KR101451483B1 - 전해도금 장치 - Google Patents

전해도금 장치 Download PDF

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Publication number
KR101451483B1
KR101451483B1 KR1020120156867A KR20120156867A KR101451483B1 KR 101451483 B1 KR101451483 B1 KR 101451483B1 KR 1020120156867 A KR1020120156867 A KR 1020120156867A KR 20120156867 A KR20120156867 A KR 20120156867A KR 101451483 B1 KR101451483 B1 KR 101451483B1
Authority
KR
South Korea
Prior art keywords
anode
cathode
insertion portion
plating
diaphragm
Prior art date
Application number
KR1020120156867A
Other languages
English (en)
Korean (ko)
Other versions
KR20140086418A (ko
Inventor
한봉환
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020120156867A priority Critical patent/KR101451483B1/ko
Priority to JP2013222372A priority patent/JP5822212B2/ja
Publication of KR20140086418A publication Critical patent/KR20140086418A/ko
Application granted granted Critical
Publication of KR101451483B1 publication Critical patent/KR101451483B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020120156867A 2012-12-28 2012-12-28 전해도금 장치 KR101451483B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020120156867A KR101451483B1 (ko) 2012-12-28 2012-12-28 전해도금 장치
JP2013222372A JP5822212B2 (ja) 2012-12-28 2013-10-25 電解メッキ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120156867A KR101451483B1 (ko) 2012-12-28 2012-12-28 전해도금 장치

Publications (2)

Publication Number Publication Date
KR20140086418A KR20140086418A (ko) 2014-07-08
KR101451483B1 true KR101451483B1 (ko) 2014-10-15

Family

ID=51408208

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120156867A KR101451483B1 (ko) 2012-12-28 2012-12-28 전해도금 장치

Country Status (2)

Country Link
JP (1) JP5822212B2 (ja)
KR (1) KR101451483B1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105063709B (zh) * 2015-09-18 2018-02-23 安捷利电子科技（苏州）有限公司 印刷电路板用电镀装置
CN108588804A (zh) * 2018-06-29 2018-09-28 苏州市金翔钛设备有限公司 电镀槽装置
CN112430838B (zh) * 2020-12-01 2022-06-17 刘鹏 一种电镀模组

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275811A (ja) * 1997-03-31 1998-10-13 Shinko Electric Ind Co Ltd バンプの形成方法およびめっき装置
KR20100125487A (ko) * 2009-05-21 2010-12-01 주식회사 티케이씨 도금설비의 인쇄회로기판용 전극판 차폐박스 구조

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0452296A (ja) * 1990-06-20 1992-02-20 Permelec Electrode Ltd 銅めっき方法
JPH0444377U (ja) * 1990-08-15 1992-04-15
JP2517787B2 (ja) * 1990-08-15 1996-07-24 株式会社アルメックス メッキ装置の陽極構造
JPH08375Y2 (ja) * 1990-08-15 1996-01-10 株式会社アルメックス メッキ装置の陽極構造
JP5437665B2 (ja) * 2009-03-06 2014-03-12 住友電気工業株式会社 高速連続めっき処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275811A (ja) * 1997-03-31 1998-10-13 Shinko Electric Ind Co Ltd バンプの形成方法およびめっき装置
KR20100125487A (ko) * 2009-05-21 2010-12-01 주식회사 티케이씨 도금설비의 인쇄회로기판용 전극판 차폐박스 구조

Also Published As

Publication number Publication date
JP2014129591A (ja) 2014-07-10
JP5822212B2 (ja) 2015-11-24
KR20140086418A (ko) 2014-07-08

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