CN101303443A - 相机模组及其组装方法 - Google Patents

相机模组及其组装方法 Download PDF

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CN101303443A
CN101303443A CNA2007102006002A CN200710200600A CN101303443A CN 101303443 A CN101303443 A CN 101303443A CN A2007102006002 A CNA2007102006002 A CN A2007102006002A CN 200710200600 A CN200710200600 A CN 200710200600A CN 101303443 A CN101303443 A CN 101303443A
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circuit board
camera module
image sensing
anisotropic conductive
sensing module
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王仁照
雷安长
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNA2007102006002A priority Critical patent/CN101303443A/zh
Priority to US11/923,045 priority patent/US20080280389A1/en
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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Abstract

一种相机模组组装方法，其包括下列步骤：提供一个具有接着区的电路板；在该电路板的接着区上涂布液态异方性导电胶；将一个待组装的影像感测模组放置于电路板的接着区上；对放置有影像感测模组的电路板进行热压着制程，以将影像感测模组通过异方性导电胶固接于电路板并电性导通。上述相机模组组装方法采用液态状异方性导电胶将影像感测模组与电路板导通，由于液态异方导电胶更易于实现自动化，可降低人员需求，同时人为因素所产生的不良会降低，因而有利于提高良率，降低成本。本发明还涉及一种由此组装方法所组装的相机模组。

