KR101488047B1 - 다이싱-다이본딩 테이프 및 반도체 칩의 제조 방법 - Google Patents
다이싱-다이본딩 테이프 및 반도체 칩의 제조 방법 Download PDFInfo
- Publication number
- KR101488047B1 KR101488047B1 KR1020107001095A KR20107001095A KR101488047B1 KR 101488047 B1 KR101488047 B1 KR 101488047B1 KR 1020107001095 A KR1020107001095 A KR 1020107001095A KR 20107001095 A KR20107001095 A KR 20107001095A KR 101488047 B1 KR101488047 B1 KR 101488047B1
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive layer
- dicing
- die bonding
- pressure
- bonding tape
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2007-188003 | 2007-07-19 | ||
JP2007188003 | 2007-07-19 | ||
PCT/JP2008/062496 WO2009011281A1 (ja) | 2007-07-19 | 2008-07-10 | ダイシング-ダイボンディングテープ及び半導体チップの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100054782A KR20100054782A (ko) | 2010-05-25 |
KR101488047B1 true KR101488047B1 (ko) | 2015-01-30 |
Family
ID=40259617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020107001095A KR101488047B1 (ko) | 2007-07-19 | 2008-07-10 | 다이싱-다이본딩 테이프 및 반도체 칩의 제조 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5286085B2 (zh) |
KR (1) | KR101488047B1 (zh) |
CN (1) | CN101772831B (zh) |
TW (1) | TWI432547B (zh) |
WO (1) | WO2009011281A1 (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010287848A (ja) * | 2009-06-15 | 2010-12-24 | Sekisui Chem Co Ltd | ダイシング−ダイボンディングテープ及び半導体チップの製造方法 |
JP2011023692A (ja) * | 2009-06-15 | 2011-02-03 | Sekisui Chem Co Ltd | ダイシング−ダイボンディングテープ及びその製造方法、並びに半導体チップの製造方法 |
JP2011054641A (ja) * | 2009-08-31 | 2011-03-17 | Nitto Denko Corp | 被切断体からのダイシング表面保護テープの剥離除去方法 |
JP5566141B2 (ja) * | 2010-03-15 | 2014-08-06 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
JP4976532B2 (ja) * | 2010-09-06 | 2012-07-18 | 日東電工株式会社 | 半導体装置用フィルム |
JP5803123B2 (ja) * | 2011-02-08 | 2015-11-04 | 日立化成株式会社 | 半導体用粘接着シート、それを用いた半導体ウエハ、半導体装置及び半導体装置の製造方法 |
JP5899622B2 (ja) * | 2011-02-08 | 2016-04-06 | 日立化成株式会社 | 半導体用粘接着シート、半導体用粘接着シートの製造方法、半導体ウエハ、半導体装置及び半導体装置の製造方法 |
EP2696352B1 (en) * | 2011-04-07 | 2015-12-09 | Lg Chem, Ltd. | Silver paste composition for forming an electrode, and method for preparing same |
JP2013065625A (ja) * | 2011-09-15 | 2013-04-11 | Sekisui Chem Co Ltd | ダイシング−ダイボンディングテープ、粘接着剤層付き半導体チップの作製キット及び粘接着剤層付き半導体チップの製造方法 |
KR20130062817A (ko) * | 2011-12-05 | 2013-06-13 | 제일모직주식회사 | 반도체 가공용 접착 테이프 |
JP6101492B2 (ja) * | 2013-01-10 | 2017-03-22 | 日東電工株式会社 | 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置 |
US9299614B2 (en) * | 2013-12-10 | 2016-03-29 | Applied Materials, Inc. | Method and carrier for dicing a wafer |
WO2015102342A1 (ko) * | 2014-01-03 | 2015-07-09 | 주식회사 엘지화학 | 다이싱 필름 및 다이싱 다이본딩 필름 |
KR101722137B1 (ko) | 2014-01-03 | 2017-03-31 | 주식회사 엘지화학 | 다이싱 필름 및 다이싱 다이본딩 필름 |
CN105981138B (zh) * | 2014-02-14 | 2018-12-28 | 三井化学东赛璐株式会社 | 半导体晶片表面保护用粘着膜、以及使用粘着膜的半导体晶片的保护方法和半导体装置的制造方法 |
JP6704322B2 (ja) | 2015-09-30 | 2020-06-03 | 日東電工株式会社 | シートおよび複合シート |
JP2017066485A (ja) * | 2015-09-30 | 2017-04-06 | 日東電工株式会社 | シートおよび複合シート |
JP6805233B2 (ja) * | 2016-03-10 | 2020-12-23 | リンテック株式会社 | ダイシングダイボンディングシート、半導体チップの製造方法及び半導体装置の製造方法 |
