KR101744547B1 - Socket assembly for testing semiconductor package - Google Patents
Socket assembly for testing semiconductor package Download PDFInfo
- Publication number
- KR101744547B1 KR101744547B1 KR1020150099659A KR20150099659A KR101744547B1 KR 101744547 B1 KR101744547 B1 KR 101744547B1 KR 1020150099659 A KR1020150099659 A KR 1020150099659A KR 20150099659 A KR20150099659 A KR 20150099659A KR 101744547 B1 KR101744547 B1 KR 101744547B1
- Authority
- KR
- South Korea
- Prior art keywords
- socket
- holding plate
- socket pin
- pin
- insertion hole
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to a socket comprising: a socket having a socket pin connected to a semiconductor package; A holding plate disposed below the socket and having an insertion hole into which a free end of the socket pin is inserted; And a circuit board disposed on the lower side of the holding plate, the circuit board including a conductive pillar electrically connected to the socket pin.
Description
The present invention relates to a socket assembly for testing semiconductor packages.
Generally, a semiconductor package completed by a manufacturing process is checked for proper operating characteristics through a test (inspection) process. As a result, only semiconductor packages classified as good are shipped.
For this test, the semiconductor package may be electrically connected to the main board while being inserted into the socket assembly.
At this time, since the interval between the electrodes of the semiconductor package is miniaturized, it is difficult to manufacture a socket assembly that can cope with this.
It is an object of the present invention to provide a socket assembly for testing a semiconductor package, which can solve the difficulty of connecting the socket pin having a fine gap to the circuit board.
It is another object of the present invention to provide a socket assembly for testing a semiconductor package, which is capable of limiting the circuit configuration area on the circuit board by the socket pin.
According to an aspect of the present invention, there is provided a socket assembly for testing a semiconductor package, comprising: a socket having a socket pin connected to a semiconductor package; A holding plate disposed below the socket and having an insertion hole into which a free end of the socket pin is inserted; And a circuit board disposed on the lower side of the holding plate and including a conductive column electrically connected to the socket pin.
The holding plate may further include a conductive charging unit that is filled in the insertion hole, surrounds the free end of the socket pin, and contacts the conductive pillars.
Here, the charging unit may be formed to surround the lower end of the free end of the socket pin, and the socket pin may be electrically connected to the conductive pillar through the charging unit.
Here, the inner diameter of the insertion hole may be 1.5 to 2 times the diameter of the socket pin.
The holding plate may further include a metal part attached to the inner wall of the insertion hole and coupled with the charging part.
Here, the charging part may be fused to the conductive pillars.
Here, the holding plate may include an upper surface in close contact with a lower surface of the socket.
Here, the socket may further include a recess portion formed at the center of the lower surface, and the holding plate may be disposed in the recess portion.
The circuit board may further include an insulating molding that is filled in the recess portion and adheres to the socket and the circuit board.
Here, the socket may further include a coupling protrusion protruding from a portion surrounding the recess, and the circuit board may further include a coupling hole for receiving the coupling protrusion.
According to the socket assembly for testing a semiconductor package according to the present invention, the socket pin having a minute gap can be simply connected to the circuit board.
In addition, the circuit configuration area is not restricted by the socket pin on the circuit board.
FIG. 1 is a perspective view showing a
2 is a cross-sectional view of a
3 is an enlarged cross-sectional view of the
Hereinafter, a socket assembly for testing a semiconductor package according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present specification, the same or similar reference numerals are given to different embodiments in the same or similar configurations.
FIG. 1 is a perspective view showing a
Referring to the drawings, a semiconductor device testing board device may include a main board M and a
A circuit for testing is constituted on the main board (M). The circuit is for controlling the
The
The specific structure of the
2 is a cross-sectional view of a
Referring to the drawings, the
The
The
The socket pin (113) extends through the body (111). The
The
The
The
The
The
The
The
The
The engaging
The
The
The
According to this configuration, the
Further, since the
Further, since the
Further, by adding the
Next, the detailed structure of the holding
3 is an enlarged cross-sectional view of the holding
Referring to this figure, the holding
The
With the
As a result, the charging
The socket assembly for testing a semiconductor package as described above is not limited to the configuration and operation of the embodiments described above. The above embodiments may be configured so that all or some of the embodiments may be selectively combined to make various modifications.
100: Socket assembly for semiconductor package test
110: socket 111: body
113: socket pin 115: engaging projection
130: holding plate 131: body
133: insertion hole 135:
150: circuit board 151: body
153: conductive column 155: coupling hole
157: Circuit pattern 170: Molding
Claims (10)
Wherein the holding plate further comprises a conductive charging portion filled in the insertion hole to surround the free end of the socket pin and to contact the conductive pillar.
The charging unit includes:
Wherein the socket pin is configured to wrap under the free end of the socket pin such that the socket pin is energized with the conductive pillar through the live part.
Wherein an inner diameter of the insertion hole is 1.5 to 2 times the diameter of the socket pin.
Wherein the holding plate comprises:
Further comprising a metal portion attached to an inner wall of the insertion hole and coupled with the charging portion.
The charging unit includes:
Wherein the conductive pillar is fused to the conductive pillar.
Wherein the holding plate comprises:
And an upper surface in close contact with a lower surface of the socket.
The socket includes:
And a recessed portion formed at the center of the lower surface,
Wherein the holding plate comprises:
Wherein the recessed portion is disposed within the recessed portion.
Further comprising an insulating molding filled in the recessed portion to bond the socket and the circuit board.
The socket includes:
And a coupling protrusion protruding from a portion surrounding the recess portion,
The circuit board includes:
And a coupling hole for receiving the coupling protrusion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150099659A KR101744547B1 (en) | 2015-07-14 | 2015-07-14 | Socket assembly for testing semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150099659A KR101744547B1 (en) | 2015-07-14 | 2015-07-14 | Socket assembly for testing semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170008455A KR20170008455A (en) | 2017-01-24 |
KR101744547B1 true KR101744547B1 (en) | 2017-06-09 |
Family
ID=57993317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150099659A KR101744547B1 (en) | 2015-07-14 | 2015-07-14 | Socket assembly for testing semiconductor package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101744547B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102339112B1 (en) * | 2020-06-15 | 2021-12-15 | 배명철 | Manufacturing method for pin gide structure of semiconductor package test socket, pin gide structure of semiconductor package test socket and socket for testing of semiconductor package |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101370409B1 (en) | 2012-12-05 | 2014-03-07 | 에이케이이노텍주식회사 | Semiconductor test socket |
-
2015
- 2015-07-14 KR KR1020150099659A patent/KR101744547B1/en active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101370409B1 (en) | 2012-12-05 | 2014-03-07 | 에이케이이노텍주식회사 | Semiconductor test socket |
Also Published As
Publication number | Publication date |
---|---|
KR20170008455A (en) | 2017-01-24 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |