KR101318818B1 - 취성 재료 기판의 분단 방법 - Google Patents

취성 재료 기판의 분단 방법 Download PDF

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Publication number
KR101318818B1
KR101318818B1 KR1020110024771A KR20110024771A KR101318818B1 KR 101318818 B1 KR101318818 B1 KR 101318818B1 KR 1020110024771 A KR1020110024771 A KR 1020110024771A KR 20110024771 A KR20110024771 A KR 20110024771A KR 101318818 B1 KR101318818 B1 KR 101318818B1
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KR
South Korea
Prior art keywords
substrate
scribe line
scribe
brittle material
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KR1020110024771A
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English (en)
Korean (ko)
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KR20110109881A (ko
Inventor
켄지 무라카미
마사카즈 다케다
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20110109881A publication Critical patent/KR20110109881A/ko
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Publication of KR101318818B1 publication Critical patent/KR101318818B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020110024771A 2010-03-31 2011-03-21 취성 재료 기판의 분단 방법 KR101318818B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-082952 2010-03-31
JP2010082952A JP5216040B2 (ja) 2010-03-31 2010-03-31 脆性材料基板の分断方法

Publications (2)

Publication Number Publication Date
KR20110109881A KR20110109881A (ko) 2011-10-06
KR101318818B1 true KR101318818B1 (ko) 2013-10-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110024771A KR101318818B1 (ko) 2010-03-31 2011-03-21 취성 재료 기판의 분단 방법

Country Status (4)

Country Link
JP (1) JP5216040B2 (ja)
KR (1) KR101318818B1 (ja)
CN (1) CN102218777B (ja)
TW (1) TWI429604B (ja)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5187421B2 (ja) * 2010-11-30 2013-04-24 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
CN102581967B (zh) * 2012-02-06 2015-02-04 安徽白鹭电子科技有限公司 带有v型槽的微小硅片的切断方法
CN103586985A (zh) * 2012-08-17 2014-02-19 佳友科技有限公司 脆性材料加工方法与***
JP5991133B2 (ja) * 2012-10-16 2016-09-14 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク用治具及びブレイク方法
JP6043150B2 (ja) * 2012-10-29 2016-12-14 三星ダイヤモンド工業株式会社 積層脆性材料基板のブレイク装置および積層脆性材料基板のブレイク方法
JP6014490B2 (ja) * 2012-12-27 2016-10-25 三星ダイヤモンド工業株式会社 分断方法、及び分断装置
JP6163341B2 (ja) * 2013-04-02 2017-07-12 三星ダイヤモンド工業株式会社 ブレイク装置
JP6140012B2 (ja) * 2013-07-08 2017-05-31 三星ダイヤモンド工業株式会社 貼り合わせ基板のブレイク方法
JP6262960B2 (ja) * 2013-08-23 2018-01-17 三星ダイヤモンド工業株式会社 基板分断装置
JP6207307B2 (ja) * 2013-09-03 2017-10-04 三星ダイヤモンド工業株式会社 ブレイク装置
JP6185812B2 (ja) * 2013-09-30 2017-08-23 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法並びにブレイク装置
JP6154713B2 (ja) * 2013-09-30 2017-06-28 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法並びにブレイク装置
JP6268917B2 (ja) * 2013-10-25 2018-01-31 三星ダイヤモンド工業株式会社 ブレイク装置
JP6243699B2 (ja) 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
KR20160023075A (ko) * 2014-08-21 2016-03-03 한국미쯔보시다이아몬드공업(주) 기판 브레이크 장치
JP6481465B2 (ja) 2014-08-21 2019-03-13 三星ダイヤモンド工業株式会社 複合基板のブレイク方法
JP5913483B2 (ja) * 2014-08-25 2016-04-27 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置
JP6627326B2 (ja) * 2015-08-20 2020-01-08 三星ダイヤモンド工業株式会社 ブレイク装置
JP6271486B2 (ja) * 2015-09-29 2018-01-31 三星ダイヤモンド工業株式会社 ブレイクバー
TWI632040B (zh) * 2017-07-10 2018-08-11 煜峰投資顧問有限公司 脆性材料基板裂片裝置及使用該裝置之裂片方法
CN109093857B (zh) * 2018-07-03 2020-05-26 常州大学 基于双面应力集中的切割机
TWI820177B (zh) * 2018-09-26 2023-11-01 日商三星鑽石工業股份有限公司 附有金屬膜之基板的分割方法
TW202041343A (zh) * 2018-12-18 2020-11-16 日商三星鑽石工業股份有限公司 陶瓷片的製造方法及陶瓷片製造用之煅燒前片的製造方法
CN110328765A (zh) * 2019-07-05 2019-10-15 苏州德龙激光股份有限公司 晶圆裂片装置
CN111517630A (zh) * 2020-05-29 2020-08-11 河北南玻玻璃有限公司 一种玻璃清边装置
CN111896347B (zh) * 2020-08-07 2024-06-14 广东韶钢松山股份有限公司 一种截断装置及设备
EP4263447A1 (en) * 2020-12-21 2023-10-25 Corning Incorporated Substrate cutting and separating systems and methods

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JP2007067365A (ja) * 2005-08-05 2007-03-15 Alps Electric Co Ltd 電子機器の製造方法
KR20080095204A (ko) * 2007-04-23 2008-10-28 가부시키가이샤 도요다 지도숏키 유기 디바이스 제조 방법

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* Cited by examiner, † Cited by third party
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CN2516547Y (zh) * 2001-12-10 2002-10-16 洛阳北方玻璃技术股份有限公司 多头双臂数控直线玻璃切割机
DE60331423D1 (de) * 2002-04-01 2010-04-08 Mitsuboshi Diamond Ind Co Ltd Teilverfahren für substrat aus zerbrechlichem material und das verfahren verwendende teilvorrichtung
JP4742649B2 (ja) * 2005-04-05 2011-08-10 ソニー株式会社 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法
JP2007073602A (ja) * 2005-09-05 2007-03-22 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067365A (ja) * 2005-08-05 2007-03-15 Alps Electric Co Ltd 電子機器の製造方法
KR20080095204A (ko) * 2007-04-23 2008-10-28 가부시키가이샤 도요다 지도숏키 유기 디바이스 제조 방법

Also Published As

Publication number Publication date
TWI429604B (zh) 2014-03-11
JP2011212963A (ja) 2011-10-27
KR20110109881A (ko) 2011-10-06
CN102218777A (zh) 2011-10-19
JP5216040B2 (ja) 2013-06-19
TW201134777A (en) 2011-10-16
CN102218777B (zh) 2016-02-24

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