KR101057878B1 - 프린트 배선 기판 및 그 제조 방법 - Google Patents

프린트 배선 기판 및 그 제조 방법 Download PDF

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Publication number: KR101057878B1
Authority: KR; South Korea
Prior art keywords: layer; copper plating; wiring board; printed wiring; less
Prior art date: 2009-07-06

Application number

KR20100064440A

Other languages

English (en)

Korean (ko)

Other versions

KR20110004306A (ko

Inventor

코헤이 이시카와

히데키 오자키

카즈히로 오사와

Original Assignee

미쓰이 긴조꾸 고교 가부시키가이샤

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-07-06

Filing date

2010-07-05

Publication date

2011-08-19

2010-07-05 Application filed by 미쓰이 긴조꾸 고교 가부시키가이샤 filed Critical 미쓰이 긴조꾸 고교 가부시키가이샤

2011-01-13 Publication of KR20110004306A publication Critical patent/KR20110004306A/ko

2011-08-19 Application granted granted Critical

2011-08-19 Publication of KR101057878B1 publication Critical patent/KR101057878B1/ko

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Engineering & Computer Science (AREA)
Manufacturing Of Printed Wiring (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Wire Bonding (AREA)

KR20100064440A 2009-07-06 2010-07-05 프린트 배선 기판 및 그 제조 방법 KR101057878B1 (ko)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JPJP-P-2009-160198		2009-07-06
JP2009160198A JP2011014848A (ja)	2009-07-06	2009-07-06	プリント配線基板及びその製造方法

Publications (2)

Publication Number	Publication Date
KR20110004306A KR20110004306A (ko)	2011-01-13
KR101057878B1 true KR101057878B1 (ko)	2011-08-19

Family

ID=43593428

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR20100064440A KR101057878B1 (ko)	2009-07-06	2010-07-05	프린트 배선 기판 및 그 제조 방법

Country Status (3)

Country	Link
JP (1)	JP2011014848A (ja)
KR (1)	KR101057878B1 (ja)
TW (1)	TWI406614B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20130086831A (ko) *	2012-01-26	2013-08-05	김정식	선도금과 후에칭방법에 의한 극미세 회로를 가지는 기판의 제조방법과 그에 의하여 제작된 극미세 회로기판

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6236824B2 (ja) *	2012-03-29	2017-11-29	宇部興産株式会社	プリント配線基板の製造方法
JP6035678B2 (ja) *	2013-02-19	2016-11-30	住友金属鉱山株式会社	フレキシブル配線板の製造方法ならびにフレキシブル配線板
CN103227160B (zh) *	2013-03-18	2016-03-16	三星半导体(中国)研究开发有限公司	一种混合的表面镀层及其制造方法
CN104837301A (zh) *	2014-02-12	2015-08-12	富葵精密组件(深圳)有限公司	具有屏蔽结构的柔性电路板及其制作方法
US20170074771A1 (en) *	2014-05-29	2017-03-16	Chemical Materials Evaluation And Research Base	Standard film for correction of water vapor permeability measurement device, method for manufacturing same, standard film set for correction, and correction method using same
CN104619123B (zh) *	2015-01-05	2018-11-09	惠州市星之光科技有限公司	一种pcb板的制作方法
TWI640422B (zh)	2016-02-09	2018-11-11	Ｊｘ金屬股份有限公司	印刷配線板用積層體、印刷配線板之製造方法及電子機器之製造方法
JP7087759B2 (ja) *	2018-07-18	2022-06-21	住友金属鉱山株式会社	銅張積層板
JP7087760B2 (ja) *	2018-07-18	2022-06-21	住友金属鉱山株式会社	銅張積層板
US11871514B2 (en) *	2020-04-01	2024-01-09	Sumitomo Electric Industries, Ltd.	Flexible printed circuit board and method for producing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2006278950A (ja)	2005-03-30	2006-10-12	Fujikura Ltd	プリント配線板およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW517502B (en) *	1998-09-14	2003-01-11	Ibiden Co Ltd	Printed circuit board and its manufacturing method
TWI235025B (en) *	2004-03-03	2005-06-21	Phoenix Prec Technology Corp	Circuit board structure and method for fabricating the same

2009
- 2009-07-06 JP JP2009160198A patent/JP2011014848A/ja active Pending
2010
- 2010-06-11 TW TW99119040A patent/TWI406614B/zh not_active IP Right Cessation
- 2010-07-05 KR KR20100064440A patent/KR101057878B1/ko active IP Right Grant

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2006278950A (ja)	2005-03-30	2006-10-12	Fujikura Ltd	プリント配線板およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20130086831A (ko) *	2012-01-26	2013-08-05	김정식	선도금과 후에칭방법에 의한 극미세 회로를 가지는 기판의 제조방법과 그에 의하여 제작된 극미세 회로기판

Also Published As

Publication number	Publication date
JP2011014848A (ja)	2011-01-20
TWI406614B (zh)	2013-08-21
KR20110004306A (ko)	2011-01-13
TW201106824A (en)	2011-02-16

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