KR101532172B1 - 칩 전자부품 및 그 실장기판 - Google Patents

칩 전자부품 및 그 실장기판 Download PDF

Info

Publication number: KR101532172B1
Authority: KR; South Korea
Prior art keywords: plating layer; coil conductor; insulating substrate; conductor pattern; electronic component
Prior art date: 2014-06-02

Application number

KR1020140066924A

Other languages

English (en)

Korean (ko)

Inventor

정정혁

방혜민

김태영

차혜연

Original Assignee

삼성전기주식회사

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-06-02

Filing date

2014-06-02

Publication date

2015-06-26

2014-06-02 Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사

2014-06-02 Priority to KR1020140066924A priority Critical patent/KR101532172B1/ko

2014-08-22 Priority to JP2014169125A priority patent/JP6121371B2/ja

2014-09-12 Priority to CN201410465055.XA priority patent/CN105185507B/zh

2015-06-26 Application granted granted Critical

2015-06-26 Publication of KR101532172B1 publication Critical patent/KR101532172B1/ko

Links

239000000758 substrate Substances 0.000 claims abstract description 63
238000007747 plating Methods 0.000 claims abstract description 57
238000009713 electroplating Methods 0.000 claims abstract description 46
239000004020 conductor Substances 0.000 claims description 64
238000000034 method Methods 0.000 claims description 27
229910052802 copper Inorganic materials 0.000 claims description 10
229910052759 nickel Inorganic materials 0.000 claims description 9
229910052709 silver Inorganic materials 0.000 claims description 8
229910052782 aluminium Inorganic materials 0.000 claims description 7
229910052737 gold Inorganic materials 0.000 claims description 7
229910052763 palladium Inorganic materials 0.000 claims description 7
229910052719 titanium Inorganic materials 0.000 claims description 7
238000009413 insulation Methods 0.000 abstract 3
239000010949 copper Substances 0.000 description 14
229910052751 metal Inorganic materials 0.000 description 11
239000002184 metal Substances 0.000 description 11
239000010409 thin film Substances 0.000 description 11
229910000859 α-Fe Inorganic materials 0.000 description 11
PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
239000010408 film Substances 0.000 description 9
KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
229920002120 photoresistant polymer Polymers 0.000 description 8
239000010931 gold Substances 0.000 description 7
239000010936 titanium Substances 0.000 description 7
239000000696 magnetic material Substances 0.000 description 6
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
238000011160 research Methods 0.000 description 4
229910045601 alloy Inorganic materials 0.000 description 3
239000000956 alloy Substances 0.000 description 3
239000003990 capacitor Substances 0.000 description 3
230000007547 defect Effects 0.000 description 3
238000007598 dipping method Methods 0.000 description 3
239000000126 substance Substances 0.000 description 3
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
230000000694 effects Effects 0.000 description 2
239000003822 epoxy resin Substances 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
239000000463 material Substances 0.000 description 2
229910052697 platinum Inorganic materials 0.000 description 2
229920000647 polyepoxide Polymers 0.000 description 2
238000007639 printing Methods 0.000 description 2
238000007650 screen-printing Methods 0.000 description 2
239000004332 silver Substances 0.000 description 2
239000010944 silver (metal) Substances 0.000 description 2
238000005476 soldering Methods 0.000 description 2
238000005507 spraying Methods 0.000 description 2
229910052718 tin Inorganic materials 0.000 description 2
239000011135 tin Substances 0.000 description 2
229910018605 Ni—Zn Inorganic materials 0.000 description 1
229910007565 Zn—Cu Inorganic materials 0.000 description 1
239000011324 bead Substances 0.000 description 1
238000004891 communication Methods 0.000 description 1
230000002950 deficient Effects 0.000 description 1
230000001747 exhibiting effect Effects 0.000 description 1
230000002706 hydrostatic effect Effects 0.000 description 1
238000010030 laminating Methods 0.000 description 1
238000003475 lamination Methods 0.000 description 1
239000006247 magnetic powder Substances 0.000 description 1
230000005389 magnetism Effects 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000005300 metallic glass Substances 0.000 description 1
230000000149 penetrating effect Effects 0.000 description 1
239000000843 powder Substances 0.000 description 1
238000003825 pressing Methods 0.000 description 1
238000004080 punching Methods 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000011347 resin Substances 0.000 description 1

