KR100649640B1 - 측면 방출형 발광다이오드 패키지 - Google Patents
측면 방출형 발광다이오드 패키지 Download PDFInfo
- Publication number
- KR100649640B1 KR100649640B1 KR1020050044649A KR20050044649A KR100649640B1 KR 100649640 B1 KR100649640 B1 KR 100649640B1 KR 1020050044649 A KR1020050044649 A KR 1020050044649A KR 20050044649 A KR20050044649 A KR 20050044649A KR 100649640 B1 KR100649640 B1 KR 100649640B1
- Authority
- KR
- South Korea
- Prior art keywords
- led chip
- led
- lower structure
- mirror
- light
- Prior art date
Links
- 238000007789 sealing Methods 0.000 claims abstract description 39
- 238000002310 reflectometry Methods 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 41
- 239000002184 metal Substances 0.000 claims description 32
- 229920000642 polymer Polymers 0.000 claims description 29
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 230000009974 thixotropic effect Effects 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- 239000000463 material Substances 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 10
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 7
- 238000005266 casting Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 239000012528 membrane Substances 0.000 description 5
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004383 yellowing Methods 0.000 description 3
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/68—Details of reflectors forming part of the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005061431.0A DE102005061431B4 (de) | 2005-02-03 | 2005-12-22 | LED-Einheit der Art Seitenausstrahlung |
TW094146463A TWI294696B (en) | 2005-02-03 | 2005-12-26 | Side-emission type led package related application |
US11/318,837 US7473937B2 (en) | 2005-02-03 | 2005-12-28 | Side-emission type LED package |
JP2005377172A JP4849889B2 (ja) | 2005-02-03 | 2005-12-28 | 側面放出型発光ダイオードパッケージ |
NL1030979A NL1030979C2 (nl) | 2005-02-03 | 2006-01-23 | Led-pakket van het zijkant-emissie-type. |
JP2010137741A JP5419289B2 (ja) | 2005-02-03 | 2010-06-16 | Led組立体 |
JP2011188240A JP5467584B2 (ja) | 2005-02-03 | 2011-08-31 | 側面放出型ledパッケージ及び組立体 |
NL2007700A NL2007700C2 (nl) | 2005-02-03 | 2011-11-02 | Led-samenstel. |
NL2007703A NL2007703C2 (nl) | 2005-02-03 | 2011-11-02 | Led-samenstel. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20050010046 | 2005-02-03 | ||
KR1020050010046 | 2005-02-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060090149A KR20060090149A (ko) | 2006-08-10 |
KR100649640B1 true KR100649640B1 (ko) | 2006-11-27 |
Family
ID=37571518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050044649A KR100649640B1 (ko) | 2005-02-03 | 2005-05-26 | 측면 방출형 발광다이오드 패키지 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP5419289B2 (nl) |
KR (1) | KR100649640B1 (nl) |
NL (3) | NL1030979C2 (nl) |
TW (1) | TWI294696B (nl) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010117167A2 (ko) * | 2009-04-10 | 2010-10-14 | Kim Duk-Yong | 엘이디 조명장치 및 엘이디 조명장치의 면발광 방법 |
