KR100584435B1 - 열경화성 수지조성물 - Google Patents
열경화성 수지조성물 Download PDFInfo
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- KR100584435B1 KR100584435B1 KR1020020041915A KR20020041915A KR100584435B1 KR 100584435 B1 KR100584435 B1 KR 100584435B1 KR 1020020041915 A KR1020020041915 A KR 1020020041915A KR 20020041915 A KR20020041915 A KR 20020041915A KR 100584435 B1 KR100584435 B1 KR 100584435B1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
성분(㎏) | 실시예 1 | 실시예 2 | 실시예 3 | 실시예 4 | 실시예 5 | 실시예 6 |
A | 100 | - | - | 100 | 100 | 100 |
B | - | - | - | - | - | - |
C | - | 100 | - | - | - | - |
D | - | - | 100 | - | - | - |
E | - | - | - | - | - | - |
F | - | - | - | - | - | - |
G | - | - | - | - | - | - |
H | 40 | 60 | - | - | - | - |
I | - | - | 100 | 40 | 40 | 40 |
J | - | 60 | - | - | - | - |
K | 100 | - | 100 | 80 | 80 | 80 |
L | 10 | - | - | - | - | - |
M | - | 100 | 50 | 50 | 50 | 50 |
N | - | - | - | - | - | - |
O | 10 | 10 | 10 | 10 | 10 | - |
P | - | - | - | - | - | 10 |
Q | 100 | 60 | - | - | - | 100 |
R | - | - | 100 | 120 | - | - |
S | - | - | - | - | 100 | - |
T | 16 | 12 | 15 | 16 | 15 | 16 |
U | - | - | - | - | - | - |
V | - | - | - | - | - | - |
W | - | - | - | - | - | - |
X | - | - | 150 | - | - | - |
Y | 120 | - | - | - | - | - |
Z | - | 100 | - | 100 | 100 | 100 |
ZZ | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 |
성분(㎏) | 실시예 7 | 실시예 8 | 실시예 9 | 실시예 10 | 비교 실시예 1 | 비교 실시예 2 |
A | - | - | - | - | 100 | - |
B | - | 100 | - | - | - | - |
C | - | - | - | - | - | - |
D | - | - | - | - | - | - |
E | - | - | 100 | - | - | - |
F | - | - | - | 100 | - | - |
G | 100 | - | - | - | - | - |
H | 60 | 50 | 50 | - | 40 | 60 |
I | - | - | 50 | - | - | - |
J | 60 | - | - | - | - | 60 |
K | - | - | 100 | 100 | 100 | - |
L | - | 50 | - | - | 10 | - |
M | 100 | 100 | - | 80 | - | 100 |
N | - | - | - | 50 | - | - |
O | 10 | 10 | 10 | 10 | 10 | 10 |
P | - | - | - | - | - | - |
Q | 100 | 80 | - | 120 | - | 100 |
R | - | - | - | - | - | - |
S | - | - | 100 | - | - | - |
T | 16 | - | 15 | 20 | 16 | - |
U | - | 10 | - | - | - | 20 |
V | - | - | - | - | - | 100 |
W | - | - | - | - | 100 | - |
X | 150 | 150 | 150 | - | - | 150 |
Y | - | - | - | 150 | 120 | - |
