KR100898821B1 - 웨이퍼 캐리어의 제조방법 - Google Patents
웨이퍼 캐리어의 제조방법 Download PDFInfo
- Publication number
- KR100898821B1 KR100898821B1 KR1020070122655A KR20070122655A KR100898821B1 KR 100898821 B1 KR100898821 B1 KR 100898821B1 KR 1020070122655 A KR1020070122655 A KR 1020070122655A KR 20070122655 A KR20070122655 A KR 20070122655A KR 100898821 B1 KR100898821 B1 KR 100898821B1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- wafer carrier
- hole
- manufacturing
- carrier
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 21
- 238000000576 coating method Methods 0.000 claims abstract description 21
- 238000005498 polishing Methods 0.000 claims abstract description 19
- 239000002002 slurry Substances 0.000 claims abstract description 8
- 239000003550 marker Substances 0.000 claims description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052799 carbon Inorganic materials 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract description 2
- 229910003460 diamond Inorganic materials 0.000 abstract description 2
- 239000010432 diamond Substances 0.000 abstract description 2
- 239000011247 coating layer Substances 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 241000282472 Canis lupus familiaris Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49982—Coating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (3)
- 웨이퍼의 양면을 연마하기 위한 웨이퍼의 양면 연마장치에 구비되는 웨이퍼 캐리어의 제조방법에 있어서,상기 웨이퍼 캐리어를 구성하는 본체를 미리 설정된 형상으로 가공하는 가공단계;상기 웨이퍼 캐리어의 본체에 예비공 및 슬러리를 유입하기 위한 슬러리 유입공을 관통 형성하는 형성단계;상기 예비공이 형성된 본체에 디엘씨를 코팅하는 코팅단계; 및상기 디엘씨 코팅후에 상기 예비공을 확공하여 웨이퍼를 삽입하기 위한 웨이퍼 유지공을 형성하는 웨이퍼 유지공 형성단계;를 구비하는 것을 특징으로 하는 웨이퍼 캐리어의 제조방법.
- 제 1항에 있어서,상기 예비공을 형성한 후 상기 디엘씨를 코팅하기 전에, 상기 본체의 전면 및 배면 중 적어도 하나의 면에 상기 예비공의 중심점으로부터 서로 동일한 거리에 배치되도록 상기 본체에 부착 가능한 표식부재를 부착하는 부착단계;를 더 구비하는 것을 특징으로 하는 웨이퍼 캐리어의 제조방법.
- 제 2항에 있어서,상기 표식부재를 상기 예비공의 중심점으로부터 방사형으로 배치되도록 적어도 4개 부착하는 것을 특징으로 하는 웨이퍼 캐리어의 제조방법.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070122655A KR100898821B1 (ko) | 2007-11-29 | 2007-11-29 | 웨이퍼 캐리어의 제조방법 |
EP08015234A EP2065131B1 (en) | 2007-11-29 | 2008-08-28 | Method of manufacturing wafer carrier |
US12/201,490 US20090139077A1 (en) | 2007-11-29 | 2008-08-29 | Method of manufacturing wafer carrier |
JP2008233693A JP2009135424A (ja) | 2007-11-29 | 2008-09-11 | ウェーハキャリアの製造方法 |
SG2011039096A SG173996A1 (en) | 2007-11-29 | 2008-09-17 | Method of manufacturing wafer carrier |
SG200806881-9A SG152974A1 (en) | 2007-11-29 | 2008-09-17 | Method of manufacturing wafer carrier |
CNA2008101755535A CN101444899A (zh) | 2007-11-29 | 2008-11-07 | 制造芯片载体的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070122655A KR100898821B1 (ko) | 2007-11-29 | 2007-11-29 | 웨이퍼 캐리어의 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100898821B1 true KR100898821B1 (ko) | 2009-05-22 |
Family
ID=40373423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070122655A KR100898821B1 (ko) | 2007-11-29 | 2007-11-29 | 웨이퍼 캐리어의 제조방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090139077A1 (ko) |
EP (1) | EP2065131B1 (ko) |
JP (1) | JP2009135424A (ko) |
KR (1) | KR100898821B1 (ko) |
CN (1) | CN101444899A (ko) |
SG (2) | SG173996A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101043983B1 (ko) * | 2010-09-01 | 2011-06-24 | 박광진 | 수지재 캐리어 및 그 제조방법 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011003008B4 (de) * | 2011-01-21 | 2018-07-12 | Siltronic Ag | Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben |
JP5741157B2 (ja) * | 2011-04-07 | 2015-07-01 | 旭硝子株式会社 | 研磨用キャリア及び該キャリアを用いたガラス基板の研磨方法及びガラス基板の製造方法 |
TWI425230B (zh) * | 2011-10-25 | 2014-02-01 | Chroma Ate Inc | Touchpad detection machine |
DE102012214998B4 (de) | 2012-08-23 | 2014-07-24 | Siltronic Ag | Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe |
JP6056793B2 (ja) * | 2014-03-14 | 2017-01-11 | 信越半導体株式会社 | 両面研磨装置用キャリアの製造方法及び両面研磨方法 |
JP6424809B2 (ja) * | 2015-12-11 | 2018-11-21 | 信越半導体株式会社 | ウェーハの両面研磨方法 |
JP2018136239A (ja) * | 2017-02-23 | 2018-08-30 | セイコーエプソン株式会社 | 電子部品搬送装置及び電子部品検査装置 |
JP2021102245A (ja) * | 2019-12-25 | 2021-07-15 | スピードファム株式会社 | ワークホール検出装置及びワークホール検出方法 |
Citations (4)
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JP2006303136A (ja) * | 2005-04-20 | 2006-11-02 | Shin Etsu Handotai Co Ltd | 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法 |
JP2007276041A (ja) | 2006-04-05 | 2007-10-25 | Shirasaki Seisakusho:Kk | Dlcコーティングウエハホルダ、およびdlcコーティングウエハホルダの製造方法。 |
KR20070110033A (ko) * | 2005-02-25 | 2007-11-15 | 신에쯔 한도타이 가부시키가이샤 | 양면 연마 장치용 캐리어 및 이를 이용한 양면 연마 장치,양면 연마 방법 |
JP2007301713A (ja) | 2006-04-10 | 2007-11-22 | Kemet Japan Co Ltd | 研磨治具 |
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US5731046A (en) * | 1994-01-18 | 1998-03-24 | Qqc, Inc. | Fabrication of diamond and diamond-like carbon coatings |
JP3379097B2 (ja) * | 1995-11-27 | 2003-02-17 | 信越半導体株式会社 | 両面研磨装置及び方法 |
JPH1110530A (ja) * | 1997-06-25 | 1999-01-19 | Shin Etsu Handotai Co Ltd | 両面研磨用キャリア |
US7008308B2 (en) * | 2003-05-20 | 2006-03-07 | Memc Electronic Materials, Inc. | Wafer carrier |
US7004827B1 (en) * | 2004-02-12 | 2006-02-28 | Komag, Inc. | Method and apparatus for polishing a workpiece |
JP4113509B2 (ja) * | 2004-03-09 | 2008-07-09 | スピードファム株式会社 | 被研磨物保持用キャリア |
WO2006001340A1 (ja) | 2004-06-23 | 2006-01-05 | Komatsu Denshi Kinzoku Kabushiki Kaisha | 両面研磨用キャリアおよびその製造方法 |
US20080166952A1 (en) * | 2005-02-25 | 2008-07-10 | Shin-Etsu Handotai Co., Ltd | Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same |
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DE102007049811B4 (de) * | 2007-10-17 | 2016-07-28 | Peter Wolters Gmbh | Läuferscheibe, Verfahren zur Beschichtung einer Läuferscheibe sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben |
JP4605233B2 (ja) * | 2008-02-27 | 2011-01-05 | 信越半導体株式会社 | 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法 |
JP5452984B2 (ja) * | 2009-06-03 | 2014-03-26 | 不二越機械工業株式会社 | ウェーハの両面研磨方法 |
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2007
- 2007-11-29 KR KR1020070122655A patent/KR100898821B1/ko active IP Right Grant
-
2008
- 2008-08-28 EP EP08015234A patent/EP2065131B1/en active Active
- 2008-08-29 US US12/201,490 patent/US20090139077A1/en not_active Abandoned
- 2008-09-11 JP JP2008233693A patent/JP2009135424A/ja active Pending
- 2008-09-17 SG SG2011039096A patent/SG173996A1/en unknown
- 2008-09-17 SG SG200806881-9A patent/SG152974A1/en unknown
- 2008-11-07 CN CNA2008101755535A patent/CN101444899A/zh active Pending
Patent Citations (4)
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---|---|---|---|---|
KR20070110033A (ko) * | 2005-02-25 | 2007-11-15 | 신에쯔 한도타이 가부시키가이샤 | 양면 연마 장치용 캐리어 및 이를 이용한 양면 연마 장치,양면 연마 방법 |
JP2006303136A (ja) * | 2005-04-20 | 2006-11-02 | Shin Etsu Handotai Co Ltd | 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法 |
JP2007276041A (ja) | 2006-04-05 | 2007-10-25 | Shirasaki Seisakusho:Kk | Dlcコーティングウエハホルダ、およびdlcコーティングウエハホルダの製造方法。 |
JP2007301713A (ja) | 2006-04-10 | 2007-11-22 | Kemet Japan Co Ltd | 研磨治具 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101043983B1 (ko) * | 2010-09-01 | 2011-06-24 | 박광진 | 수지재 캐리어 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
SG152974A1 (en) | 2009-06-29 |
US20090139077A1 (en) | 2009-06-04 |
EP2065131A1 (en) | 2009-06-03 |
JP2009135424A (ja) | 2009-06-18 |
CN101444899A (zh) | 2009-06-03 |
EP2065131B1 (en) | 2012-10-10 |
SG173996A1 (en) | 2011-09-29 |
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