JP6721398B2 (ja) * | 2016-04-22 | 2020-07-15 | 日東電工株式会社 | ダイシングダイボンディングフィルム、ダイシングダイボンディングテープおよび半導体装置の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002203816A (ja) * | 2000-12-28 | 2002-07-19 | Nitto Denko Corp | ダイシング用粘着シート |
JP2003007646A (ja) * | 2001-06-18 | 2003-01-10 | Nitto Denko Corp | ダイシング用粘着シートおよび切断片の製造方法 |
JP2006165074A (ja) * | 2004-12-03 | 2006-06-22 | Sumitomo Bakelite Co Ltd | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2726350B2 (ja) * | 1992-02-24 | 1998-03-11 | リンテック株式会社 | ウェハ貼着用粘着シート |
JP3280876B2 (ja) * | 1996-01-22 | 2002-05-13 | 日本テキサス・インスツルメンツ株式会社 | ウェハダイシング・接着用シートおよび半導体装置の製造方法 |
JP2004292821A (ja) * | 2002-06-26 | 2004-10-21 | Hitachi Chem Co Ltd | フィルム状接着剤、接着シート及び半導体装置 |
JP4776189B2 (ja) * | 2004-08-03 | 2011-09-21 | 古河電気工業株式会社 | ウエハ加工用テープ |
JP2006203000A (ja) * | 2005-01-20 | 2006-08-03 | Sekisui Chem Co Ltd | ダイシング用粘着テープおよび半導体チップの製造方法 |
JP2008091839A (ja) * | 2006-10-05 | 2008-04-17 | Sekisui Chem Co Ltd | 半導体チップの製造方法 |
-
2008
- 2008-07-10 JP JP2008532937A patent/JP5286085B2/ja active Active
- 2008-07-10 KR KR1020107001095A patent/KR101488047B1/ko active IP Right Grant
- 2008-07-10 CN CN2008800246358A patent/CN101772831B/zh not_active Expired - Fee Related
- 2008-07-10 WO PCT/JP2008/062496 patent/WO2009011281A1/ja active Application Filing
- 2008-07-16 TW TW097126968A patent/TWI432547B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002203816A (ja) * | 2000-12-28 | 2002-07-19 | Nitto Denko Corp | ダイシング用粘着シート |
JP2003007646A (ja) * | 2001-06-18 | 2003-01-10 | Nitto Denko Corp | ダイシング用粘着シートおよび切断片の製造方法 |
JP2006165074A (ja) * | 2004-12-03 | 2006-06-22 | Sumitomo Bakelite Co Ltd | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009011281A1 (ja) | 2010-09-24 |
CN101772831B (zh) | 2011-12-21 |
JP5286085B2 (ja) | 2013-09-11 |
TWI432547B (zh) | 2014-04-01 |
CN101772831A (zh) | 2010-07-07 |
WO2009011281A1 (ja) | 2009-01-22 |
TW200914573A (en) | 2009-04-01 |
KR20100054782A (ko) | 2010-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101488047B1 (ko) | 다이싱-다이본딩 테이프 및 반도체 칩의 제조 방법 | |
JP6274588B2 (ja) | 保護膜形成層付ダイシングシートおよびチップの製造方法 | |
KR101461243B1 (ko) | 다이싱·다이본딩 테이프 및 반도체 칩의 제조 방법 | |
KR101273871B1 (ko) | 다이싱ㆍ다이본딩 테이프 및 반도체칩의 제조 방법 | |
KR101567131B1 (ko) | 경화성 조성물, 다이싱-다이본딩 테이프, 접속 구조체 및 점접착제층을 갖는 반도체 칩의 제조 방법 | |
JP6424205B2 (ja) | 半導体関連部材加工用シートおよび当該シートを用いるチップの製造方法 | |
KR20170055552A (ko) | 반도체 웨이퍼 표면 보호용 점착 테이프 및 반도체 웨이퍼의 가공 방법 | |
JP2009065191A5 (zh) | ||
JP5580631B2 (ja) | 硬化性組成物、ダイシング−ダイボンディングテープ、接続構造体及び粘接着剤層付き半導体チップの製造方法 | |
JPWO2014155756A1 (ja) | 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法 | |
JPWO2015133420A6 (ja) | 半導体関連部材加工用シートおよび当該シートを用いるチップの製造方法 | |
JP5566774B2 (ja) | 放射線硬化性半導体ウエハ表面保護用粘着テープ | |
JP5319993B2 (ja) | ダイシング−ダイボンディングテープ及び半導体チップの製造方法 | |
JP2009239190A (ja) | ダイシング・ダイボンディングテープ | |
JP6262717B2 (ja) | 保護膜付チップの製造方法 | |
JP2011023692A (ja) | ダイシング−ダイボンディングテープ及びその製造方法、並びに半導体チップの製造方法 | |
JP2011054707A (ja) | ダイシング−ダイボンディングテープ及び半導体チップの製造方法 | |
JP2011199015A (ja) | ダイシング−ダイボンディングテープ及び粘接着剤層付き半導体チップの製造方法 | |
JP2010287848A (ja) | ダイシング−ダイボンディングテープ及び半導体チップの製造方法 | |
JP2010067772A (ja) | ダイシング−ダイボンディングテープ及び半導体チップの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20180104 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20200107 Year of fee payment: 6 |