KR100646176B1 - 항온 유지 장치 - Google Patents
항온 유지 장치 Download PDFInfo
- Publication number
- KR100646176B1 KR100646176B1 KR1020050057886A KR20050057886A KR100646176B1 KR 100646176 B1 KR100646176 B1 KR 100646176B1 KR 1020050057886 A KR1020050057886 A KR 1020050057886A KR 20050057886 A KR20050057886 A KR 20050057886A KR 100646176 B1 KR100646176 B1 KR 100646176B1
- Authority
- KR
- South Korea
- Prior art keywords
- temperature
- cooler
- cooling capacity
- heater
- circulating fluid
- Prior art date
Links
- 238000001816 cooling Methods 0.000 claims abstract description 53
- 239000012530 fluid Substances 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 15
- 238000005057 refrigeration Methods 0.000 claims description 7
- 239000003507 refrigerant Substances 0.000 description 22
- 238000010438 heat treatment Methods 0.000 description 11
- 238000005265 energy consumption Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 6
- 239000000498 cooling water Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000036632 reaction speed Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000013526 supercooled liquid Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/30—Expansion means; Dispositions thereof
- F25B41/31—Expansion valves
- F25B41/34—Expansion valves with the valve member being actuated by electric means, e.g. by piezoelectric actuators
- F25B41/35—Expansion valves with the valve member being actuated by electric means, e.g. by piezoelectric actuators by rotary motors, e.g. by stepping motors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/04—Refrigeration circuit bypassing means
- F25B2400/0403—Refrigeration circuit bypassing means for the condenser
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/04—Refrigeration circuit bypassing means
- F25B2400/0409—Refrigeration circuit bypassing means for the evaporator
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/24—Storage receiver heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2600/00—Control issues
- F25B2600/02—Compressor control
- F25B2600/021—Inverters therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2117—Temperatures of an evaporator
- F25B2700/21171—Temperatures of an evaporator of the fluid cooled by the evaporator
- F25B2700/21172—Temperatures of an evaporator of the fluid cooled by the evaporator at the inlet
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
- F25B2700/2117—Temperatures of an evaporator
- F25B2700/21171—Temperatures of an evaporator of the fluid cooled by the evaporator
- F25B2700/21173—Temperatures of an evaporator of the fluid cooled by the evaporator at the outlet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Plasma & Fusion (AREA)
- Air Conditioning Control Device (AREA)
Abstract
Description
무부하시 | 유부하시 | |||
종래장치 | 본발명장치 | 종래장치 | 본발명장치 | |
외부열부하장치 리턴열부하 | 0 | 0 | 3000 | 3000 |
냉각기능력① | 5000 | 1000 | 5000 | 4000 |
가열기능력② | 5000 | 1000 | 2000 | 1000 |
소비 에너지 (냉각①+가열②) | 5+5=10 | 1+1=2 | 5+2=7 | 4+1=5 |
비고 | 아이들링모드 | 로드 모드 |
Claims (8)
- 냉각기, 가열기 및 외부 열부하 장치를 접속하는 순환액로에 열매체 순환액을 순환시켜서 외부 열부하 장치를 일정한 설정 온도로 유지하는 항온 유지 장치에 있어서,냉각기 입구의 순환액의 온도와 가열기 출구의 순환액의 온도의 온도차에 의거하여 적어도 아이들링 모드와 로드 모드를 포함하는 냉각기 운전 모드를 전환하는 냉각기 운전 모드 전환 수단과, 상기 로드 모드에 있어서 냉각기 출구의 순환액의 온도와 가열기의 설정 온도와의 온도차가 미리 정해진 값의 지정 온도차가 되도록 냉각기의 냉각 능력을 조정하는 냉각 능력 조정 제어 수단을 구비하고 있는 것을 특징으로 하는 항온 유지 장치.
- 제 1항에 있어서,상기 냉각기 운전 모드 전환 수단은, 냉각기의 냉동 사이클중에 조합된 압축기를 구동하는 인버터의 주파수에 의해 냉각 능력을 조정하는 인버터 주파수에 의한 냉각 능력 조정 수단을 구비하고 있는 것을 특징으로 하는 항온 유지 장치.
- 제 1항에 있어서,상기 냉각 능력 조정 제어 수단에 있어서의 지정 온도차는 냉각기의 출구 순환액의 온도가 가열기의 설정 온도보다 미리 정해진 온도만큼 낮게 되도록 설정되 어 있는 것을 특징으로 하는 항온 유지 장치.
- 제 1항 또는 제 3항에 있어서,상기 냉각 능력 조정 제어 수단은 냉각기의 냉동 사이클중에 조합된 전자 팽창 밸브의 밸브 개도에 의해 냉각 능력을 조정하는 전자 팽창 밸브에 의한 냉각 능력 조정 수단을 구비하고 있는 것을 특징으로 하는 항온 유지 장치.
- 제 4항에 있어서,상기 전자 팽창 밸브에 의한 냉각 능력 조정 수단은 냉각기 출구의 순환액의 온도에 의한 피드백 제어 기능을 구비하고 있는 것을 특징으로 하는 항온 유지 장치.