WO2014069973A1 (ko) * | 2012-11-05 | 2014-05-08 | 주식회사 애니캐스팅 | 측면 방출형 발광다이오드용 렌즈, 이를 구비하는 백라이트유닛 및 표시장치 |
KR101398186B1 (ko) | 2012-11-05 | 2014-05-23 | (주)애니캐스팅 | 측면 방출형 발광다이오드용 렌즈, 이를 구비하는 백라이트유닛 및 표시장치 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100757828B1 (ko) * | 2006-09-28 | 2007-09-11 | 서울반도체 주식회사 | 전면 발광 다이오드 패키지 |
CN102135239B (zh) * | 2010-01-21 | 2013-01-23 | 财团法人工业技术研究院 | 照明装置及其光学元件模块 |
JP5749555B2 (ja) * | 2011-04-26 | 2015-07-15 | 株式会社エンプラス | 光束制御部材、この光束制御部材を備えた発光装置およびこの発光装置を備えた面光源装置 |
KR101149201B1 (ko) * | 2011-12-20 | 2012-05-25 | 한윤희 | 광고용 엘이디 모듈 및 광고용 엘이디 모듈 제조방법 |
CN103335249B (zh) * | 2013-07-02 | 2016-04-06 | 中节能晶和照明有限公司 | Led中华景观灯 |
CN111063787A (zh) * | 2014-01-23 | 2020-04-24 | 亮锐控股有限公司 | 具有自对准预制透镜的发光设备 |
TWI743540B (zh) * | 2019-08-22 | 2021-10-21 | 友達光電股份有限公司 | 發光單元及其製造方法 |
JP7483474B2 (ja) | 2020-04-15 | 2024-05-15 | 株式会社ジャパンディスプレイ | 照明装置 |
CN114578614A (zh) * | 2020-11-30 | 2022-06-03 | 华为技术有限公司 | 一种背光模组及显示屏 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001185762A (ja) * | 1999-12-24 | 2001-07-06 | Rohm Co Ltd | 裏面実装チップ型発光装置 |
KR20020080834A (ko) * | 2001-04-18 | 2002-10-26 | (주)옵토니카 | 엘.이.디. 투광장치 및 그 제조방법 |
KR20040024747A (ko) * | 2002-09-16 | 2004-03-22 | 주식회사 티씨오 | 고휘도 발광다이오드 및 그 제조방법 |
JP2004140327A (ja) * | 2002-08-21 | 2004-05-13 | Nippon Leiz Co Ltd | 光源および導光体ならびに平面発光装置 |
JP2004281606A (ja) * | 2003-03-14 | 2004-10-07 | Toyoda Gosei Co Ltd | 発光装置およびその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5977249U (ja) * | 1982-11-16 | 1984-05-25 | 日本電気株式会社 | 横方向出力発光ダイオ−ド装置 |
JPH073154U (ja) * | 1993-06-01 | 1995-01-17 | 株式会社アドビック | 発光ダイオードおよび光反射部材ならびに警告灯 |
JPH0918058A (ja) * | 1995-06-29 | 1997-01-17 | Sharp Corp | 発光半導体装置 |
JP2001076513A (ja) * | 1999-09-07 | 2001-03-23 | Stanley Electric Co Ltd | 車両用灯具 |
JP2001185752A (ja) * | 1999-12-24 | 2001-07-06 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置とそれを用いた光信号入出力装置 |
JP4239565B2 (ja) * | 2002-03-20 | 2009-03-18 | 豊田合成株式会社 | 発光器および灯具 |
US6679621B2 (en) * | 2002-06-24 | 2004-01-20 | Lumileds Lighting U.S., Llc | Side emitting LED and lens |
JP2005026503A (ja) * | 2003-07-03 | 2005-01-27 | Matsushita Electric Ind Co Ltd | 半導体発光装置およびその製造方法 |
-
2005
- 2005-05-26 KR KR1020050044649A patent/KR100649640B1/ko active IP Right Grant
- 2005-12-26 TW TW094146463A patent/TWI294696B/zh active
-
2006
- 2006-01-23 NL NL1030979A patent/NL1030979C2/nl active Search and Examination
-
2010
- 2010-06-16 JP JP2010137741A patent/JP5419289B2/ja active Active
-
2011
- 2011-08-31 JP JP2011188240A patent/JP5467584B2/ja active Active
- 2011-11-02 NL NL2007703A patent/NL2007703C2/nl active
- 2011-11-02 NL NL2007700A patent/NL2007700C2/nl active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001185762A (ja) * | 1999-12-24 | 2001-07-06 | Rohm Co Ltd | 裏面実装チップ型発光装置 |