Images

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components

Landscapes

Engineering & Computer Science (AREA)
Power Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Coils Or Transformers For Communication (AREA)
Coils Of Transformers For General Uses (AREA)
Manufacturing Cores, Coils, And Magnets (AREA)

KR1020140066924A 2014-06-02 2014-06-02 칩 전자부품 및 그 실장기판 KR101532172B1 (ko)

Priority Applications (3)

Application Number	Priority Date	Filing Date	Title
KR1020140066924A KR101532172B1 (ko)	2014-06-02	2014-06-02	칩 전자부품 및 그 실장기판
JP2014169125A JP6121371B2 (ja)	2014-06-02	2014-08-22	チップ電子部品及びその実装基板
CN201410465055.XA CN105185507B (zh)	2014-06-02	2014-09-12	片式电子器件和用于安装片式电子器件的板

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
KR1020140066924A KR101532172B1 (ko)	2014-06-02	2014-06-02	칩 전자부품 및 그 실장기판

Publications (1)

Publication Number	Publication Date
KR101532172B1 true KR101532172B1 (ko)	2015-06-26

Family

ID=53519973

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020140066924A KR101532172B1 (ko)	2014-06-02	2014-06-02	칩 전자부품 및 그 실장기판

Country Status (3)

Country	Link
JP (1)	JP6121371B2 (zh)
KR (1)	KR101532172B1 (zh)
CN (1)	CN105185507B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20170004124A (ko) *	2015-07-01	2017-01-11	삼성전기주식회사	코일 전자부품 및 그 제조방법
US20170032884A1 (en) *	2015-07-31	2017-02-02	Samsung Electro-Mechanics Co., Ltd.	Coil electronic component and method of manufacturing the same
KR20170142151A (ko) *	2017-12-15	2017-12-27	삼성전기주식회사	코일 전자 부품 및 그 제조방법
WO2019070090A1 (ko) *	2017-10-02	2019-04-11	엘지이노텍 주식회사	무선충전코일, 그 제조방법 및 이를 구비한 무선충전장치
KR20190045749A (ko) *	2017-10-24	2019-05-03	삼성전기주식회사	코일 부품 및 그 제조 방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR102632366B1 (ko) *	2016-09-01	2024-02-02	삼성전기주식회사	코일 부품
KR101981466B1 (ko) *	2016-09-08	2019-05-24	주식회사 모다이노칩	파워 인덕터
KR101862503B1 (ko) *	2017-01-06	2018-05-29	삼성전기주식회사	인덕터 및 그의 제조방법
KR102381269B1 (ko) *	2020-04-27	2022-03-30	삼성전기주식회사	코일 부품
TWI760275B (zh)	2021-08-26	2022-04-01	奇力新電子股份有限公司	電感元件及其製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2001028110A (ja) *	1999-07-13	2001-01-30	Hitachi Ltd	磁気抵抗効果ヘッドの製造方法と磁気抵抗効果ヘッド及びそれを用いた磁気ディスク装置
JP2006278909A (ja) *	2005-03-30	2006-10-12	Tdk Corp	コイル基材、コイル部品及びその製造方法
KR20130031082A (ko) *	2011-09-20	2013-03-28	삼성전기주식회사	적층형 인덕터의 제조 방법
KR20140042663A (ko) *	2012-09-27	2014-04-07	티디케이가부시기가이샤	이방성 도금 방법 및 박막 코일

