KR101033650B1 - A method of peeling off for coatings - Google Patents

A method of peeling off for coatings Download PDF

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Publication number
KR101033650B1
KR101033650B1 KR1020100061163A KR20100061163A KR101033650B1 KR 101033650 B1 KR101033650 B1 KR 101033650B1 KR 1020100061163 A KR1020100061163 A KR 1020100061163A KR 20100061163 A KR20100061163 A KR 20100061163A KR 101033650 B1 KR101033650 B1 KR 101033650B1
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KR
South Korea
Prior art keywords
parts
peeling
weight
minutes
coating film
Prior art date
Application number
KR1020100061163A
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Korean (ko)
Inventor
윤병호
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윤병호
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Priority to KR1020100061163A priority Critical patent/KR101033650B1/en
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Publication of KR101033650B1 publication Critical patent/KR101033650B1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/06Cleaning involving contact with liquid using perforated drums in which the article or material is placed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26DRYING
    • F26BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B1/00Preliminary treatment of solid materials or objects to facilitate drying, e.g. mixing or backmixing the materials to be dried with predominantly dry solids
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/62Plastics recycling; Rubber recycling

Abstract

The present invention relates to a method of peeling a coating film of stainless steel.
In the present invention, the pre-treatment process for immersing the part to be peeled in the remover chemicals in the environment of the temperature of 5 ℃-60 ℃ for 5 minutes to 48 hours to peel off the coating film of the component, and the temperature of the finished part is 20 ℃ -80 A peeling process of immersing in an acid of 5 ° C. for 5 minutes to 1 hour to remove the residue on the painted surface, a first washing process for removing the chemicals on the parts where the peeling process is completed, and a temperature of 40 ° C.- An ultrasonic treatment to soak the components in a caustic soda in an environment of 80 ° C. for 1 to 20 minutes to remove fine residues on the surface using ultrasonic waves, and to remove the chemicals on the components using water. A peeling method of a coating film including a washing process and a drying process for removing water on the surface of the part is provided.

Description

A method of peeling off for coatings

The peeling method of the thermosetting coating film apply | coated to the stainless surface, such as an electronic product of this invention, is related. More specifically, the present invention relates to a peeling method of a thermosetting coating film for removing a coating applied to a surface of a stainless material used as a part or a case of a mobile phone.

Electronic products, in particular, stainless steel, which is used as a material for parts and cases, such as mobile phones, which have a high production volume, are used by coating their surfaces. There are many defects in painting during or after painting such mobile phone parts. Conscious of the competition for product reliability among mobile phone manufacturers and consumers who are sensitive to product defects, the quality of the product inspection increases during the shipment of mobile phones, and many defects such as paint defects and scratches are found on the coatings of mobile phone parts or cases. It is often treated poorly.

In the past, many peeling techniques have been developed to remove, reprocess and recycle paint from plastic resins or stainless steel used in defective products, home appliances and automobiles. However, defects in the coating of stainless steel or plastic resins found in the production process of a mobile phone or just before shipment are not defects of the product itself, and are generally not able to be shipped due to poor coating or scratches. In order to reuse these parts, the coating must be peeled off, and the peeling is difficult due to the size of the small part and the firm adhesion of the thermosetting coating film, and the peeling is not perfected so that the part can be reused as it is after peeling. In addition, during the peeling process of the parts, the parts themselves may be scratched and deformed, and thus they may not be reused. In addition, since the cost of peeling the coating film from the parts is expensive, the defective parts are often discarded. Therefore, there is a great deal of economic loss and environmental degradation.

Therefore, there is a need for a method of completely removing the coating film of many products in a short time in a large number of mobile phone parts that are defective in painting.

The present invention is to solve the problems of the prior art, an object of the present invention is to remove the coating film of a large number of products in a large amount of mobile phone parts having a defect in the painting in a short time, the deformation or scratches, etc. of the parts removed the coating film It is to provide a peeling method of the coating film does not occur.

As a technical solution for achieving the object of the present invention, in the present invention, the pre-treatment process of soaking the part to be peeled in the remover chemicals of the temperature 5 ℃-60 ℃ environment for 5 minutes to 48 hours and called the coating film of the part; The immersion process is completed by immersing the pre-treated parts in an acid of 20 ° C.-80 ° C. for 5 minutes to 1 hour to remove the residue on the painted surface, and the chemicals on the parts after the peeling process are completed with water. A first washing process for removing, an ultrasonic treatment for immersing the parts in a caustic soda at a temperature of 40 ° C.-80 ° C. for 1 to 20 minutes to remove fine residues on the surface using ultrasonic waves, and the parts A method of peeling a coating film is provided, including a second washing process for removing a chemical contained in the water by using water, and a drying process for removing water on the surface of the part.

