KR100761310B1 - 테스트 핸들러용 소팅 테이블 장치 - Google Patents
테스트 핸들러용 소팅 테이블 장치 Download PDFInfo
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- KR100761310B1 KR100761310B1 KR1020060009771A KR20060009771A KR100761310B1 KR 100761310 B1 KR100761310 B1 KR 100761310B1 KR 1020060009771 A KR1020060009771 A KR 1020060009771A KR 20060009771 A KR20060009771 A KR 20060009771A KR 100761310 B1 KR100761310 B1 KR 100761310B1
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- semiconductor element
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- test handler
- sorting table
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (6)
- 반도체 소자를 적재시킬 수 있는 적재부를 적어도 하나 이상 가지는 기대; 및상기 기대의 선형운동을 가능하게 하는 구동장치; 를 포함하고,상기 기대에는 상기 적재부의 하측에 상기 기대의 선형운동 방향으로 상기 기대를 관통하도록 형성되는 흡기공과, 상기 흡기공을 상기 적재부에 연통시키는 흡착공이 형성됨으로써 상기 기대의 선형운동에 동기하여 상기 적재부에 반도체 소자를 흡착시키는 것을 특징으로 하는 테스트 핸들러용 소팅 테이블 장치.
- 삭제
- 삭제
- 반도체 소자를 적재시킬 수 있는 적재부를 적어도 하나 이상 가지는 기대; 및상기 기대의 선형운동을 가능하게 하는 구동장치; 를 포함하고,상기 기대에는 상기 적재부의 하측에 상기 기대의 선형운동 방향으로 상기 기대를 관통하도록 형성되는 흡기홈과, 상기 흡기홈을 상기 적재부에 연통시키는 흡착공이 형성됨으로써 상기 기대의 선형운동에 동기하여 상기 적재부에 반도체 소자를 흡착시키는 것을 특징으로 하는 테스트 핸들러용 소팅 테이블 장치.
- 삭제
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060009771A KR100761310B1 (ko) | 2006-02-01 | 2006-02-01 | 테스트 핸들러용 소팅 테이블 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060009771A KR100761310B1 (ko) | 2006-02-01 | 2006-02-01 | 테스트 핸들러용 소팅 테이블 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070079223A KR20070079223A (ko) | 2007-08-06 |
KR100761310B1 true KR100761310B1 (ko) | 2007-09-27 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060009771A KR100761310B1 (ko) | 2006-02-01 | 2006-02-01 | 테스트 핸들러용 소팅 테이블 장치 |
Country Status (1)
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KR (1) | KR100761310B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200455999Y1 (ko) * | 2007-07-19 | 2011-10-07 | (주)테크윙 | 테스트핸들러용 기동형 테이블 장치 |
US11112451B2 (en) | 2018-07-17 | 2021-09-07 | Samsung Electronics Co., Ltd. | Test method for semiconductor devices and a test system for semiconductor devices |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100864590B1 (ko) * | 2007-09-20 | 2008-10-22 | 주식회사 케이엔제이 | 반도체 패키지의 소팅테이블 |
KR102058443B1 (ko) | 2014-03-03 | 2020-02-07 | (주)테크윙 | 테스트핸들러 및 테스트핸들러에서의 테스트트레이 순환 방법 |
KR101490310B1 (ko) * | 2014-08-14 | 2015-02-04 | (주)메티스 | 후프 이송장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04256400A (ja) * | 1991-02-08 | 1992-09-11 | Nec Kyushu Ltd | Icの搬送機構 |
KR19990000650A (ko) * | 1997-06-09 | 1999-01-15 | 곽노권 | 반도체 가공장치의 팩키지 적재시스템 |
JPH11274202A (ja) | 1998-03-24 | 1999-10-08 | Fuji Xerox Co Ltd | バンプ形成装置およびバンプ形成に使用されるチップトレイ |
US6111417A (en) | 1996-02-17 | 2000-08-29 | Ricoh Company, Ltd. | Semiconductor component test apparatus including sucking mechanism maintaining components in tray during testing |
KR20020049956A (ko) * | 2000-12-20 | 2002-06-26 | 곽 노 권 | 반도체패키지 적재 테이블장치 |
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2006
- 2006-02-01 KR KR1020060009771A patent/KR100761310B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04256400A (ja) * | 1991-02-08 | 1992-09-11 | Nec Kyushu Ltd | Icの搬送機構 |
US6111417A (en) | 1996-02-17 | 2000-08-29 | Ricoh Company, Ltd. | Semiconductor component test apparatus including sucking mechanism maintaining components in tray during testing |
KR19990000650A (ko) * | 1997-06-09 | 1999-01-15 | 곽노권 | 반도체 가공장치의 팩키지 적재시스템 |
JPH11274202A (ja) | 1998-03-24 | 1999-10-08 | Fuji Xerox Co Ltd | バンプ形成装置およびバンプ形成に使用されるチップトレイ |
KR20020049956A (ko) * | 2000-12-20 | 2002-06-26 | 곽 노 권 | 반도체패키지 적재 테이블장치 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200455999Y1 (ko) * | 2007-07-19 | 2011-10-07 | (주)테크윙 | 테스트핸들러용 기동형 테이블 장치 |
US11112451B2 (en) | 2018-07-17 | 2021-09-07 | Samsung Electronics Co., Ltd. | Test method for semiconductor devices and a test system for semiconductor devices |
Also Published As
Publication number | Publication date |
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KR20070079223A (ko) | 2007-08-06 |
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