KR101440481B1 - 취성 재료 기판의 스크라이브 방법 및 취성 재료 기판의 스크라이브 장치 - Google Patents

취성 재료 기판의 스크라이브 방법 및 취성 재료 기판의 스크라이브 장치 Download PDF

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Publication number
KR101440481B1
KR101440481B1 KR1020120125872A KR20120125872A KR101440481B1 KR 101440481 B1 KR101440481 B1 KR 101440481B1 KR 1020120125872 A KR1020120125872 A KR 1020120125872A KR 20120125872 A KR20120125872 A KR 20120125872A KR 101440481 B1 KR101440481 B1 KR 101440481B1
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KR
South Korea
Prior art keywords
laser
brittle material
material substrate
substrate
cooling
Prior art date
Application number
KR1020120125872A
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English (en)
Korean (ko)
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KR20130058604A (ko
Inventor
마사나오 무라카미
세이지 시미즈
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20130058604A publication Critical patent/KR20130058604A/ko
Application granted granted Critical
Publication of KR101440481B1 publication Critical patent/KR101440481B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
KR1020120125872A 2011-11-25 2012-11-08 취성 재료 기판의 스크라이브 방법 및 취성 재료 기판의 스크라이브 장치 KR101440481B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-257039 2011-11-25
JP2011257039A JP5879106B2 (ja) 2011-11-25 2011-11-25 脆性材料基板のスクライブ方法

Publications (2)

Publication Number Publication Date
KR20130058604A KR20130058604A (ko) 2013-06-04
KR101440481B1 true KR101440481B1 (ko) 2014-09-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120125872A KR101440481B1 (ko) 2011-11-25 2012-11-08 취성 재료 기판의 스크라이브 방법 및 취성 재료 기판의 스크라이브 장치

Country Status (4)

Country Link
JP (1) JP5879106B2 (ja)
KR (1) KR101440481B1 (ja)
CN (1) CN103130409B (ja)
TW (1) TWI488703B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015048255A (ja) * 2013-08-30 2015-03-16 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板融着方法及びレーザ加工装置
JP6207306B2 (ja) * 2013-08-30 2017-10-04 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板融着方法及びレーザ加工装置
CN105436712B (zh) * 2015-12-07 2017-12-12 武汉铱科赛科技有限公司 一种脆性半导体材料的脆性裂片方法及***
JP6775822B2 (ja) * 2016-09-28 2020-10-28 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置
CN107199410B (zh) * 2017-07-25 2019-04-02 东莞市盛雄激光设备有限公司 一种激光切割设备及其切割方法
CN111108072B (zh) * 2017-09-27 2022-06-17 三星钻石工业股份有限公司 玻璃基板的切断装置、切断方法和存储介质
KR102216298B1 (ko) 2020-04-28 2021-02-18 주식회사 아이티아이 세라믹 절단법 및 장비
WO2021221378A1 (ko) 2020-04-28 2021-11-04 주식회사 아이티아이 세라믹 절단법 및 장비
KR102216294B1 (ko) 2020-07-22 2021-02-18 주식회사 아이티아이 세라믹 절단법 및 장비
KR102241518B1 (ko) 2020-11-17 2021-04-19 주식회사 아이티아이 세라믹 절단방법 및 장치

Citations (4)

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JP3938312B2 (ja) 2001-06-14 2007-06-27 住友電工ハードメタル株式会社 硬質材料の加工方法
JP2008272832A (ja) * 2007-04-03 2008-11-13 Bbele.Com Kk レーザによる脆性材料の切断方法及び切断装置。
JP2009262408A (ja) * 2008-04-24 2009-11-12 Lemi Ltd 脆性材料基板のスクライブ方法および装置
KR20110006678A (ko) * 2008-04-15 2011-01-20 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 가공 방법

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JP2003088973A (ja) * 2001-09-12 2003-03-25 Hamamatsu Photonics Kk レーザ加工方法
JP4408607B2 (ja) * 2002-06-11 2010-02-03 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライブ装置
JP2004098120A (ja) * 2002-09-09 2004-04-02 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
JP2005138143A (ja) * 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
JP3908236B2 (ja) * 2004-04-27 2007-04-25 株式会社日本製鋼所 ガラスの切断方法及びその装置
JP2007261915A (ja) * 2006-03-29 2007-10-11 Joyo Kogaku Kk レーザによるガラス切断方法および切断装置
TW200738388A (en) * 2006-04-12 2007-10-16 Chung Shan Inst Of Science Device for cutting glass piece and method for the same
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US8093532B2 (en) * 2008-03-31 2012-01-10 Electro Scientific Industries, Inc. Laser machining of fired ceramic and other hard and/or thick materials
US8327666B2 (en) * 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
JP2011057494A (ja) * 2009-09-09 2011-03-24 Lemi Ltd 脆性材料の割断方法および装置
JP2011088799A (ja) * 2009-10-26 2011-05-06 Mitsubishi Electric Corp 半導体装置の製造方法およびレーザー加工装置
JP4719857B2 (ja) * 2009-10-28 2011-07-06 地方独立行政法人鳥取県産業技術センター アタッチメント
TWI580652B (zh) * 2009-11-30 2017-05-01 康寧公司 用以在包括壓縮表面層及內部張力層之強化玻璃基板中形成相交刻劃孔口的方法
US20110127242A1 (en) * 2009-11-30 2011-06-02 Xinghua Li Methods for laser scribing and separating glass substrates

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3938312B2 (ja) 2001-06-14 2007-06-27 住友電工ハードメタル株式会社 硬質材料の加工方法
JP2008272832A (ja) * 2007-04-03 2008-11-13 Bbele.Com Kk レーザによる脆性材料の切断方法及び切断装置。
KR20110006678A (ko) * 2008-04-15 2011-01-20 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 가공 방법
JP2009262408A (ja) * 2008-04-24 2009-11-12 Lemi Ltd 脆性材料基板のスクライブ方法および装置

Also Published As

Publication number Publication date
KR20130058604A (ko) 2013-06-04
JP2013112532A (ja) 2013-06-10
JP5879106B2 (ja) 2016-03-08
TW201336612A (zh) 2013-09-16
TWI488703B (zh) 2015-06-21
CN103130409A (zh) 2013-06-05
CN103130409B (zh) 2016-02-10

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