Description

相机模组及其组装方法
技术领域
本发明关于一种相机模组制程，尤其是关于一种相机模组组装方法及由该组装方法所组装的相机模组。
背景技术
随着电子科技不断的发展与进步，各式各样的电子产品均朝着数字化发展。并且，为了符合轻便性与实用性的需要，在电子产品的设计规格上，都趋向轻薄短小、功能多、且处理速度快发展，以利于制作的产品能更容易携带，且更符合现代的生活需求。特别是在多媒体电脑大行其道后，强大的运算能力，可轻易地处理各种音效、影像、图样等数字化资料。连带的使与影像有关的周边设备，亦受到广泛的发展与运用。例如，个人数字处理器、数字音响、扫描仪以及数码相机等。
在电子产品朝着轻薄短小发展过程中，简化制程，降低成本成为任一个生产商所追求的目标，因此，将制程流水作业化，同时又能降低成本的制程越来越受人们的重视。
通常相机模组的组装方法包括下列步骤，首先提供一具有接点的软板，并在该软板有接点的表面贴附半固态状异方性导电膜；然后将具有外接点的影像感测模组置于该软板上，并使影像感测模组具有外接点的一面与软板上的异方性导电膜相接；最后利用热压机将该影像感测模组与软板热压固接在一起，并使得软板的接点与影像感测模组的外接点电性导通，从而该影像感测模组组装完成。
上述相机模组的组装方法所采用的异方性导电膜是将导电粒子均匀分布于粘合剂中，并将其涂覆在一绝缘膜上，在热压制程中，受影像感测模组的外接点与软板的接点部分的挤压(因为接点部分较无接点部分突出)，使得绝缘膜破裂，从而在影像感测模组与软板之间形成导通。
所述异方性导电膜作为影像感测模组与软板的接着材料，因为其为半固态状，使得将异方性导电膜贴附于软板的制程中，要依照产品的尺寸来裁切异方性导电膜，因此通常采用单站方式作业，且利用人工将异方性导电膜贴附于软板上，由于人工作业存在误差，而会降低了产品良率，同时由于人力成本的存在也提高了组装成本。
发明内容
有鉴于此，有必要提供一种能提高产品良率且降低组装成本的相机模组及其组装方法。
一种相机模组组装方法，其包括下列步骤：
提供一个具有接着区的电路板；
在该电路板的接着区上涂布液态异方性导电胶；
将一个具有基板的待组装影像感测模组放置于电路板的接着区上；
对放置有影像感测模组的电路板进行热压着制程，以将影像感测模组通过异方性导电胶固接于电路板并电性导通。
一种相机模组，其包括一个具有接着区的电路板；一个具有基板的影像感测模组；一由液态固化于该电路板的接着区与影像感测模组的基板之间的异方性导电胶。所述影像感测模组通过异方性导电胶固接于电路板并电性导通。
上述相机模组的组装方法采用液态状异方性导电胶将影像感测模组与电路板导通，由于液态异方导电胶无需进行胶材裁切，因而更易于实现自动化，可降低人员需求，同时人为因素所产生的不良会降低，因而有利于提高良率，降低成本。
附图说明
图1是本发明所提供的相机模组组装方法的流程图；
图2是本发明所提供的待组装电路板的结构示意图；
图3是本发明所提供的液态异方性导电胶的结构示意图；
图4是本发明所提供的待组装影像感测模组的结构示意图；
图5是图2的电路板与图4的影像感测模组组装后的结构示意图；
图6是图5的影像感测模组组装后的局部放大示意图。
具体实施方式
为了对本发明作更进一步的说明，举一较佳实施例并配合附图详细描述如下。
请参阅图1，为本发明实施例的所提供的相机模组100的组装方法流程图，该组装方法包括以下步骤。
步骤一：提供一具有接着区的电路板。
如图2所示，所述电路板13具有一个接着区131。该接着区131上设置有多个裸露且突出于接着区131表面的接点132，该接点132与电路板13上的导线(图未示)相连，用于传输电信号。该电路板13优选为一挠性电路板，该挠性电路板可以为陶瓷软板或热固性塑胶软板，在本实施例中所述电路板13为热固性塑胶软板。
步骤二：将液态异方性导电胶涂布于电路板的接着区上；
如图3所示，所述异方性导电胶14(Anisotropic Conductive Adhesives，简称ACA)的初始状态为液态，其是将导电颗粒141分布于绝缘热固性(Thermosets)粘胶树脂142中而制成一种沿平行于所涂覆表面方向呈绝缘状态，而在受压时沿垂直于所涂覆表面的方向电性导通。该ACA胶14可以用罐或针筒来盛装。在使用罐来盛装时，可以用钢版或网版印刷方式来将该ACA胶14涂布于接着区131上。在使用针筒盛装时，可以利用时间/气压控制的点胶机将该ACA胶14涂布于接着区131上。在本实施中，利用时间/气压控制下的点胶机(图未示)将该ACA胶涂布于接着区131上。
步骤三：将电路板上的液态异方性导电胶粘稠化。
在电路板13涂布液态ACA胶14后，为了让所述待组装的影像感测模组10更好与该电路板13固定，优选地，在放置待组装的影像感测模组10前，先使该涂布在电路板13上的ACA胶14粘稠化以保持一定的厚度。该粘稠化的方法可以为一烘烤制程，也可以为其它方法，如将该涂布有液态ACA胶14的电路板13，放置于空气中一段时间直到该液态ACA胶14粘稠化。在本实施例中，该粘稠化方法为一烘烤制程。在该烘烤制程中，所用的烤箱为快速硬化烤箱(SnapCure Oven)，烘烤所用的时间与温度根据需要而设定，如电路板13的材料特性。
步骤四：将待组装影像感测模组放置于涂布有异方性导电胶的电路板上。
请参阅图4，该待组装影像感测模组10包括一个用于成像的镜头模组11以及一个设置于该镜头模组11一端的影像感测器12。
该镜头模组11包括一个镜座111、一个设置于该镜座111一端的一个镜筒112以及容置于该镜筒112中的一个镜片组113。
该影像感测器12包括一个基板121、一个设置于基板121上且与基板121电连接的影像感测晶片122、一个与基板121胶接的透光盖板123以及用于胶接盖板123与基板121的粘胶124。该影像感测晶片122设置于盖板123、粘胶124以及基板121所形成的密封空间中，其用于感测来自镜头模组11所成的像，并将该所成的像转换成电信号。所述基板121具有多个与影像感测晶片122电连接且裸露于影像感测模组12外面的外接点1211，该外接点1211设置于基板121相对于影像感测晶片122的另一表面并突出于该表面，用于与相机模组100的其他元件，如电路板13电连接以输出由影像感测晶片122所转换的电信号。
该影像感测器12设置于镜头模组11的镜座111的一端，该镜座111的底部相固接于贴附影像感测晶片122的基板121的一面。
该影像感测模组10可以通过一吸嘴或夹爪(图未示)将其放置于电路板13的接着区131上。可以想到的是，为了将该影像感测模组10与电路板13的接着区131对准，可采用置于吸嘴或夹爪上的高倍率的辨视镜(图未示)以及与控制吸嘴或夹爪的吸取臂(图未示)来放置所述影像感测模组10。
步骤五：对电路板连同影像感测模组进行热压着制程。
如图5及图6所示，将待组装的影像感测模组10放置在电路板13的接着区131上后，通过热压着制程把该影像感测模组10与电路板13相固接，由于影像感测模组10的基板121的外接点1211部分与电路板13上的接点132部分突出于无接点部分，使得基板121的外接点1211与电路板13上的接点132之间的ACA胶14的导电颗粒141之间的绝缘粘胶树脂142被挤压出有接点的部分，且导电颗粒141仍留置在基板121的外接点1211与电路板13上的接点132之间。而在无接点部分导电颗粒141之间仍有绝缘粘胶树脂142，从而使得ACA胶14在沿平行电路板13的涂覆表面方向呈绝缘状态，垂直于该电路板13的涂覆表面方向呈电性导通状态。请再参阅图5，热压制程后的电路板的接点部分与基板的外接点部分之间的导电粒子的密度大于其无接点部分的密度。在本实施例中，通过热压机(图未示)来将电路板13与影像感测模组10压着在一起，其热压着制程中所设定的温度、时间以及压力根据需要而设定。
热压着制程结束后，由影像感测模组10、电路板13以及异方性导电胶14所组成的相机模组100的组装便已完成，如要进行其它制程，如打包组装好的相机模组100，继续其它制程即可。
可以想到的是，只要电路板13的接着区131上的接点132与基板121的外接点121中的至少其中之一突出于所处的表面，在热压着制程中就可以使得导电颗粒141留置在基板121的外接点1211与电路板13上的接点132之间，而在无接点部分导电颗粒141之间仍有绝缘粘胶树脂142，从而使得ACA胶14在沿平行电路板13的涂覆表面方向呈绝缘状态，垂直于该电路板13的涂覆表面方向呈电性导通状态，进而使得影像感测模组10与电路板13电性导通。
上述相机模组100的组装方法利用液态状异方性导电胶14将影像感测模组10与电路板13导通，由于液态异方性导电胶14无需裁切，更易于实现自动化，可降低人员需求，从而降低人力成本，同时人为因素所产生的不良会降低，从而良率提高。
另外，本领域技术人员还可在本发明精神内做其它变化，只要其不偏离本发明的技术效果，都应包含在本发明所要求保护的范围之内。