KR20020080834A (ko) * | 2001-04-18 | 2002-10-26 | (주)옵토니카 | 엘.이.디. 투광장치 및 그 제조방법 |
JP2004140327A (ja) * | 2002-08-21 | 2004-05-13 | Nippon Leiz Co Ltd | 光源および導光体ならびに平面発光装置 |
KR20040024747A (ko) * | 2002-09-16 | 2004-03-22 | 주식회사 티씨오 | 고휘도 발광다이오드 및 그 제조방법 |
JP2004281606A (ja) * | 2003-03-14 | 2004-10-07 | Toyoda Gosei Co Ltd | 発光装置およびその製造方法 |
Non-Patent Citations (1)
Title |
---|
13185762 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010117167A2 (ko) * | 2009-04-10 | 2010-10-14 | Kim Duk-Yong | 엘이디 조명장치 및 엘이디 조명장치의 면발광 방법 |
WO2010117167A3 (ko) * | 2009-04-10 | 2011-02-17 | Kim Duk-Yong | 엘이디 조명장치 및 엘이디 조명장치의 면발광 방법 |
WO2014069973A1 (ko) * | 2012-11-05 | 2014-05-08 | 주식회사 애니캐스팅 | 측면 방출형 발광다이오드용 렌즈, 이를 구비하는 백라이트유닛 및 표시장치 |
KR101398186B1 (ko) | 2012-11-05 | 2014-05-23 | (주)애니캐스팅 | 측면 방출형 발광다이오드용 렌즈, 이를 구비하는 백라이트유닛 및 표시장치 |
Also Published As
Publication number | Publication date |
---|---|
NL2007703C2 (nl) | 2013-02-27 |
TW200629609A (en) | 2006-08-16 |
NL1030979C2 (nl) | 2011-11-09 |
NL2007700C2 (nl) | 2013-01-31 |
KR20060090149A (ko) | 2006-08-10 |
JP5419289B2 (ja) | 2014-02-19 |
JP2012009889A (ja) | 2012-01-12 |
TWI294696B (en) | 2008-03-11 |
JP5467584B2 (ja) | 2014-04-09 |
NL2007700A (nl) | 2012-01-16 |
NL1030979A1 (nl) | 2006-08-07 |
NL2007703A (nl) | 2012-01-16 |
JP2010251785A (ja) | 2010-11-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100649640B1 (ko) | 측면 방출형 발광다이오드 패키지 | |
JP4849889B2 (ja) | 側面放出型発光ダイオードパッケージ | |
CN1965417B (zh) | 具有漏斗形状透镜的led聚光灯 | |
KR100631992B1 (ko) | 측면 방출형 이중 렌즈 구조 led 패키지 | |
EP2876490B1 (en) | Display device | |
US7851815B2 (en) | Light-emitting element having at least one light-emitting chip crystal | |
US8120048B2 (en) | LED unit | |
CN103633079A (zh) | 发光器件 | |
US20060238884A1 (en) | Optical lens, light emitting device package using the optical lens, and backlight unit | |
JP2005223112A (ja) | 表面実装型発光ダイオード | |
KR101140923B1 (ko) | 영상 생성 유닛을 위한 광원 | |
KR101028316B1 (ko) | 발광 다이오드 패키지 | |
JP6216272B2 (ja) | Led発光装置 | |
KR102107526B1 (ko) | 발광 소자 패키지 | |
KR100801620B1 (ko) | 볼록 몰딩렌즈를 갖는 led 패키지 및 그 제조방법 | |
KR20060113246A (ko) | Led 패키지를 구비한 백라이트 유닛 | |
KR102531846B1 (ko) | 광학 플레이트, 발광 소자 및 광원 모듈 | |
KR102617482B1 (ko) | 발광소자 패키지 및 이를 포함하는 직하 타입 백라이트 유닛 | |
KR102024297B1 (ko) | 렌즈모듈 및 이를 포함하는 발광소자패키지 | |
KR101297404B1 (ko) | Led 패키지용 히트싱크 및 이를 구비하는 led 패키지 | |
KR101741613B1 (ko) | 발광 소자 패키지 | |
KR101860899B1 (ko) | 발광 소자 패키지 | |
KR102531104B1 (ko) | 광학 플레이트, 발광 소자 및 광원 모듈 | |
KR101831278B1 (ko) | 발광소자 패키지 | |
KR20050090707A (ko) | 칩형 발광다이오드 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121031 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20131031 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20141031 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20151030 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20181031 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20191031 Year of fee payment: 14 |