KR101318818B1 - 취성 재료 기판의 분단 방법 - Google Patents
취성 재료 기판의 분단 방법 Download PDFInfo
- Publication number
- KR101318818B1 KR101318818B1 KR1020110024771A KR20110024771A KR101318818B1 KR 101318818 B1 KR101318818 B1 KR 101318818B1 KR 1020110024771 A KR1020110024771 A KR 1020110024771A KR 20110024771 A KR20110024771 A KR 20110024771A KR 101318818 B1 KR101318818 B1 KR 101318818B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- scribe line
- scribe
- brittle material
- scribe lines
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2010-082952 | 2010-03-31 | ||
JP2010082952A JP5216040B2 (ja) | 2010-03-31 | 2010-03-31 | 脆性材料基板の分断方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110109881A KR20110109881A (ko) | 2011-10-06 |
KR101318818B1 true KR101318818B1 (ko) | 2013-10-17 |
Family
ID=44775610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020110024771A KR101318818B1 (ko) | 2010-03-31 | 2011-03-21 | 취성 재료 기판의 분단 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5216040B2 (ja) |
KR (1) | KR101318818B1 (ja) |
CN (1) | CN102218777B (ja) |
TW (1) | TWI429604B (ja) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5187421B2 (ja) * | 2010-11-30 | 2013-04-24 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法 |
CN102581967B (zh) * | 2012-02-06 | 2015-02-04 | 安徽白鹭电子科技有限公司 | 带有v型槽的微小硅片的切断方法 |
CN103586985A (zh) * | 2012-08-17 | 2014-02-19 | 佳友科技有限公司 | 脆性材料加工方法与*** |
JP5991133B2 (ja) * | 2012-10-16 | 2016-09-14 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク用治具及びブレイク方法 |
JP6043150B2 (ja) * | 2012-10-29 | 2016-12-14 | 三星ダイヤモンド工業株式会社 | 積層脆性材料基板のブレイク装置および積層脆性材料基板のブレイク方法 |
JP6014490B2 (ja) * | 2012-12-27 | 2016-10-25 | 三星ダイヤモンド工業株式会社 | 分断方法、及び分断装置 |
JP6163341B2 (ja) * | 2013-04-02 | 2017-07-12 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
JP6140012B2 (ja) * | 2013-07-08 | 2017-05-31 | 三星ダイヤモンド工業株式会社 | 貼り合わせ基板のブレイク方法 |
JP6262960B2 (ja) * | 2013-08-23 | 2018-01-17 | 三星ダイヤモンド工業株式会社 | 基板分断装置 |
JP6207307B2 (ja) * | 2013-09-03 | 2017-10-04 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
JP6185812B2 (ja) * | 2013-09-30 | 2017-08-23 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法並びにブレイク装置 |
JP6154713B2 (ja) * | 2013-09-30 | 2017-06-28 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法並びにブレイク装置 |
JP6268917B2 (ja) * | 2013-10-25 | 2018-01-31 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
JP6243699B2 (ja) | 2013-10-25 | 2017-12-06 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断装置 |
KR20160023075A (ko) * | 2014-08-21 | 2016-03-03 | 한국미쯔보시다이아몬드공업(주) | 기판 브레이크 장치 |
JP6481465B2 (ja) | 2014-08-21 | 2019-03-13 | 三星ダイヤモンド工業株式会社 | 複合基板のブレイク方法 |
JP5913483B2 (ja) * | 2014-08-25 | 2016-04-27 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断方法並びに分断装置 |
JP6627326B2 (ja) * | 2015-08-20 | 2020-01-08 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
JP6271486B2 (ja) * | 2015-09-29 | 2018-01-31 | 三星ダイヤモンド工業株式会社 | ブレイクバー |
TWI632040B (zh) * | 2017-07-10 | 2018-08-11 | 煜峰投資顧問有限公司 | 脆性材料基板裂片裝置及使用該裝置之裂片方法 |
CN109093857B (zh) * | 2018-07-03 | 2020-05-26 | 常州大学 | 基于双面应力集中的切割机 |
TWI820177B (zh) * | 2018-09-26 | 2023-11-01 | 日商三星鑽石工業股份有限公司 | 附有金屬膜之基板的分割方法 |
TW202041343A (zh) * | 2018-12-18 | 2020-11-16 | 日商三星鑽石工業股份有限公司 | 陶瓷片的製造方法及陶瓷片製造用之煅燒前片的製造方法 |