- 제 5항에 있어서,상기 피드백 제어 기능은 냉각기 출구의 순환액의 온도를 미리 정해진 복수의 온도대로 구분하여, 각 온도대에 따라 냉각기의 냉각 능력을 조정하도록 구성되어 있는 것을 특징으로 하는 항온 유지 장치.
- 제 1항에 있어서,상기 가열기는, 해당 가열기 출구의 순환액의 온도에 의한 피드백 제어 기능을 구비하고 있는 것을 특징으로 하는 항온 유지 장치.
- 제 7항에 있어서,상기 피드백 제어 기능이 PID 제어 기능인 것을 특징으로 하는 항온 유지 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2005-00110439 | 2005-04-07 | ||
JP2005110439A JP4566052B2 (ja) | 2005-04-07 | 2005-04-07 | 恒温維持装置。 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060106557A KR20060106557A (ko) | 2006-10-12 |
KR100646176B1 true KR100646176B1 (ko) | 2006-11-14 |
Family
ID=37082064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050057886A KR100646176B1 (ko) | 2005-04-07 | 2005-06-30 | 항온 유지 장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20060225876A1 (ko) |
JP (1) | JP4566052B2 (ko) |
KR (1) | KR100646176B1 (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009174802A (ja) * | 2008-01-25 | 2009-08-06 | Okamura Corp | 冷凍・冷蔵設備の集中管理システム |
KR100876185B1 (ko) | 2008-05-02 | 2008-12-31 | 주식회사 에이알 | 에너지 절약형 항온항습기와 그의 현열 냉각방법 및 냉각제습방법 |
US20100078156A1 (en) * | 2008-09-29 | 2010-04-01 | Power Integration Consulting, Inc. | System and method for cooling an electrical device in a closed air volume |
JP5641709B2 (ja) * | 2009-04-23 | 2014-12-17 | キヤノン株式会社 | デバイス製造装置およびデバイス製造方法 |
JP5084794B2 (ja) * | 2009-07-22 | 2012-11-28 | 住友重機械工業株式会社 | クライオポンプ、及びクライオポンプの監視方法 |
JP5191969B2 (ja) | 2009-09-30 | 2013-05-08 | 三菱重工コンプレッサ株式会社 | ガス処理装置 |
US20120225395A1 (en) * | 2011-03-01 | 2012-09-06 | Haggerty Sean E | Method and system for limiting water boiler heat input |
CN102322715A (zh) * | 2011-09-22 | 2012-01-18 | 合肥美的荣事达电冰箱有限公司 | 制冷***的控制装置和具有其的制冷设备 |
CN102374711A (zh) * | 2011-10-08 | 2012-03-14 | 合肥美的荣事达电冰箱有限公司 | 制冷***和具有该制冷***的冰箱 |
KR102207295B1 (ko) * | 2014-02-12 | 2021-01-26 | 엘지전자 주식회사 | 냉장고, 냉장고의 온수공급시스템, 및 냉장고의 온수공급방법 |
TWI669492B (zh) | 2015-06-05 | 2019-08-21 | 日商伸和控制工業股份有限公司 | Environmental test device |
CN105004110B (zh) * | 2015-07-21 | 2018-01-30 | 三河同飞制冷股份有限公司 | 数控机床用带有热蒸汽补偿的变频温控*** |
JP6537986B2 (ja) * | 2016-01-26 | 2019-07-03 | 伸和コントロールズ株式会社 | 温度制御システム |
US10731903B2 (en) * | 2017-05-01 | 2020-08-04 | Temptronic Corporation | System and method for device under test cooling using digital scroll compressor |
JP2021009590A (ja) * | 2019-07-02 | 2021-01-28 | 株式会社Kelk | 温度制御システム及び温度制御方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH024166A (ja) * | 1988-06-21 | 1990-01-09 | Daikin Ind Ltd | 液体冷却装置の温度制御装置 |
JP2796955B2 (ja) * | 1995-09-25 | 1998-09-10 | 伸和コントロールズ株式会社 | ブラインの供給装置 |
US6866094B2 (en) * | 1997-12-31 | 2005-03-15 | Temptronic Corporation | Temperature-controlled chuck with recovery of circulating temperature control fluid |
JP4626000B2 (ja) * | 1999-12-14 | 2011-02-02 | ダイキン工業株式会社 | 液体冷却装置の温度制御装置 |
JP4295490B2 (ja) * | 2002-11-15 | 2009-07-15 | 東京エレクトロン株式会社 | 処理装置並びに処理装置用のチラー制御方法及びチラー制御装置 |
JP2004198001A (ja) * | 2002-12-17 | 2004-07-15 | Daikin Ind Ltd | 冷凍装置 |
JP4290480B2 (ja) * | 2003-05-28 | 2009-07-08 | 高砂熱学工業株式会社 | 温度制御方法 |
-
2005
- 2005-04-07 JP JP2005110439A patent/JP4566052B2/ja not_active Expired - Fee Related
- 2005-06-30 KR KR1020050057886A patent/KR100646176B1/ko active IP Right Grant
-
2006
- 2006-03-23 US US11/386,641 patent/US20060225876A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR20060106557A (ko) | 2006-10-12 |
JP4566052B2 (ja) | 2010-10-20 |
US20060225876A1 (en) | 2006-10-12 |
JP2006292204A (ja) | 2006-10-26 |
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