Claims (10)

1.一种相机模组组装方法，其包括下列步骤：
提供一个具有接着区的电路板；
在该电路板的接着区上涂布液态异方性导电胶；
将一个待组装影像感测模组放置于电路板的接着区上；
对放置有影像感测模组的电路板进行热压着制程，以将影像感测模组通过异方性导电胶固接于电路板并电性导通。
2.如权利要求1所述的相机模组组装方法，其特征在于：该电路板为挠性电路板，该挠性电路板为陶瓷软板与热固性塑胶软板中的一种。
3.如权利要求1所述的相机模组组装方法，其特征在于：所述相机模组组装方法在电路板的接着区上涂布液态异方性导电胶后，还包括一将电路板上的液态异方性导电胶粘稠化的制程。
4.如权利要求3所述的相机模组组装方法，其特征在于：该使电路板上的液态异方性导电胶粘稠化的制程为一烘烤制程，其烘烤制程所用的烤箱为快速硬化烤箱
5.如权利要求1所述的相机模组组装方法，其特征在于：所述液态异方性导电胶用印刷方式涂布于所述电路板上。
6.如权利要求5所述的相机模组组装方法，其特征在于：所述印刷方法为钢版与网版印刷中的一种。
7.如权利要求1所述的相机模组组装方法，其特征在于：所述液态异方性导电胶运用点胶机涂布于所述电路板上。
8.一种相机模组，其特征在于，该相机模组包括一个具有接着区的电路板；一个具有基板的影像感测模组；一由液态固化于该电路板的接着区与影像感测模组的基板之间的异方性导电胶，所述影像感测模组与该电路板通过异方性导电胶固接且电性导通。
9.如权利要求8所述的相机模组，其特征在于：所述电路板的接着区具有多个接点，且所述影像感测模组的基板上具有多个与接着区的接点相对应设置的外接点。
10.如权利要求9所述的相机模组，其特征在于：所述电路板的接着区上的接点与所述基板的外接点中的至少其中之一突出于其所处的表面。
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