KR100869680B1 - 잉크제트용 잉크 및 그 제법 - Google Patents
잉크제트용 잉크 및 그 제법 Download PDFInfo
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- KR100869680B1 KR100869680B1 KR1020027007533A KR20027007533A KR100869680B1 KR 100869680 B1 KR100869680 B1 KR 100869680B1 KR 1020027007533 A KR1020027007533 A KR 1020027007533A KR 20027007533 A KR20027007533 A KR 20027007533A KR 100869680 B1 KR100869680 B1 KR 100869680B1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/324—Inkjet printing inks characterised by colouring agents containing carbon black
- C09D11/326—Inkjet printing inks characterised by colouring agents containing carbon black characterised by the pigment dispersant
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/773—Nanoparticle, i.e. structure having three dimensions of 100 nm or less
- Y10S977/775—Nanosized powder or flake, e.g. nanosized catalyst
- Y10S977/777—Metallic powder or flake
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/81—Of specified metal or metal alloy composition
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
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- Microelectronics & Electronic Packaging (AREA)
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- Spectroscopy & Molecular Physics (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
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- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (11)
- 입경 100 ㎚ 이하의 금속 초미립자, 및 알킬아민, 카르복실산아미드 및 아미노카르복실산염 중에서 선택된 하나 이상의 분산제를 함유하는 금속 초미립자 독립분산액으로 이루어지고, 상기 금속 초미립자 독립분산액의 점도가 1 ∼ 100 m㎩ㆍs, 그 표면장력이 25 ∼ 80 mN/m 인 것을 특징으로 하는 잉크제트용 잉크로서,가스 분위기 중에서 그리고 제 1 용제 증기의 존재하에서 금속을 증발시킴으로써 용제 중에 금속 초미립자가 분산된 금속 초미립자 분산액을 얻는 제 1 공정과, 이 제 1 공정에서 얻어진 분산액에 저분자량의 극성 용제인 제 2 용제를 첨가하여 이 금속 초미립자를 침강시키고, 그 상등액을 제거함으로써 이 제 1 용제를 제거하는 제 2 공정과, 이렇게 하여 얻어진 침강물에 제 3 용제를 첨가하여 금속 초미립자 독립분산액을 얻는 제 3 공정으로 제조된 것을 특징으로 하는 잉크제트용 잉크이고,상기 제 1 용제가 탄소수 5 이상의 알콜류 또는 아세트산벤질, 스테아르산에틸, 올레인산메틸, 페닐아세트산에틸 및 글리세리드로 이루어진 군에서 선택된 1 종 이상을 함유하는 용제이고,상기 제 3 용제가 주쇄 탄소수 6 ∼ 20 의 비극성 탄화수소, 물 및 탄소수 15 이하의 알콜계 용제로 이루어진 군에서 선택된 1 종 이상을 함유하는 용제인 잉크제트용 잉크.
- 삭제
- 삭제
- 삭제
- 삭제
- 제 1 항에 있어서, 상기 알킬아민의 주쇄 탄소수가 4 ∼ 20 인 것을 특징으로 하는 잉크제트용 잉크.
- 제 1 항에 있어서, 상기 알킬아민이 1 차 알킬아민인 것을 특징으로 하는 잉크제트용 잉크.
- 제 1 항에 있어서, 상기 분산액이 분산매로서 주쇄 탄소수 6 ∼ 20 의 비극성 탄화수소, 물, 및 탄소수가 15 이하의 알콜계 용제에서 선택된 적어도 1 종의 용제를 함유하고 있는 것을 특징으로 하는 잉크제트용 잉크.