Z | - | - | - | - | - | - |
ZZ | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 |
실시예 11 | 실시예 12 | 실시예 13 | 실시예 14 | 실시예 15 | 실시예 16 | |
*1 | 실시예 1 | 실시예 2 | 실시예 3 | 실시예 4 | 실시예 5 | 실시예 6 |
*2 | 기포 50~100μ | 기포 50~100μ | 기포 50~100μ | 기포 50~100μ | 기포 50~100μ | 기포 50~100μ |
*3 | 없음 | 없음 | 없음 | 없음 | 없음 | 없음 |
*4 | H | 3H | H | H | H | H |
*5 | 3μ이내 | 3μ이내 | 3μ이내 | 3μ이내 | 3μ이내 | 3μ이내 |
*6 | 없음 | 없음 | 없음 | 없음 | 없음 | 없음 |
*7 | 없음 | 없음 | 없음 | 없음 | 없음 | 없음 |
*8 | 없음 | 없음 | 없음 | 없음 | 없음 | 없음 |
*9 | 없음 | 없음 | 없음 | 없음 | 없음 | 없음 |
실시예 17 | 실시예 18 | 실시예 19 | 실시예 20 | 비교 실시예 3 | 비교 실시예 4 | |
*1 | 실시예 7 | 실시예 8 | 실시예 9 | 실시예 10 | 비교 실시예 1 | 비교 실시예 2 |
*2 | 기포 50~100μ | 기포 50μ | 기포 50μ | 기포 50μ | 기포 50~100μ | 기포 50μ |
*3 | 없음 | 없음 | 없음 | 없음 | 기포 50μ | 없음 |
*4 | 2H | H | H | H | 접착성 | 접착성 |
*5 | 3μ이내 | 3μ이내 | 3μ이내 | 3μ이내 | - | - |
*6 | 없음 | 없음 | 없음 | 없음 | - | - |
*7 | 없음 | 없음 | 없음 | 없음 | - | - |
*8 | 없음 | 없음 | 없음 | 없음 | - | - |
*9 | 거의 없음 | 없음 | 없음 | 없음 | - | - |
Claims (16)
- (Ⅰ) 100 중량부의 에폭시 수지와 불포화 지방산의 부가물(불포화 지방산을 에폭시 수지 중의 에폭시기 20~80 %에 첨가함), (Ⅱ) 50~300 중량부의 (메트)아크릴레이트, (Ⅲ) 5~20 중량부의 라디칼 중합 개시제, (Ⅳ) 50~200 중량부의 결정성 에폭시 수지 및 (Ⅴ) 5~30 중량부의 잠재성 경화제를 포함하며,성분(Ⅴ)의 잠재성 경화제는 1차 경화 반응 개시 온도에서 1차 경화 반응을 할 수 있고 150~200 ℃의 온도에서 2차 경화 반응을 할 수 있으며, 성분(Ⅳ)의 용융점은 80~110 ℃이고(이는 1차 경화 반응 개시 온도보다 낮음), 성분(Ⅳ)의 용융점 이상에서 성분(Ⅳ)의 점도는 50 (mPa.s) 이하인 것을 특징으로 하는 열경화성 수지 조성물.
- 제 1 항에 있어서,성분(Ⅰ)은 에폭시가(epoxy value)가 130 내지 400인 에폭시 수지인 것을 특징으로 하는 열경화성 수지 조성물.
- 제 2 항에 있어서,에폭시 수지는 나프탈렌 골격을 갖는 에폭시 수지, 글리시딜아민-에폭시 수지, 트리아진 골격을 갖는 에폭시 수지, 글리시딜에스테르-에폭시 수지 및 지환족-에폭시 수지로 이루어진 그룹으로부터 선택되는 것을 특징으로 하는 열경화성 수지 조성물.
- 제 1 항에 있어서,성분(Ⅱ)는 (메트)아크릴산과 히드록실 화합물의 에스테르화물을 포함하는 것을 특징으로 하는 열경화성 수지 조성물.
- 제 1 항에 있어서,성분(Ⅲ)은 1차 경화 반응용 개시제를 포함하며, 결정성 에폭시 수지(Ⅳ)의 용융점보다 높고 2차 경화 반응의 개시 온도보다 낮은 라디칼 중합 개시 온도를 갖는 것을 특징으로 하는 열경화성 수지 조성물.
- 제 5 항에 있어서.성분(Ⅲ)의 라디칼 중합 온도는 60℃ 내지 150℃인 것을 특징으로 하는 열경화성 수지 조성물.
- 제 1 항에 있어서,성분(Ⅲ)은 에폭시기에 우선하여 1차 경화 반응에 참여하는 불포화 지방산으로부터 유도된 불포화 결합을 포함하는 것을 특징으로 하는 열경화성 수지 조성물.
- 제 1 항에 있어서,성분(Ⅳ)는 상온 내지 1차 경화 반응 개시 온도 범위의 용융점을 갖는 것을 특징으로 하는 열경화성 수지 조성물.
- 제 8 항에 있어서,성분(Ⅳ)의 용융점은 90℃ 내지 105℃인 것을 특징으로 하는 열경화성 수지 조성물.
- 제 1 항에 있어서,성분(Ⅳ)의 용융점 이상일 때 성분(Ⅳ)의 점도는 0.1~20 mPa인 것을 특징으로 하는 열경화성 수지 조성물.