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0719950B2 (ja) *	1992-03-06	1995-03-06	株式会社エス・エム・シー	配線基板およびその製造方法
JP2004342645A (ja) *	2003-05-13	2004-12-02	Matsushita Electric Ind Co Ltd	平面コイルの製造方法
JP2005005298A (ja) *	2003-06-09	2005-01-06	Tdk Corp	積層型チップインダクタとその製造方法
CN103180919B (zh) *	2010-10-21	2016-05-18	Tdk株式会社	线圈部件及其制造方法
US9287034B2 (en) *	2012-02-27	2016-03-15	Ibiden Co., Ltd.	Printed wiring board, inductor component, and method for manufacturing inductor component
JP6060508B2 (ja) *	2012-03-26	2017-01-18	Tdk株式会社	平面コイル素子およびその製造方法
KR20140020505A (ko) *	2012-08-09	2014-02-19	삼성전기주식회사	인덕터 소자 및 이의 제조 방법
JP6102578B2 (ja) *	2012-09-27	2017-03-29	Tdk株式会社	異方性めっき方法

2014
- 2014-06-02 KR KR1020140066924A patent/KR101532172B1/ko active IP Right Grant
- 2014-08-22 JP JP2014169125A patent/JP6121371B2/ja active Active
- 2014-09-12 CN CN201410465055.XA patent/CN105185507B/zh active Active

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2001028110A (ja) *	1999-07-13	2001-01-30	Hitachi Ltd	磁気抵抗効果ヘッドの製造方法と磁気抵抗効果ヘッド及びそれを用いた磁気ディスク装置
JP2006278909A (ja) *	2005-03-30	2006-10-12	Tdk Corp	コイル基材、コイル部品及びその製造方法
KR20130031082A (ko) *	2011-09-20	2013-03-28	삼성전기주식회사	적층형 인덕터의 제조 방법
KR20140042663A (ko) *	2012-09-27	2014-04-07	티디케이가부시기가이샤	이방성 도금 방법 및 박막 코일

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20170004124A (ko) *	2015-07-01	2017-01-11	삼성전기주식회사	코일 전자부품 및 그 제조방법
KR101719908B1 (ko)	2015-07-01	2017-03-24	삼성전기주식회사	코일 전자부품 및 그 제조방법
US20170032884A1 (en) *	2015-07-31	2017-02-02	Samsung Electro-Mechanics Co., Ltd.	Coil electronic component and method of manufacturing the same
CN106409469A (zh) *	2015-07-31	2017-02-15	三星电机株式会社	线圈电子组件及其制造方法
US10902988B2 (en) *	2015-07-31	2021-01-26	Samsung Electro-Mechanics Co., Ltd.	Coil electronic component and method of manufacturing the same
WO2019070090A1 (ko) *	2017-10-02	2019-04-11	엘지이노텍 주식회사	무선충전코일, 그 제조방법 및 이를 구비한 무선충전장치
KR20190045749A (ko) *	2017-10-24	2019-05-03	삼성전기주식회사	코일 부품 및 그 제조 방법
KR102475201B1 (ko) *	2017-10-24	2022-12-07	삼성전기주식회사	코일 부품 및 그 제조 방법
KR20220165704A (ko) *	2017-10-24	2022-12-15	삼성전기주식회사	코일 부품 및 그 제조 방법
KR102574419B1 (ko) *	2017-10-24	2023-09-04	삼성전기주식회사	코일 부품 및 그 제조 방법
KR20170142151A (ko) *	2017-12-15	2017-12-27	삼성전기주식회사	코일 전자 부품 및 그 제조방법
KR102232600B1 (ko) *	2017-12-15	2021-03-26	삼성전기주식회사	코일 전자 부품 및 그 제조방법

Also Published As

Publication number	Publication date
CN105185507A (zh)	2015-12-23
JP2015228479A (ja)	2015-12-17
CN105185507B (zh)	2017-11-14
JP6121371B2 (ja)	2017-04-26

Legal Events

Date

Code

Title

Description

2015-06-22

GRNT

Written decision to grant

2018-04-02

FPAY

Annual fee payment

Payment date: 20180403

Year of fee payment: 4

2019-04-01