- 가스 분위기 중에서 그리고 제 1 용제 증기의 존재하에서 금속을 증발시켜 이 금속 증기와 이 용제 증기를 접촉시키고, 냉각 포집하여 이 용제중에 금속 초미립자가 분산된 금속 초미립자 분산액을 얻는 제 1 공정과, 이 제 1 공정에서 얻어진 분산액에 저분자량의 극성 용제인 제 2 용제를 첨가하여 이 금속 초미립자를 침강시키고, 그 상등액을 제거함으로써 이 제 1 용제를 제거하는 제 2 공정과, 이렇게 하여 얻어진 침강물에 제 3 용제를 첨가하여 금속 초미립자 독립분산액을 얻는 제 3 공정을 갖는 것을 특징으로 하는 잉크제트용 잉크의 제법으로서,상기 제 1 용제가 탄소수 5 이상의 알콜류 또는 아세트산벤질, 스테아르산에틸, 올레인산메틸, 페닐아세트산에틸 및 글리세리드로 이루어진 군에서 선택된 1 종 이상을 함유하는 용제이고,상기 제 3 용제가 주쇄 탄소수 6 ∼ 20 의 비극성 탄화수소, 물 및 탄소수 15 이하의 알콜계 용제로 이루어진 군에서 선택된 1 종 이상을 함유하는 용제이고,상기 금속 초미립자가 입경 100 ㎚ 이하이며, 상기 금속 초미립자 독립분산액의 점도가 1 ∼ 100 m㎩ㆍs, 그 표면장력이 25 ∼ 80 mN/m 인 잉크제트용 잉크의 제법.
- 삭제
- 제 9 항에 있어서, 상기 제 1 공정, 또는 제 3 공정, 또는 제 1 공정과 제 3 공정의 두 공정에서 알킬아민, 카르복실산아미드 및 아미노카르복실산염 중에서 선택된 하나 이상의 분산제를 첨가하는 것을 특징으로 하는 잉크제트용 잉크의 제법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2000-00313592 | 2000-10-13 | ||
JP2000313592A JP5008216B2 (ja) | 2000-10-13 | 2000-10-13 | インクジェット用インクの製法 |
Publications (2)
Publication Number | Publication Date |
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KR20020074167A KR20020074167A (ko) | 2002-09-28 |
KR100869680B1 true KR100869680B1 (ko) | 2008-11-21 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020027007533A KR100869680B1 (ko) | 2000-10-13 | 2001-10-12 | 잉크제트용 잉크 및 그 제법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7708910B2 (ko) |
EP (1) | EP1329488B1 (ko) |
JP (1) | JP5008216B2 (ko) |
KR (1) | KR100869680B1 (ko) |
DE (1) | DE60125394T2 (ko) |
TW (1) | TWI245061B (ko) |
WO (1) | WO2002031068A1 (ko) |
Families Citing this family (52)
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JP4677092B2 (ja) * | 2000-12-04 | 2011-04-27 | 株式会社アルバック | フラットパネルディスプレイの電極形成方法 |
WO2003038002A1 (en) * | 2001-11-01 | 2003-05-08 | Yissum Research Development Company Of The Hebrew University Of Jerusalem | Ink-jet inks containing metal nanoparticles |
JP4068883B2 (ja) * | 2002-04-22 | 2008-03-26 | セイコーエプソン株式会社 | 導電膜配線の形成方法、膜構造体の製造方法、電気光学装置の製造方法、及び電子機器の製造方法 |
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CN1322075C (zh) * | 2002-06-13 | 2007-06-20 | 耐诺泡德斯工业有限公司 | 导电的透明纳米涂层与纳米油墨的制造方法以及该方法制得的纳米粉末涂层和油墨 |
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DE60125394D1 (de) | 2007-02-01 |
EP1329488A1 (en) | 2003-07-23 |
TWI245061B (en) | 2005-12-11 |
EP1329488A4 (en) | 2004-12-01 |
JP5008216B2 (ja) | 2012-08-22 |
KR20020074167A (ko) | 2002-09-28 |
US7708910B2 (en) | 2010-05-04 |
DE60125394T2 (de) | 2007-09-27 |
JP2002121437A (ja) | 2002-04-23 |
EP1329488B1 (en) | 2006-12-20 |
WO2002031068A1 (fr) | 2002-04-18 |
US20030110978A1 (en) | 2003-06-19 |
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