According to the present invention, it is possible to remove the coating film of many products in a short time in a large number of mobile phone parts that are defective in painting, it is possible to implement a peeling method of the coating film that does not cause deformation or scratches of the parts from which the coating film is removed.

BRIEF DESCRIPTION OF THE DRAWINGS It is a flowchart for demonstrating the Example which concerns on the peeling method of the coating film of this invention.

Hereinafter, with reference to the accompanying drawings, the configuration of the invention according to an embodiment of the present invention will be described in detail.

As shown in FIG. 1, the present invention is a method for peeling a coating film applied to a stainless steel component such as a mobile phone, and soaking the component to be peeled for 5 minutes to 48 hours in a remover chemical at a temperature of 5 ° C to 60 ° C. A pre-treatment process (S100), which is called a coating of a component, and a peeling process (S102) of immersing the pre-processed component in an acid having a temperature of 20 ° C.-80 ° C. for 5 minutes to 1 hour to remove the residue on the painted surface; In addition, the first washing process (S104) for removing the chemicals on the parts after the peeling process is completed with water, and soaking the parts in a caustic soda in a temperature of 40 ° C-80 ° C for 1 to 20 minutes using ultrasonic waves Ultrasonic treatment process (S106) for removing the fine residues on the surface by the second washing process (S108) for removing the chemicals on the parts using water, and for removing water on the surface of the parts dry It includes information (S110).

The peeling process (S102) is configured to repeat the same process at least once. That is, the peeling process (S102), the first peeling process of immersing the parts in the acid of 20 ℃ -80 ℃ environment for 5 minutes to 1 hour to remove the residue on the painted surface, the temperature of the parts 20 ℃ A second peeling process of immersing in an acid of -80 ° C for 5 minutes to 1 hour to remove the residue on the painted surface; and soaking the part in an acid of 20 ° C to 80 ° C for 5 minutes to 1 hour It may include a third peeling process for removing the residue of the cotton.

As described above, the reason for repeating the peeling process (S102) of the present invention is a means for processing a large amount of parts in a short time. In order to process the plurality of peeling target parts in which the pretreatment process S100 is completed in one peeling process S102, there is a problem of waiting for a long processing time and a processing chamber that can accommodate a large amount of parts. Therefore, the peeling process (S102) is divided into two or three stages, while repeatedly performing in a small process chamber and divided processing time, it is a configuration to continue the peeling process. By doing in this way, a large amount of peeling components can be processed without a break.

Remover drug used in the pretreatment process (S100), 1 to 3 parts by weight of toluene (methylbenzene) used to synthesize many substances, paraffinwax (paraffinwax) 1 to 2 to suppress the volatility of the remover drug Parts by weight, 0.5 to 1.5 parts by weight of cellulose ether, 5 to 10 parts by weight of methanol (methyl alcohol) as a solubilizer, 75 to 85 parts by weight of methylene chloride as a stripping solvent, mineral spirits as solvents ) 5-7 parts by weight of the mixture.

The preferred synthetic ratio of the remover drug of the present invention is 2.13 parts by weight of toluene (methylbenzene), 1.6 parts by weight of paraffinwax, 1.2 parts by weight of cellulose ether, methanol (methyl alcohol) It is recommended to synthesize at a ratio of 7.8 parts by weight, 81.1 parts by weight of methylene chloride, and 6.2 parts by weight of mineral spirits.

In the present invention, methylene chloride is used as the release agent, which is used as a solvent having an excellent effect on peeling paint, and is used for peeling off the coating film. In general, when methylene chloride is used as the release agent, the amount is known to be preferably 30 to 40 parts by weight. If less than 30 parts by weight, the peeling time is longer, and if it exceeds 40 parts by weight, the boiling point of the overall composition is lowered because the generation of steam is increased. However, methylene chloride as the release agent of the present invention has a mixing ratio of 75 to 85 parts by weight, preferably 81.1 parts by weight. This is because it is possible to reduce the boiling point of the composition by shortening the peeling time and mixing paraffin wax which is resistant to chemicals and is less volatile. Therefore, in the present invention, by using methylene chloride as a main component and increasing the mixed content thereof, the peeling time of the part coating film can be significantly shortened.

In addition, since the solvent has a dissolving ability to organic substances, 5-10 parts by weight of methanol (methyl alcohol), which is used as an overall phase stabilizer of the detergent and the composition, is less than 5 parts by weight. In this case, the peeling effect is reduced. Therefore, the preferred amount of methanol (methyl alcohol) in the present invention is 7.8 parts by weight to increase the cleaning power and phase stability.

