: 100, 300, 800
Semiconductor light emitting device chip: 150, 320, 830
Substrates for semiconductor light emitting devices: 200, 400, 500, 600, 700
Claims (10)
A substrate electrode formed on one surface of the semiconductor light emitting device substrate corresponding to the electrodes of the semiconductor light emitting device chip and electrically connected to the electrodes of the semiconductor light emitting device chip; And,
And a substrate bonding portion formed on one surface of the substrate for the semiconductor light emitting device corresponding to the bonding portion of the semiconductor light emitting device and electrically connected to the bonding portion of the semiconductor light emitting device,
Wherein the substrate electrode and the substrate bonding portion are formed on one surface of the same substrate for a semiconductor light emitting element.
Wherein the substrate bonding portion surrounds the substrate electrode.
Wherein the substrate bonding portion is formed of at least one of silver (Ag), copper (Cu), and gold (Au).
Wherein the substrate bonding portion is separated from the substrate electrode by 0.5 mm or more.
And a solder resist is formed between the substrate bonding portion and the substrate electrode.
Wherein a solder resist is formed between a portion of the substrate bonding portion that is coupled to the bonding portion of the semiconductor light emitting device and the substrate electrode.
Wherein the substrate electrode is electrically coupled to the electrode and the junction of the semiconductor light emitting device chip of the semiconductor light emitting device.
Wherein the shape of the substrate bonding portion is the same as the shape of the semiconductor light emitting device bonding portion.
Wherein the planar area of the substrate junction is larger than the planar area of the junction of the semiconductor light emitting device.
A solder resist is formed between a portion of the substrate bonding portion that is bonded to the bonding portion of the semiconductor light emitting device and the substrate electrode,
Wherein the substrate electrode is electrically coupled to the electrode and the junction of the semiconductor light emitting device chip of the semiconductor light emitting device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150179294A KR101762597B1 (en) | 2015-12-15 | 2015-12-15 | Substrate for semiconductor light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150179294A KR101762597B1 (en) | 2015-12-15 | 2015-12-15 | Substrate for semiconductor light emitting device |
Publications (2)
Publication Number | Publication Date |
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KR20170071670A KR20170071670A (en) | 2017-06-26 |
KR101762597B1 true KR101762597B1 (en) | 2017-07-31 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020150179294A KR101762597B1 (en) | 2015-12-15 | 2015-12-15 | Substrate for semiconductor light emitting device |
Country Status (1)
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KR (1) | KR101762597B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210044344A (en) * | 2019-10-14 | 2021-04-23 | 주식회사 세미콘라이트 | Semiconductor light emitting device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102161006B1 (en) * | 2019-01-31 | 2020-10-05 | 주식회사 세미콘라이트 | Semiconductor light emitting device and method for manufacturing the same |
KR102315915B1 (en) * | 2019-12-19 | 2021-10-22 | 주식회사 에스엘바이오닉스 | Semiconductor light emitting device and method of manufacturing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015073043A (en) * | 2013-10-04 | 2015-04-16 | セイコーエプソン株式会社 | Light-emitting device and projector |
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2015
- 2015-12-15 KR KR1020150179294A patent/KR101762597B1/en active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015073043A (en) * | 2013-10-04 | 2015-04-16 | セイコーエプソン株式会社 | Light-emitting device and projector |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210044344A (en) * | 2019-10-14 | 2021-04-23 | 주식회사 세미콘라이트 | Semiconductor light emitting device |
KR102275368B1 (en) | 2019-10-14 | 2021-07-13 | 주식회사 에스엘바이오닉스 | Semiconductor light emitting device |
Also Published As
Publication number | Publication date |
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KR20170071670A (en) | 2017-06-26 |
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