KR100621053B1 - 복수전극접착용의 전자부품과 그 실장방법 - Google Patents

복수전극접착용의 전자부품과 그 실장방법 Download PDF

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KR100621053B1
KR100621053B1 KR1020040013848A KR20040013848A KR100621053B1 KR 100621053 B1 KR100621053 B1 KR 100621053B1 KR 1020040013848 A KR1020040013848 A KR 1020040013848A KR 20040013848 A KR20040013848 A KR 20040013848A KR 100621053 B1 KR100621053 B1 KR 100621053B1
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South Korea
Prior art keywords
chip
adhesive
anisotropic conductive
electrode
conductive adhesive
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KR1020040013848A
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English (en)
Korean (ko)
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KR20040078556A (ko
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스다유시
Original Assignee
가부시키가이샤 라이프
유겐가이샤 고쇼
스다 유시
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Publication of KR20040078556A publication Critical patent/KR20040078556A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
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    • H01—ELECTRIC ELEMENTS
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49126—Assembling bases

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020040013848A 2003-03-04 2004-03-02 복수전극접착용의 전자부품과 그 실장방법 KR100621053B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00056587 2003-03-04
JP2003056587A JP3755824B2 (ja) 2003-03-04 2003-03-04 複数電極接着用の電子部品とその実装方法

Publications (2)

Publication Number Publication Date
KR20040078556A KR20040078556A (ko) 2004-09-10
KR100621053B1 true KR100621053B1 (ko) 2006-09-08

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KR1020040013848A KR100621053B1 (ko) 2003-03-04 2004-03-02 복수전극접착용의 전자부품과 그 실장방법

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Country Link
US (1) US6911606B2 (ja)
JP (1) JP3755824B2 (ja)
KR (1) KR100621053B1 (ja)
DE (1) DE102004010633A1 (ja)

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Publication number Priority date Publication date Assignee Title
JP4676196B2 (ja) * 2004-12-16 2011-04-27 富士通株式会社 Ｒｆｉｄタグ
US8169090B2 (en) * 2005-05-31 2012-05-01 Sumitomo Bakelite Company, Ltd. Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same
KR100704969B1 (ko) * 2005-11-28 2007-04-09 삼성전기주식회사 적외선 차단필터 본딩 장치
KR100704911B1 (ko) * 2005-12-26 2007-04-09 삼성전기주식회사 전자소자 내장형 인쇄회로기판 및 그 제조방법
EP1976354A4 (en) * 2006-01-20 2012-08-01 Fujitsu Ltd STRUCTURE AND METHOD FOR MOUNTING COMPONENTS INTO PELLETS AND ELECTRONIC DEVICE
KR100818101B1 (ko) * 2006-11-08 2008-03-31 주식회사 하이닉스반도체 웨이퍼 레벨 칩 사이즈 패키지
CN101303443A (zh) * 2007-05-11 2008-11-12 鸿富锦精密工业（深圳）有限公司 相机模组及其组装方法
US7802466B2 (en) * 2007-11-28 2010-09-28 Sierra Sensors Gmbh Oscillating sensor and fluid sample analysis using an oscillating sensor
KR100946619B1 (ko) * 2008-03-26 2010-03-09 알트론 주식회사 캠 단면을 가지는 압착 부재를 이용한 지지 방열 장치
KR20100010747A (ko) * 2008-07-23 2010-02-02 삼성전자주식회사 반도체 소자 패키지
JP2010034423A (ja) * 2008-07-30 2010-02-12 Fujitsu Ltd 加圧加熱装置及び方法
KR101201981B1 (ko) 2010-05-25 2012-11-15 한국생산기술연구원 열가역적 수지를 포함하는 접착층을 사용한 플립 칩 접합방법
JP4865067B1 (ja) * 2010-07-30 2012-02-01 株式会社東芝 電子機器
US8476115B2 (en) * 2011-05-03 2013-07-02 Stats Chippac, Ltd. Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material
US8877558B2 (en) * 2013-02-07 2014-11-04 Harris Corporation Method for making electronic device with liquid crystal polymer and related devices
US10249593B2 (en) 2014-06-20 2019-04-02 Agency For Science, Technology And Research Method for bonding a chip to a wafer
CN106292035B (zh) 2016-09-22 2018-05-08 京东方科技集团股份有限公司 压感显示面板及其制造方法、压感显示装置
KR101947237B1 (ko) * 2016-10-27 2019-05-10 현대자동차주식회사 열전 모듈 제조 장치
JP2018117049A (ja) * 2017-01-18 2018-07-26 株式会社ディスコ パッケージデバイスの製造方法
KR101897061B1 (ko) * 2018-03-21 2018-09-10 손방용 잉크카트리지 재생용 fpcb를 이용한 카트리지 재생방법
KR101897057B1 (ko) * 2018-03-21 2018-09-10 손방용 잉크카트리지 재생용 컨트롤러가 실장된 fpcb
CN111111006A (zh) * 2019-11-29 2020-05-08 深圳先进技术研究院 一种植入式医疗器件及其制造方法
CN112969284B (zh) * 2021-02-19 2022-06-24 深圳市众芯诺科技有限公司 一种嵌入式光学字符智能识别芯片
CN116759388B (zh) * 2023-08-18 2023-10-27 合肥阿基米德电子科技有限公司 一种免焊接模块封装结构

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5162613A (en) * 1991-07-01 1992-11-10 At&T Bell Laboratories Integrated circuit interconnection technique
JPH10270496A (ja) * 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
DE19754874A1 (de) * 1997-12-10 1999-06-24 Siemens Ag Verfahren zur Umformung eines Substrats mit Randkontakten in ein Ball Grid Array, nach diesem Verfahren hergestelltes Ball Grid Array und flexible Verdrahtung zur Umformung eines Substrats mit Randkontakten in ein Ball Grid Array
US6342731B1 (en) * 1997-12-31 2002-01-29 Micron Technology, Inc. Vertically mountable semiconductor device, assembly, and methods
US6629363B1 (en) * 1998-01-22 2003-10-07 International Business Machines Corporation Process for mechanically attaching a temporary lid to a microelectronic package
US6288906B1 (en) * 1998-12-18 2001-09-11 Intel Corporation Multiple layer printed circuit board having power planes on outer layers
JP2000286526A (ja) * 1999-03-30 2000-10-13 Murata Mfg Co Ltd 表面実装構造及びその表面実装構造に用いられる表面実装型電子部品
US6717819B1 (en) * 1999-06-01 2004-04-06 Amerasia International Technology, Inc. Solderable flexible adhesive interposer as for an electronic package, and method for making same
JP3491595B2 (ja) * 2000-02-25 2004-01-26 ソニーケミカル株式会社 異方導電性接着フィルム
US6512183B2 (en) * 2000-10-10 2003-01-28 Matsushita Electric Industrial Co., Ltd. Electronic component mounted member and repair method thereof
JP2002299809A (ja) 2001-03-29 2002-10-11 Matsushita Electric Ind Co Ltd 電子部品の実装方法および実装装置
JP3855679B2 (ja) * 2001-05-01 2006-12-13 株式会社村田製作所 表面実装型電子部品
US6770822B2 (en) * 2002-02-22 2004-08-03 Bridgewave Communications, Inc. High frequency device packages and methods

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