CN110328765A (zh) * | 2019-07-05 | 2019-10-15 | 苏州德龙激光股份有限公司 | 晶圆裂片装置 |
CN111517630A (zh) * | 2020-05-29 | 2020-08-11 | 河北南玻玻璃有限公司 | 一种玻璃清边装置 |
CN111896347B (zh) * | 2020-08-07 | 2024-06-14 | 广东韶钢松山股份有限公司 | 一种截断装置及设备 |
EP4263447A1 (en) * | 2020-12-21 | 2023-10-25 | Corning Incorporated | Substrate cutting and separating systems and methods |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007067365A (ja) * | 2005-08-05 | 2007-03-15 | Alps Electric Co Ltd | 電子機器の製造方法 |
KR20080095204A (ko) * | 2007-04-23 | 2008-10-28 | 가부시키가이샤 도요다 지도숏키 | 유기 디바이스 제조 방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2516547Y (zh) * | 2001-12-10 | 2002-10-16 | 洛阳北方玻璃技术股份有限公司 | 多头双臂数控直线玻璃切割机 |
DE60331423D1 (de) * | 2002-04-01 | 2010-04-08 | Mitsuboshi Diamond Ind Co Ltd | Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtung |
JP4742649B2 (ja) * | 2005-04-05 | 2011-08-10 | ソニー株式会社 | 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法 |
JP2007073602A (ja) * | 2005-09-05 | 2007-03-22 | Shibaura Mechatronics Corp | 半導体チップのピックアップ装置及びピックアップ方法 |
-
2010
- 2010-03-31 JP JP2010082952A patent/JP5216040B2/ja not_active Expired - Fee Related
-
2011
- 2011-03-03 TW TW100107070A patent/TWI429604B/zh not_active IP Right Cessation
- 2011-03-21 KR KR1020110024771A patent/KR101318818B1/ko not_active IP Right Cessation
- 2011-03-28 CN CN201110078563.9A patent/CN102218777B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007067365A (ja) * | 2005-08-05 | 2007-03-15 | Alps Electric Co Ltd | 電子機器の製造方法 |
KR20080095204A (ko) * | 2007-04-23 | 2008-10-28 | 가부시키가이샤 도요다 지도숏키 | 유기 디바이스 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
TWI429604B (zh) | 2014-03-11 |
JP2011212963A (ja) | 2011-10-27 |
KR20110109881A (ko) | 2011-10-06 |
CN102218777A (zh) | 2011-10-19 |
JP5216040B2 (ja) | 2013-06-19 |
TW201134777A (en) | 2011-10-16 |
CN102218777B (zh) | 2016-02-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101318818B1 (ko) | 취성 재료 기판의 분단 방법 | |
JP6039363B2 (ja) | 脆性材料基板の分断方法並びに分断装置 | |
JP6140012B2 (ja) | 貼り合わせ基板のブレイク方法 | |
KR101278056B1 (ko) | 분단 장치 | |
KR20150045944A (ko) | 가공 대상물 절단 방법 | |
JP2006199553A (ja) | 基板分断装置及び基板分断方法 | |
KR101073459B1 (ko) | 접합 기판의 단자 가공 방법 | |
TWI620634B (zh) | Expander, breaking device and breaking method | |
CN111916356A (zh) | 金属积层陶瓷基板的分断方法 | |
TWI545636B (zh) | Fracture with a brittle material substrate and its cutting method | |
KR102351927B1 (ko) | 브레이크 장치 및 브레이크 장치에 있어서의 취성 재료 기판의 분단 방법 | |
JP2011218607A (ja) | 基板分割装置および基板分割方法 | |
JP5161926B2 (ja) | 分断装置 | |
JP5237318B2 (ja) | 基板分断装置 | |
KR20160015145A (ko) | 접합 기판의 분단 방법 및 분단 장치 | |
JP5161925B2 (ja) | 分断装置 | |
KR102351832B1 (ko) | 접합 기판의 분단 방법 및 브레이크날 | |
JP6114422B2 (ja) | 貼り合わせ基板の分断装置 | |
TWI842825B (zh) | 晶圓之裂斷方法 | |
JP2020181931A (ja) | ウエハーのブレイク方法並びにブレイク装置 | |
JP5913483B2 (ja) | 脆性材料基板の分断方法並びに分断装置 | |
JP5161928B2 (ja) | 分断装置 | |
KR20200112655A (ko) | 취성 재료 기판의 브레이크 장치 및 브레이크 방법 | |
JP5941570B2 (ja) | 貼り合わせ基板の分断装置およびブレーク刃 | |
JP2015017014A (ja) | 貼り合わせ基板のブレイク装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E90F | Notification of reason for final refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20160921 Year of fee payment: 4 |
|
LAPS | Lapse due to unpaid annual fee |