In addition, the mineral spirits (mineral spirits) has a cleaning function, the cellulose ether (methocel) is a composition for the moisturizing function.

In addition, the acid used in the exfoliation process (S102) includes sulfuric acid.

Claims (5)

In the method of peeling the coating film, which removes the coating film of many products in a short time from a large number of mobile phone parts that are defective in painting, but does not cause deformation or scratches of the removed parts,
A pretreatment step of immersing the part to be peeled in the remover chemical at a temperature of 5 ° C. to 60 ° C. for 5 minutes to 48 hours to peel off the coating film of the part;
A first peeling process in which the pretreated parts are immersed in an acid in a 20 ° C.-80 ° C. environment for 5 minutes to 1 hour in a first processing chamber to remove remnants of the painted surface;
After completion of the first peeling process, a second peeling process of immersing the component in an acid in a 20 ° C.-80 ° C. environment for 5 minutes to 1 hour in a second processing chamber to remove the residue on the painted surface;
After completion of the second peeling process, a third peeling process of immersing the parts in an acid of a temperature of 20 ° C.-80 ° C. for 5 minutes to 1 hour in a third processing chamber to remove residues on the painted surface;
A first washing process for removing the chemicals on the parts of which the third peeling process is completed, with water;
An ultrasonic treatment process in which the parts are immersed in a caustic soda in a temperature of 40 ° C.-80 ° C. for 1 to 20 minutes to remove fine residues on the surface using ultrasonic waves,
A second washing process of removing the chemicals on the parts by using water,
A drying process for removing water on the surface of the part,
The remover medicine, based on methylene chloride (methylene chloride), but 1 to 3 parts by weight of toluene (methylbenzene) used to synthesize many substances, paraffin wax (paraffinwax to avoid lowering the boiling point of the composition ) 1 to 2 parts by weight, 0.5 to 1.5 parts by weight of cellulose ether, 5 to 10 parts by weight of methanol (methyl alcohol) as a solubilizer, 75 to 85 parts by weight of methylene chloride as a solvent, and minerals that are solvents Peeling method of the coating film comprising 5 to 7 parts by weight of spirit (mineral spirits).
delete In the method of peeling the coating film, which removes the coating film of many products in a short time from a large number of mobile phone parts that are defective in painting, but does not cause deformation or scratches of the removed parts,
A pretreatment step of immersing the part to be peeled in the remover chemical at a temperature of 5 ° C. to 60 ° C. for 5 minutes to 48 hours to peel off the coating film of the part;
A first peeling process in which the pretreated parts are immersed in an acid in a 20 ° C.-80 ° C. environment for 5 minutes to 1 hour in a first processing chamber to remove remnants of the painted surface;
After completion of the first peeling process, a second peeling process of immersing the component in an acid in a 20 ° C.-80 ° C. environment for 5 minutes to 1 hour in a second processing chamber to remove the residue on the painted surface;
After completion of the second peeling process, a third peeling process of immersing the parts in an acid of a temperature of 20 ° C.-80 ° C. for 5 minutes to 1 hour in a third processing chamber to remove residues on the painted surface;
A first washing process for removing the chemicals on the parts of which the third peeling process is completed, with water;
An ultrasonic treatment process in which the parts are immersed in a caustic soda in a temperature of 40 ° C.-80 ° C. for 1 to 20 minutes to remove fine residues on the surface using ultrasonic waves,
A second washing process of removing the chemicals on the parts by using water,
A drying process for removing water on the surface of the part,
The remover drug is based on methylene chloride (methylene chloride), toluene (methylbenzene) 2.13 parts by weight, paraffinwax (1.6 parts by weight), cellulose ether (methocel) 1.2 parts by weight, methanol (methanol) (Methyl alcohol) 7.8 parts by weight, methylene chloride (methylene chloride) 81.1 parts by weight, 6.2 parts by weight of mineral spirits (mineral spirits) The peeling method of a coating film comprising a.
delete delete
KR1020100061163A 2010-06-28 2010-06-28 A method of peeling off for coatings KR101033650B1 (en)

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KR1020100061163A KR101033650B1 (en) 2010-06-28 2010-06-28 A method of peeling off for coatings

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Application Number Priority Date Filing Date Title
KR1020100061163A KR101033650B1 (en) 2010-06-28 2010-06-28 A method of peeling off for coatings

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090036715A (en) * 2007-10-10 2009-04-15 주식회사 실트론 Method for cleaning silicon wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090036715A (en) * 2007-10-10 2009-04-15 주식회사 실트론 Method for cleaning silicon wafer

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