KR100621053B1 - 복수전극접착용의 전자부품과 그 실장방법 - Google Patents
복수전극접착용의 전자부품과 그 실장방법 Download PDFInfo
- Publication number
- KR100621053B1 KR100621053B1 KR1020040013848A KR20040013848A KR100621053B1 KR 100621053 B1 KR100621053 B1 KR 100621053B1 KR 1020040013848 A KR1020040013848 A KR 1020040013848A KR 20040013848 A KR20040013848 A KR 20040013848A KR 100621053 B1 KR100621053 B1 KR 100621053B1
- Authority
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- South Korea
- Prior art keywords
- chip
- adhesive
- anisotropic conductive
- electrode
- conductive adhesive
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 155
- 230000001070 adhesive effect Effects 0.000 claims abstract description 149
- 238000003825 pressing Methods 0.000 claims abstract description 23
- 238000009413 insulation Methods 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 230000002950 deficient Effects 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 abstract 1
- 238000002788 crimping Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2003-00056587 | 2003-03-04 | ||
JP2003056587A JP3755824B2 (ja) | 2003-03-04 | 2003-03-04 | 複数電極接着用の電子部品とその実装方法 |
Publications (2)
Publication Number | Publication Date |
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KR20040078556A KR20040078556A (ko) | 2004-09-10 |
KR100621053B1 true KR100621053B1 (ko) | 2006-09-08 |
Family
ID=32866665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020040013848A KR100621053B1 (ko) | 2003-03-04 | 2004-03-02 | 복수전극접착용의 전자부품과 그 실장방법 |
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US (1) | US6911606B2 (ja) |
JP (1) | JP3755824B2 (ja) |
KR (1) | KR100621053B1 (ja) |
DE (1) | DE102004010633A1 (ja) |
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KR100704969B1 (ko) * | 2005-11-28 | 2007-04-09 | 삼성전기주식회사 | 적외선 차단필터 본딩 장치 |
KR100704911B1 (ko) * | 2005-12-26 | 2007-04-09 | 삼성전기주식회사 | 전자소자 내장형 인쇄회로기판 및 그 제조방법 |
EP1976354A4 (en) * | 2006-01-20 | 2012-08-01 | Fujitsu Ltd | STRUCTURE AND METHOD FOR MOUNTING COMPONENTS INTO PELLETS AND ELECTRONIC DEVICE |
KR100818101B1 (ko) * | 2006-11-08 | 2008-03-31 | 주식회사 하이닉스반도체 | 웨이퍼 레벨 칩 사이즈 패키지 |
CN101303443A (zh) * | 2007-05-11 | 2008-11-12 | 鸿富锦精密工业(深圳)有限公司 | 相机模组及其组装方法 |
US7802466B2 (en) * | 2007-11-28 | 2010-09-28 | Sierra Sensors Gmbh | Oscillating sensor and fluid sample analysis using an oscillating sensor |
KR100946619B1 (ko) * | 2008-03-26 | 2010-03-09 | 알트론 주식회사 | 캠 단면을 가지는 압착 부재를 이용한 지지 방열 장치 |
KR20100010747A (ko) * | 2008-07-23 | 2010-02-02 | 삼성전자주식회사 | 반도체 소자 패키지 |
JP2010034423A (ja) * | 2008-07-30 | 2010-02-12 | Fujitsu Ltd | 加圧加熱装置及び方法 |
KR101201981B1 (ko) | 2010-05-25 | 2012-11-15 | 한국생산기술연구원 | 열가역적 수지를 포함하는 접착층을 사용한 플립 칩 접합방법 |
JP4865067B1 (ja) * | 2010-07-30 | 2012-02-01 | 株式会社東芝 | 電子機器 |
US8476115B2 (en) * | 2011-05-03 | 2013-07-02 | Stats Chippac, Ltd. | Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material |
US8877558B2 (en) * | 2013-02-07 | 2014-11-04 | Harris Corporation | Method for making electronic device with liquid crystal polymer and related devices |
US10249593B2 (en) | 2014-06-20 | 2019-04-02 | Agency For Science, Technology And Research | Method for bonding a chip to a wafer |
CN106292035B (zh) | 2016-09-22 | 2018-05-08 | 京东方科技集团股份有限公司 | 压感显示面板及其制造方法、压感显示装置 |
KR101947237B1 (ko) * | 2016-10-27 | 2019-05-10 | 현대자동차주식회사 | 열전 모듈 제조 장치 |
JP2018117049A (ja) * | 2017-01-18 | 2018-07-26 | 株式会社ディスコ | パッケージデバイスの製造方法 |
KR101897061B1 (ko) * | 2018-03-21 | 2018-09-10 | 손방용 | 잉크카트리지 재생용 fpcb를 이용한 카트리지 재생방법 |
KR101897057B1 (ko) * | 2018-03-21 | 2018-09-10 | 손방용 | 잉크카트리지 재생용 컨트롤러가 실장된 fpcb |
CN111111006A (zh) * | 2019-11-29 | 2020-05-08 | 深圳先进技术研究院 | 一种植入式医疗器件及其制造方法 |
CN112969284B (zh) * | 2021-02-19 | 2022-06-24 | 深圳市众芯诺科技有限公司 | 一种嵌入式光学字符智能识别芯片 |
CN116759388B (zh) * | 2023-08-18 | 2023-10-27 | 合肥阿基米德电子科技有限公司 | 一种免焊接模块封装结构 |
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JP2000286526A (ja) * | 1999-03-30 | 2000-10-13 | Murata Mfg Co Ltd | 表面実装構造及びその表面実装構造に用いられる表面実装型電子部品 |
US6717819B1 (en) * | 1999-06-01 | 2004-04-06 | Amerasia International Technology, Inc. | Solderable flexible adhesive interposer as for an electronic package, and method for making same |
JP3491595B2 (ja) * | 2000-02-25 | 2004-01-26 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
US6512183B2 (en) * | 2000-10-10 | 2003-01-28 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounted member and repair method thereof |
JP2002299809A (ja) | 2001-03-29 | 2002-10-11 | Matsushita Electric Ind Co Ltd | 電子部品の実装方法および実装装置 |
JP3855679B2 (ja) * | 2001-05-01 | 2006-12-13 | 株式会社村田製作所 | 表面実装型電子部品 |
US6770822B2 (en) * | 2002-02-22 | 2004-08-03 | Bridgewave Communications, Inc. | High frequency device packages and methods |
-
2003
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2004
- 2004-03-02 DE DE102004010633A patent/DE102004010633A1/de not_active Ceased
- 2004-03-02 KR KR1020040013848A patent/KR100621053B1/ko not_active IP Right Cessation
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Also Published As
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US6911606B2 (en) | 2005-06-28 |
DE102004010633A1 (de) | 2004-09-16 |
JP3755824B2 (ja) | 2006-03-15 |
US20040173372A1 (en) | 2004-09-09 |
KR20040078556A (ko) | 2004-09-10 |
JP2004266175A (ja) | 2004-09-24 |
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