- 삭제
- 제 1 항에 있어서,성분(Ⅴ)는 2차 경화 반응용 잠재성 경화제를 포함하며, 1차 경화 반응 개시 온도보다 높은 2차 경화 반응 개시 온도를 갖는 것을 특징으로 하는 열경화성 수지 조성물.
- 제 12 항에 있어서,성분(Ⅴ)의 2차 경화 반응 개시 온도는 170℃ 내지 200℃인 것을 특징으로 하는 열경화성 수지 조성물.
- 제 1 항에 있어서,충진제, 유기 또는 무기 착색제, 난연제 및 소포제로 이루어진 그룹으로부터 선택되는 첨가제를 함유하는 것을 특징으로 하는 열경화성 수지 조성물.
- 삭제
- 제 1 항에 있어서,100 중량부의 성분(Ⅰ), 150~250 중량부의 성분(Ⅱ), 8~15 중량부의 성분(Ⅲ), 60~120 중량부의 성분(Ⅳ) 및 10~20 중량부의 성분(Ⅴ)를 포함하는 것을 특징으로 하는 열경화성 수지 조성물.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001253678A JP3911690B2 (ja) | 2001-07-19 | 2001-07-19 | 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板 |
JPJP-P-2001-00253678 | 2001-07-19 |
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Publication Number | Publication Date |
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KR20030009192A KR20030009192A (ko) | 2003-01-29 |
KR100584435B1 true KR100584435B1 (ko) | 2006-05-26 |
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KR1020020041915A KR100584435B1 (ko) | 2001-07-19 | 2002-07-18 | 열경화성 수지조성물 |
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US (2) | US6812299B2 (ko) |
EP (1) | EP1277798B1 (ko) |
JP (1) | JP3911690B2 (ko) |
KR (1) | KR100584435B1 (ko) |
CN (1) | CN1170885C (ko) |
AT (1) | ATE373047T1 (ko) |
DE (1) | DE60222340T2 (ko) |
TW (1) | TW593530B (ko) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3911690B2 (ja) * | 2001-07-19 | 2007-05-09 | 山栄化学株式会社 | 熱硬化性樹脂組成物、並びに平滑板の製造方法及びその平滑板 |
JP2003105061A (ja) * | 2001-09-27 | 2003-04-09 | Sanei Kagaku Kk | 光・熱硬化性樹脂組成物、並びに穴詰プリント配線(基)板の製造方法及び穴詰プリント配線(基)板 |
JP2004066017A (ja) * | 2002-08-01 | 2004-03-04 | Nippon Paint Co Ltd | ソルダーレジスト膜の形成方法 |
JP2005209861A (ja) * | 2004-01-22 | 2005-08-04 | Nippon Steel Corp | ウェハレベルパッケージ及びその製造方法 |
JP4683182B2 (ja) * | 2004-09-28 | 2011-05-11 | 山栄化学株式会社 | 感光性熱硬化性樹脂組成物、並びにレジスト被覆プリント配線板及びその製造法 |
JP4735815B2 (ja) * | 2005-04-18 | 2011-07-27 | 山栄化学株式会社 | 穴埋め多層プリント配線板及びその製造方法 |
JP2007257818A (ja) * | 2006-02-27 | 2007-10-04 | Tdk Corp | 情報記録媒体製造方法 |
JP4351239B2 (ja) * | 2006-09-13 | 2009-10-28 | タツタ システム・エレクトロニクス株式会社 | 熱伝導性ペースト |
JP5360359B2 (ja) * | 2008-07-01 | 2013-12-04 | 株式会社スリーボンド | エポキシ樹脂組成物 |
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EP1277798A2 (en) | 2003-01-22 |
DE60222340D1 (de) | 2007-10-25 |
JP3911690B2 (ja) | 2007-05-09 |
US20050019582A1 (en) | 2005-01-27 |
KR20030009192A (ko) | 2003-01-29 |
US7410673B2 (en) | 2008-08-12 |
ATE373047T1 (de) | 2007-09-15 |
CN1398918A (zh) | 2003-02-26 |
DE60222340T2 (de) | 2008-06-19 |
TW593530B (en) | 2004-06-21 |
EP1277798A3 (en) | 2003-06-11 |
CN1170885C (zh) | 2004-10-13 |
EP1277798B1 (en) | 2007-09-12 |
JP2003026765A (ja) | 2003-01-29 |
US6812299B2 (en) | 2004-11-02 |
US20030162898A1 (en) | 2003-08-28 |
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